Patents by Inventor Wendell T. Blonigan
Wendell T. Blonigan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8616820Abstract: Provided herein is a double dual slot load lock chamber. The double dual slot load lock chamber includes two isolated load lock regions that are vertically stacked and share a common wall, wherein each isolated load lock region comprises two substrate slots.Type: GrantFiled: October 29, 2007Date of Patent: December 31, 2013Assignee: Applied Materials, Inc.Inventors: Shinichi Kurita, Wendell T. Blonigan
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Patent number: 8365682Abstract: Substrate support methods and apparatus include vertically aligned lift pins that have bearing surfaces that engage friction plates and/or magnetic fields to maintain the vertical orientation of the lift pins during substrate lifting. In some embodiments, a magnetic field and/or weighting may alternatively or additionally be used to control the vertical orientation of the lift pins, limit the angle of the lift pins, and/or prevent the lift pins from unintentionally binding in a susceptor as the susceptor is raised and prevent the resulting uneven support of the substrate.Type: GrantFiled: May 31, 2005Date of Patent: February 5, 2013Assignee: Applied Materials, Inc.Inventors: Wendell T. Blonigan, Carl Sorensen, John M. White, Robin L. Tiner
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Patent number: 8033772Abstract: A transfer chamber for a substrate processing tool includes a main body having side walls adapted to couple to at least one processing chamber and at least one load lock chamber. The main body houses at least a portion of a robot adapted to transport a substrate between the processing chamber and the load lock chamber. A lid couples to and seals a top of the main body of the transfer chamber. The transfer chamber also has a domed bottom adapted to couple to and to seal a bottom portion of the main body of the transfer chamber.Type: GrantFiled: March 21, 2006Date of Patent: October 11, 2011Assignee: Applied Materials, Inc.Inventors: Shinichi Kurita, Emanuel Beer, Hung T. Nguyen, Wendell T. Blonigan
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Patent number: 7976635Abstract: One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.Type: GrantFiled: January 21, 2010Date of Patent: July 12, 2011Assignee: Applied Materials, Inc.Inventors: Shinichi Kurita, Wendell T. Blonigan, Akihiro Hosokawa
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Patent number: 7959987Abstract: A method and apparatus for depositing a material layer to treat and condition a substrate, such as a fuel cell part, is described. The method includes depositing a hydrophilic material layer on a portion of the surface of the substrate in a process chamber from a mixture of precursors of the hydrophilic material layer. In addition, the method includes reducing a fluid contact angle of the substrate surface. The hydrophilic material layer comprises a wet etch rate of less than about 0.03 ?/min in the presence of about 10 ppm of hydrofluoric acid in water. The material layer can be used to condition various parts of a fuel cell useful in applications to generate electricity.Type: GrantFiled: November 30, 2005Date of Patent: June 14, 2011Assignee: Applied Materials, Inc.Inventors: Tae Kyung Won, Robert Bachrach, John M. White, Wendell T. Blonigan
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Patent number: 7759158Abstract: A method and apparatus for fabricating large scale PV cell and solar module/panel is disclosed. The method includes designing a PV cell wiring scheme for a number of PV cells and patterning a plurality of features on a large size silicon sheet. A number of large scale silicon sheets, having a number of PV cells on each silicon sheet, can be bonded to a wiring plane to directly manufacture into a solar module/panel. Each PV cell on the solar module is then isolated. Methods of the invention greatly cut down the cost of solar module/panel manufacturing and PV cell assembly.Type: GrantFiled: March 3, 2006Date of Patent: July 20, 2010Assignee: Applied Materials, Inc.Inventors: Robert Bachrach, Wendell T. Blonigan
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Patent number: 7735710Abstract: A method and apparatus for supporting a substrate is generally provided. In one aspect, an apparatus for supporting a substrate includes a support plate having a first body disposed proximate thereto. A first pushing member is radially coupled to the first body and adapted to urge the substrate in a first direction parallel to the support plate when the first body rotates. In another aspect, a load lock chamber having a substrate support that supports a substrate placed thereon includes a cooling plate that is moved to actuate at least one alignment mechanism. The alignment mechanism includes a pushing member that urges the substrate in a first direction towards a center of the support. The pushing member may additionally rotate about an axis perpendicular to the first direction.Type: GrantFiled: November 16, 2004Date of Patent: June 15, 2010Assignee: Applied Materials, Inc.Inventors: Shinichi Kurita, Wendell T. Blonigan, Suhail Anwar, Toshio Kiyotake, Hung T. Nguyen
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Publication number: 20100107672Abstract: One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.Type: ApplicationFiled: January 21, 2010Publication date: May 6, 2010Inventors: Shinichi Kurita, Wendell T. Blonigan, Akihiro Hosokawa
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Patent number: 7651315Abstract: A load lock chamber and method for transferring large area substrates is provided. In one embodiment, a load lock chamber suitable for transferring large area substrates includes a plurality of vertically stacked single substrate transfer chambers. The configuration of vertically stacked single substrate transfer chambers contributes to reduced size and greater throughput as compared to conventional state of the art, dual slot dual substrate designs. Moreover, the increased throughput has been realized at reduced pumping and venting rates, which corresponds to reduced probability of substrate contamination due to particulates and condensation.Type: GrantFiled: January 8, 2007Date of Patent: January 26, 2010Assignee: Applied Materials, Inc.Inventors: Shinichi Kurita, Wendell T. Blonigan, Yoshiaki Tanase
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Patent number: 7641247Abstract: Generally, an end effector assembly for a substrate transfer robot is provided. In one embodiment, an end effector assembly for supporting a quadrilateral substrate during substrate transfer includes an end effector having an inner edge support disposed on a first end and a first outer edge support disposed on a distal end. The first end of the end effector is adapted for coupling to a robot linkage. The first inner edge support has a face that is oriented parallel to and facing the face of the first outer edge support. This configuration of edge supports captures the substrate to the end effector thereby minimizing substrate slippage during transfer. In another embodiment, lateral guides may be utilized to further enhance capturing the substrate along the edges of the substrate open between the inner and outer edge supports.Type: GrantFiled: December 17, 2002Date of Patent: January 5, 2010Assignee: Applied Materials, Inc.Inventors: Wendell T. Blonigan, Takayuki Matsumoto, William N. Sterling, Billy C. Leung
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Patent number: 7641434Abstract: One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.Type: GrantFiled: May 10, 2004Date of Patent: January 5, 2010Assignee: Applied Materials, Inc.Inventors: Shinichi Kurita, Wendell T. Blonigan, Akihiro Hosokawa
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Publication number: 20090178617Abstract: An apparatus for providing a short return current path for RF current between a process chamber wall and a substrate support is provided. The RF grounding apparatus, which is RF grounded and is place above the substrate transfer port, establishes electrical contact with the substrate support only during substrate processing, such as deposition, to provide return current path for the RF current. One embodiment of the RF grounding apparatus comprises one or more low impedance flexible curtains, which are electrically connected to the grounded chamber wall, and to one or more low impedance blocks, which make contacts with the substrate support during substrate processing. Another embodiment of the RF grounding apparatus comprises a plurality of low impedance flexible straps, which are electrically connected to the grounded chamber wall, and to one or more low impedance blocks, which make contacts with the substrate support during substrate processing.Type: ApplicationFiled: March 18, 2009Publication date: July 16, 2009Inventors: John M. White, Robin L. Tiner, Beom Soo Park, Wendell T. Blonigan
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Patent number: 7534301Abstract: An apparatus for providing a short return current path for RF current between a process chamber wall and a substrate support is provided. The RF grounding apparatus, which is RF grounded and is place above the substrate transfer port, establishes electrical contact with the substrate support only during substrate processing, such as deposition, to provide return current path for the RF current. One embodiment of the RF grounding apparatus comprises one or more low impedance flexible curtains, which are electrically connected to the grounded chamber wall, and to one or more low impedance blocks, which make contacts with the substrate support during substrate processing. Another embodiment of the RF grounding apparatus comprises a plurality of low impedance flexible straps, which are electrically connected to the grounded chamber wall, and to one or more low impedance blocks, which make contacts with the substrate support during substrate processing.Type: GrantFiled: September 21, 2004Date of Patent: May 19, 2009Assignee: Applied Materials, Inc.Inventors: John M. White, Robin L. Tiner, Beom Soo Park, Wendell T Blonigan
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Patent number: 7438175Abstract: Embodiments of a vacuum conveyor system are provided herein. In one embodiment a vacuum conveyor system includes a first vacuum sleeve having a plurality of rollers that support and move substrates through the first vacuum sleeve. A port is provided for sealably coupling the first vacuum sleeve to a process chamber. A first substrate handler is disposed proximate the port. Multiple ports may be provided for sealably coupling the first vacuum sleeve to a plurality of process chambers. A dedicated substrate handler is provided for each process chamber. A second vacuum sleeve may be sealably coupled to an opposing side of the process chambers. The vacuum conveyor system may be modular with independent modules linked via load lock chambers. The plurality of rollers may compensate for any sag of the leading edge of a substrate being transported thereupon.Type: GrantFiled: July 7, 2005Date of Patent: October 21, 2008Assignee: Applied Materials, Inc.Inventors: John M. White, Wendell T. Blonigan
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Patent number: 7375946Abstract: A method and apparatus for dechucking a substrate is provided. In one embodiment, a processing chamber is provided that includes a grounded chamber body having a substrate support assembly disposed in an interior volume. A dechucking circuit selectively couples the substrate support assembly to ground or to a power source. In another embodiment of the invention, a method for dechucking a substrate includes the steps of completing a plasma process on a substrate disposed on a grounded substrate support assembly, disconnecting the substrate support assembly from ground, and applying a dechucking voltage to the substrate support assembly.Type: GrantFiled: August 16, 2004Date of Patent: May 20, 2008Assignee: Applied Materials, Inc.Inventors: John M. White, Wendell T. Blonigan
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Patent number: 7316966Abstract: Provided herein is a substrate processing system, which comprises a cassette load station; a load lock chamber; a centrally located transfer chamber; and one or more process chambers located about the periphery of the transfer chamber. The load lock chamber comprises double dual slot load locks constructed at same location. Such system may be used for processing substrates for semiconductor manufacturing.Type: GrantFiled: March 31, 2006Date of Patent: January 8, 2008Assignee: Applied Materials, Inc.Inventors: Shinichi Kurita, Wendell T. Blonigan
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Patent number: 7296673Abstract: Embodiments of a vacuum conveyor system are provided herein. In one embodiment, apparatus for conveying a substrate includes a vacuum sleeve and a plurality of rollers disposed within the vacuum sleeve for supporting and transporting the substrate thereupon. The plurality of rollers is adapted to simultaneously support the substrate thereupon at a plurality of elevations. A leading edge of the substrate is supported at an elevation above an adjacent one of the plurality of rollers in the direction of travel.Type: GrantFiled: July 7, 2005Date of Patent: November 20, 2007Assignee: Applied Materials, Inc.Inventors: Wendell T. Blonigan, John M. White
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Patent number: 7270713Abstract: A gas distribution plate assembly and a method for distributing gas in a processing chamber are provided. In one embodiment, a gas distribution plate assembly includes a tuning plate coupled to a diffuser plate. The tuning plate has a plurality of orifice holes formed therethrough that align with a plurality of apertures formed through the diffuser plate, where the apertures each have a greater sectional area than the holes in the tuning plate. Each aperture is aligned with a respective hole to define gas passages through the gas distribution plate assembly. The tuning plate may be interchanged with a replacement tuning plate to change the gas flow characteristics through the gas distribution plate assembly.Type: GrantFiled: January 7, 2003Date of Patent: September 18, 2007Assignee: Applied Materials, Inc.Inventors: Wendell T. Blonigan, John M. White, William A. Bagley
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Patent number: 7207766Abstract: A load lock chamber and method for transferring large area substrates is provided. In one embodiment, a load lock chamber suitable for transferring large area substrates includes a plurality of vertically stacked single substrate transfer chambers. The configuration of vertically stacked single substrate transfer chambers contributes to reduced size and greater throughput as compared to conventional state of the art, dual slot dual substrate designs. Moreover, the increased throughput has been realized at reduced pumping and venting rates, which corresponds to reduced probability of substrate contamination due to particulates and condensation.Type: GrantFiled: April 26, 2004Date of Patent: April 24, 2007Assignee: Applied Materials, Inc.Inventors: Shinichi Kurita, Wendell T. Blonigan, Yoshiaki Tanase
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Patent number: 7129694Abstract: A system and method for testing substrates is generally provided. In one embodiment, a test system for testing a substrate includes a load lock chamber, a transfer chamber and a test station. The load lock chamber and the test station are disposed on top of one another and coupled to the transfer chamber. The transfer chamber includes a robot adapted to transfer a substrate between the load lock chamber, which is at a first elevation, and the test station, which is at a second elevation. In another embodiment, a test station is provided having a turntable adapted to rotate the substrate. The turntable enables the range of motion required to test the substrate to be substantially reduced while facilitating full test and/or inspection of the substrate.Type: GrantFiled: May 23, 2002Date of Patent: October 31, 2006Assignee: Applied Materials, Inc.Inventors: Matthias Brunner, Shinichi Kurita, Wendell T. Blonigan, Edgar Kehrberg