Abstract: A processing system for forming an optical coating on a substrate is provided, wherein the optical coating including an anti-reflective coating and an oleophobic coating, the system comprising: a linear transport processing section configured for processing and transporting substrate carriers individually and one at a time in a linear direction; at least one evaporation processing system positioned in the linear transport processing system, the evaporation processing system configured to form the oleophobic coating; a batch processing section configured to transport substrate carriers in unison about an axis; at least one ion beam assisted deposition processing chamber positioned in the batch processing section, the ion beam assisted deposition processing chamber configured to deposit layer of the anti-reflective coating; a plurality of substrate carriers for mounting substrates; and, means for transferring the substrate carriers between the linear transport processing section and the batch processing section

Abstract: A processing system for forming an optical coating on a substrate is provided, wherein the optical coating including an anti-reflective coating and an oleophobic coating, the system comprising: a linear transport processing section configured for processing and transporting substrate carriers individually and one at a time in a linear direction; at least one evaporation processing system positioned in the linear transport processing system, the evaporation processing system configured to form the oleophobic coating; a batch processing section configured to transport substrate carriers in unison about an axis; at least one ion beam assisted deposition processing chamber positioned in the batch processing section, the ion beam assisted deposition processing chamber configured to deposit layer of the anti-reflective coating; a plurality of substrate carriers for mounting substrates; and, means for transferring the substrate carriers between the linear transport processing section and the batch processing section

Abstract: A processing system for forming an optical coating on a substrate is provided, wherein the optical coating including an anti-reflective coating and an oleophobic coating, the system comprising: a linear transport processing section configured for processing and transporting substrate carriers individually and one at a time in a linear direction; at least one evaporation processing system positioned in the linear transport processing system, the evaporation processing system configured to form the oleophobic coating; a batch processing section configured to transport substrate carriers in unison about an axis; at least one ion beam assisted deposition processing chamber positioned in the batch processing section, the ion beam assisted deposition processing chamber configured to deposit layer of the anti-reflective coating; a plurality of substrate carriers for mounting substrates; and, means for transferring the substrate carriers between the linear transport processing section and the batch processing section

Abstract: A processing system for forming an optical coating on a substrate is provided, wherein the optical coating including an anti-reflective coating and an oleophobic coating, the system comprising: a linear transport processing section configured for processing and transporting substrate carriers individually and one at a time in a linear direction; at least one evaporation processing system positioned in the linear transport processing system, the evaporation processing system configured to form the oleophobic coating; a batch processing section configured to transport substrate carriers in unison about an axis; at least one ion beam assisted deposition processing chamber positioned in the batch processing section, the ion beam assisted deposition processing chamber configured to deposit layer of the anti-reflective coating; a plurality of substrate carriers for mounting substrates; and, means for transferring the substrate carriers between the linear transport processing section and the batch processing section

Abstract: An apparatus and method for recovery and cleaning of broken substrates, especially beneficial for fabrication systems using silicon wafer carried on trays. Removal of broken wafers and particles from within the fabrication system is enabled without requiring disassembly of the system and without requiring manual labor. A placing mechanism moves a suction head to location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the wafer to smaller pieces for easy removal.

Abstract: A method for auto-sequencing of plasma processing system for concurrent processing of several substrates. The method autonomously sequence processing and move substrates in different directions as necessary. The method moves two substrate trays together into the processing chamber for substrate exchange, and remove the trays from the chamber one at a time. When needed, the method moves one tray into the processing chamber for removal of the susceptor without exposing the chamber to atmospheric environment.

Abstract: An apparatus and method for concurrent processing of several substrates. The system employs a novel architecture which, while being linear, may autonomously sequence processing and move substrates in different directions as necessary. The system moves several substrates concurrently; however, unlike the prior art it does not utilize trays.

Abstract: A showerhead for a plasma process apparatus for processing substrates, comprising a showerhead body comprising a top plate and a bottom plate defining a cavity in between; a gas inlet formed in the top plate; a perforated plate positioned between the top plate and the bottom plate and dissecting the cavity into an upper gas compartment and a lower gas compartment; and, wherein the bottom plate comprises a plurality of elongated diffusion slots on its lower surface and a plurality of diffusion holes on its upper surface, each of the diffusion holes making fluid connection from the lower gas compartment to more than one of the diffusion slots.

Abstract: A method for auto-sequencing of plasma processing system for concurrent processing of several substrates. The method autonomously sequence processing and move substrates in different directions as necessary. The method moves two substrate trays together into the processing chamber for substrate exchange, and remove the trays from the chamber one at a time. When needed, the method moves one tray into the processing chamber for removal of the susceptor without exposing the chamber to atmospheric environment.

Abstract: An apparatus and method for recovery and cleaning of broken substrates, especially beneficial for fabrication systems using silicon wafer carried on trays. Removal of broken wafers and particles from within the fabrication system is enabled without requiring disassembly of the system and without requiring manual labor. A placing mechanism moves a suction head to location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the wafer to smaller pieces for easy removal.

Abstract: An apparatus and method for recovery and cleaning of broken substrates, for fabrication systems using silicon wafers. A placing mechanism moves a suction head to a location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the substrate to smaller pieces for removal.

Abstract: An apparatus and method for concurrent processing of several substrates. The system employs a novel architecture which, while being linear, may autonomously sequence processing and move substrates in different directions as necessary. The system moves several substrates concurrently; however, unlike the prior art it does not utilize trays.

Abstract: An apparatus and method for recovery and cleaning of broken substrates, especially beneficial for fabrication systems using silicon wafer carried on trays. Removal of broken wafers and particles from within the fabrication system is enabled without requiring disassembly of the system and without requiring manual labor.

Abstract: Vacuum processing chambers having provisions for improved electrical contact to substrate carrier. Specific embodiments provide a plasma processing chamber having a pedestal for supporting the carrier, and a plurality of fixed posts and resilient contacts are distributed over the area of the pedestal. The fixed posts provide physical support for the carrier, while the resilient contacts provide reliable and repeatable multi-point electrical contact to the carrier.

Abstract: An apparatus and method for concurrent processing of several substrates. The system employs a novel architecture which, while being linear, may autonomously sequence processing and move substrates in different directions as necessary. The system moves several substrates concurrently; however, unlike the prior art it does not utilize trays.

Abstract: An apparatus and method for concurrent processing of several substrates. The system employs a novel architecture which, while being linear, may autonomously sequence processing and move substrates in different directions as necessary. The system moves several substrates concurrently; however, unlike the prior art it does not utilize trays.

Abstract: Vacuum processing chambers having provisions for thermal expansion and contraction. Specific embodiments provide a plasma processing chamber having a showerhead that enables thermal expansion and contraction without imparting structural stress on the chamber body and without breaking any vacuum seal.

Abstract: A showerhead for a plasma process apparatus for processing substrates, comprising a showerhead body comprising a top plate and a bottom plate defining a cavity in between; a gas inlet formed in the top plate; a perforated plate positioned between the top plate and the bottom plate and dissecting the cavity into an upper gas compartment and a lower gas compartment; and, wherein the bottom plate comprises a plurality of elongated diffusion slots on its lower surface and a plurality of diffusion holes on its upper surface, each of the diffusion holes making fluid connection from the lower gas compartment to more than one of the diffusion slots.