Patents by Inventor Wendell Glen BOYD, JR.

Wendell Glen BOYD, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10879046
    Abstract: Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support has a puck. The puck has a workpiece support surface and a gas hole exiting the workpiece support surface. A sensor assembly is disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to allow gas to flow past the sensor assembly when positioned in the gas hole.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: December 29, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Wendell Glen Boyd, Jr., Govinda Raj, Matthew James Busche
  • Patent number: 10557202
    Abstract: Embodiments of the invention may generally provide a method and apparatus that is used to prepare new and used substrate support assemblies for use in typical semiconductor processing environments. Embodiments of the present invention generally relate to a method of coating a new substrate support assembly or a used substrate support assembly that is being refurbished. The deposited coating may include a surface enhancement and/or protective material that is configured to protect one or more of the components exposed to the processing environment during a semiconductor process. The substrate support assembly may be coated with a protective material and during the coating process, the substrate support assembly is maintained at a temperature that is less than or equal to 150° C. by flowing a coolant through channels formed in a base of the substrate support assembly.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: February 11, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Wendell Glen Boyd, Jr., Vijay D. Parkhe, Senh Thach
  • Patent number: 10347522
    Abstract: A method and apparatus for discharging a residual charge from a substrate support. In one example, a substrate support is provided that includes a body, an electrode disposed in the body, a radiation emitter and a diffuser. The body has one or more holes formed in a workpiece support surface, the workpiece support surface configured to accept a substrate thereon. The electrode is configured to electrostatically hold a substrate to the workpiece support surface. The radiation emitter is disposed in a first hole of the one or more holes formed in the workpiece support surface. The radiation emitter is configured to emit electromagnetic energy out of the first hole. The diffuser is disposed in first hole over the radiation emitter.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: July 9, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Wendell Glen Boyd, Jr., Tom K. Cho, Robert T. Hirahara
  • Publication number: 20180166311
    Abstract: Implementations of the present disclosure relate to a method of refurbishing a sinter or plasma sprayed electrostatic chuck. Initially, a portion of a used electrostatic chuck body is removed to expose a base surface. Then, a layer of new dielectric material is deposited onto the base surface using a suspension slurry plasma spray process. The suspension slurry plasma spray process atomizes a suspension slurry of a nano-sized dielectric material into a stream of droplets, and then the stream of droplets is injected into a plasma discharge to form partially melted drops. The partially melted drops is projected onto the base surface to form a layer of dielectric material thereon. Thereafter, material of the layer of the new dielectric material is selectively removed to form mesas. The refurbished electrostatic chuck is ready to return to service after cleaning.
    Type: Application
    Filed: December 12, 2016
    Publication date: June 14, 2018
    Inventor: Wendell Glen BOYD, JR.
  • Patent number: 9805965
    Abstract: Implementations described herein provide a chucking circuit for a pixilated electrostatic chuck which enables both lateral and azimuthal tuning of the RF coupling between an electrostatic chuck and a substrate placed thereon. In one embodiment, a chucking circuit for an electrostatic chuck (ESC) has one or more chucking electrodes disposed in a dielectric body of the ESC, a plurality of pixel electrodes disposed in the dielectric body, and a chucking circuit having the one or more chucking electrodes and the plurality of pixel electrodes, the chucking circuit operable to electrostatically chuck a substrate to a workpiece support surface of the ESC, the chucking circuit having a plurality of secondary circuits, wherein each secondary circuit includes at least one capacitor of a plurality of capacitors, each secondary circuit is configured to independently control an impedance between one of the pixel electrodes and a ground.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: October 31, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Reza Sadjadi, Wendell Glen Boyd, Jr., Vijay D. Parkhe, Maxim Mikhailovich Noginov
  • Publication number: 20170263487
    Abstract: A method and apparatus for discharging a residual charge from a substrate support. In one example, a substrate support is provided that includes a body, an electrode disposed in the body, a radiation emitter and a diffuser. The body has one or more holes formed in a workpiece support surface, the workpiece support surface configured to accept a substrate thereon. The electrode is configured to electrostatically hold a substrate to the workpiece support surface. The radiation emitter is disposed in a first hole of the one or more holes formed in the workpiece support surface. The radiation emitter is configured to emit electromagnetic energy out of the first hole. The diffuser is disposed in first hole over the radiation emitter.
    Type: Application
    Filed: March 14, 2017
    Publication date: September 14, 2017
    Inventors: Wendell Glen BOYD, JR., Tom K. CHO, Robert T. HIRAHARA
  • Publication number: 20170167018
    Abstract: Embodiments of the invention may generally provide a method and apparatus that is used to prepare new and used substrate support assemblies for use in typical semiconductor processing environments. Embodiments of the present invention generally relate to a method of coating a new substrate support assembly or a used substrate support assembly that is being refurbished. The deposited coating may include a surface enhancement and/or protective material that is configured to protect one or more of the components exposed to the processing environment during a semiconductor process. The substrate support assembly may be coated with a protective material and during the coating process, the substrate support assembly is maintained at a temperature that is less than or equal to 150° C. by flowing a coolant through channels formed in a base of the substrate support assembly.
    Type: Application
    Filed: February 21, 2017
    Publication date: June 15, 2017
    Inventors: Wendell Glen BOYD, JR., Vijay D. PARKHE, Senh THACH
  • Publication number: 20170110358
    Abstract: Implementations described herein provide a chucking circuit for a pixilated electrostatic chuck which enables both lateral and azimuthal tuning of the RF coupling between an electrostatic chuck and a substrate placed thereon. In one embodiment, a chucking circuit for an electrostatic chuck (ESC) has one or more chucking electrodes disposed in a dielectric body of the ESC, a plurality of pixel electrodes disposed in the dielectric body, and a chucking circuit having the one or more chucking electrodes and the plurality of pixel electrodes, the chucking circuit operable to electrostatically chuck a substrate to a workpiece support surface of the ESC, the chucking circuit having a plurality of secondary circuits, wherein each secondary circuit includes at least one capacitor of a plurality of capacitors, each secondary circuit is configured to independently control an impedance between one of the pixel electrodes and a ground.
    Type: Application
    Filed: December 30, 2016
    Publication date: April 20, 2017
    Inventors: S. M. Reza SADJADI, Wendell Glen BOYD, JR., Vijay D. PARKHE, Maxim Mikhailovich NOGINOV
  • Publication number: 20170076915
    Abstract: Embodiments disclosed herein include a substrate support having a sensor assembly, and processing chamber having the same. In one embodiment, a substrate support has a puck. The puck has a workpiece support surface and a gas hole exiting the workpiece support surface. A sensor assembly is disposed in the gas hole and configured to detect a metric indicative of a deflection of a workpiece disposed on the workpiece support surface, wherein the sensor assembly is configured to allow gas to flow past the sensor assembly when positioned in the gas hole.
    Type: Application
    Filed: September 11, 2015
    Publication date: March 16, 2017
    Inventors: Wendell Glen BOYD, Jr., Govinda RAJ, Matthew James BUSCHE
  • Patent number: 9580806
    Abstract: Embodiments of the invention may generally provide a method and apparatus that is used to prepare new and used substrate support assemblies for use in typical semiconductor processing environments. Embodiments of the present invention generally relate to a method of coating a new substrate support assembly or a used substrate support assembly that is being refurbished. The deposited coating may include a surface enhancement and/or protective material that is configured to protect one or more of the components exposed to the processing environment during a semiconductor process. The substrate support assembly may be coated with a protective material and during the coating process, the substrate support assembly is maintained at a temperature that is less than or equal to 150° C. by flowing a coolant through channels formed in a base of the substrate support assembly.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: February 28, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Wendell Glen Boyd, Jr., Vijay D. Parkhe, Sehn Thach
  • Publication number: 20170004988
    Abstract: Implementations described herein provide a chucking circuit for a pixilated electrostatic chuck which enables both lateral and azimuthal tuning of the RF coupling between an electrostatic chuck and a substrate placed thereon. In one embodiment, a chucking circuit for an electrostatic chuck (ESC) has one or more chucking electrodes disposed in a dielectric body of the ESC, a plurality of pixel electrodes disposed in the dielectric body, and a chucking circuit having the one or more chucking electrodes and the plurality of pixel electrodes, the chucking circuit operable to electrostatically chuck a substrate to a workpiece support surface of the ESC, the chucking circuit having a plurality of secondary circuits, wherein each secondary circuit includes at least one capacitor of a plurality of capacitors, each secondary circuit is configured to independently control an impedance between one of the pixel electrodes and a ground.
    Type: Application
    Filed: September 16, 2016
    Publication date: January 5, 2017
    Inventors: Reza SADJADI, Wendell Glen BOYD, JR., Vijay D. PARKHE, Maxim Mikhailovich NOGINOV
  • Patent number: 9536769
    Abstract: Implementations described herein provide a chucking circuit for a pixilated electrostatic chuck which enables both lateral and azimuthal tuning of the RF coupling between an electrostatic chuck and a substrate placed thereon. In one embodiment, a chucking circuit for an electrostatic chuck (ESC) has one or more chucking electrodes disposed in a dielectric body of the ESC, a plurality of pixel electrodes disposed in the dielectric body, and a chucking circuit having the one or more chucking electrodes and the plurality of pixel electrodes, the chucking circuit operable to electrostatically chuck a substrate to a workpiece support surface of the ESC, the chucking circuit having a plurality of secondary circuits, wherein each secondary circuit includes at least one capacitor of a plurality of capacitors, each secondary circuit is configured to independently control an impedance between one of the pixel electrodes and a ground.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: January 3, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Reza Sadjadi, Wendell Glen Boyd, Jr., Vijay D. Parkhe, Maxim Mikhailovich Noginov
  • Patent number: 9472410
    Abstract: Implementations described herein provide a pixilated electrostatic chuck which enables both lateral and azimuthal tuning of the RF coupling between an electrostatic chuck and a substrate placed thereon. In one embodiment, the pixilated electrostatic chuck (ESC) may include a dielectric body having a workpiece support surface configured to accept a substrate thereon, one or more chucking electrodes disposed in the pixilated ESC, and a plurality of pixel electrodes. The plurality of pixel electrodes are switchable between a floating state and a grounded state, having variable capacitance to ground, or both. The pixel electrodes and the chucking electrodes form a circuit operable to electrostatically chuck the substrate to the workpiece support surface.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: October 18, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Reza Sadjadi, Wendell Glen Boyd, Jr., Vijay D. Parkhe, Maxim Mikhailovich Noginov
  • Publication number: 20150311105
    Abstract: Implementations described herein provide a pixilated electrostatic chuck which enables both lateral and azimuthal tuning of the RF coupling between an electrostatic chuck and a substrate placed thereon. In one embodiment, the pixilated electrostatic chuck (ESC) may include a dielectric body having a workpiece support surface configured to accept a substrate thereon, one or more chucking electrodes disposed in the pixilated ESC, and a plurality of pixel electrodes. The plurality of pixel electrodes are switchable between a floating state and a grounded state, having variable capacitance to ground, or both. The pixel electrodes and the chucking electrodes form a circuit operable to electrostatically chuck the substrate to the workpiece support surface.
    Type: Application
    Filed: May 13, 2014
    Publication date: October 29, 2015
    Inventors: Reza SADJADI, Wendell Glen BOYD, JR., Vijay D. PARKHE, Maxim Mikhailovich NOGINOV
  • Publication number: 20150059974
    Abstract: Embodiments of the invention may generally provide a method and apparatus that is used to prepare new and used substrate support assemblies for use in typical semiconductor processing environments. Embodiments of the present invention generally relate to a method of coating a new substrate support assembly or a used substrate support assembly that is being refurbished. The deposited coating may include a surface enhancement and/or protective material that is configured to protect one or more of the components exposed to the processing environment during a semiconductor process. The substrate support assembly may be coated with a protective material and during the coating process, the substrate support assembly is maintained at a temperature that is less than or equal to 150° C. by flowing a coolant through channels formed in a base of the substrate support assembly.
    Type: Application
    Filed: October 21, 2013
    Publication date: March 5, 2015
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Wendell Glen BOYD, JR., Vijay D. PARKHE, Sehn THACH
  • Publication number: 20150044947
    Abstract: Embodiments of the present invention provide a polishing ring assembly suitable for polishing an electrostatic chuck and method of using the same. In one embodiment, the polishing ring assembly has a retaining ring assembly and an electrostatic chuck fixture. The retaining ring assembly includes an inner diameter and a top surface, a plurality of outer drive rings wherein the plurality of outer drive rings are placed on the top surface of the ceramic retaining ring. The electrostatic chuck fixture includes an electrostatic chuck drive plate adjacent to the inner diameter of in the ceramic retaining ring. The electrostatic chuck drive plate has a lock to secure retaining ring assembly with the electrostatic chuck fixture without transferring the weight from one assembly over to the other through the locking mechanism.
    Type: Application
    Filed: July 25, 2014
    Publication date: February 12, 2015
    Inventors: William Ming-Ye LU, Wendell Glen BOYD, JR., Stacy MEYER