Abstract: A dangler cable for use in both horizontal and oblique electroplating processes is disclosed. The dangler cable includes an electrical cable having an insulating sheath surrounding a plurality of groups of wire strands. One end of the electrical cable is stripped of the insulating sheath, whereby a portion of the wire strands extend from the insulating sheath. A cathode member having a metal sleeve is secured to the stripped end of the electrical cable by crimping one end of the sleeve coaxially of the electrical cable and flattening the other end of the sleeve. In addition, the other end of the electrical cable is provided with a connector member to secure the dangler cable to a bus bar of an electroplating apparatus. There is also disclosed the method of using the novel dangler cable in an electroplating process and the method of securing a cathode member to an electrical cable.