Patents by Inventor Wencong SHEN

Wencong SHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11953125
    Abstract: The embodiments of the present disclosure provide a detachable anti-vibration sealing protection device for a pipe flange. The protection device includes a casing, wherein left and right end surfaces of the casing have through holes for the pipeline to pass through, and the casing has an accommodation cavity for placing the flange; a first shock absorption assembly for radial shock absorption of the flange; and a second shock absorption assembly which is installed in a one-to-one correspondence with the flange and is configured for axial shock absorption of the corresponding flange. The first shock absorption assembly and the second shock absorption assembly are installed in the accommodation cavity.
    Type: Grant
    Filed: May 22, 2023
    Date of Patent: April 9, 2024
    Assignee: CHANGZHOU UNIVERSITY
    Inventors: Hong Ji, Yuchen Liu, Ke Yang, Zhixiang Xing, Juncheng Jiang, Yinhan Zhao, Jie Guo, Ting Wang, Wencong Shen
  • Publication number: 20230323987
    Abstract: The embodiments of the present disclosure provide a detachable anti-vibration sealing protection device for a pipe flange. The protection device includes a casing, wherein left and right end surfaces of the casing have through holes for the pipeline to pass through, and the casing has an accommodation cavity for placing the flange; a first shock absorption assembly for radial shock absorption of the flange; and a second shock absorption assembly which is installed in a one-to-one correspondence with the flange and is configured for axial shock absorption of the corresponding flange. The first shock absorption assembly and the second shock absorption assembly are installed in the accommodation cavity.
    Type: Application
    Filed: May 22, 2023
    Publication date: October 12, 2023
    Applicant: CHANGZHOU UNIVERSITY
    Inventors: Hong JI, Yuchen LIU, Ke YANG, Zhixiang XING, Juncheng JIANG, Yinhan ZHAO, Jie GUO, Ting WANG, Wencong SHEN