Patents by Inventor Wendy B. Goldberg

Wendy B. Goldberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical planarization of metal substrates
    Patent number: 6602436
    Abstract: A method of polishing a wafer in a carrier by a polishing pad, controlling a ratio of platen speed to carrier speed (PS to CS) within a specific range, or controlling a first polishing step with a PS to CS ratio in the range of about 150:1 to about 1:150 followed by a second polishing step with a platen speed of about 0 to 20 rpm while maintaining the carrier speed used in the first polishing step, which maximizes clearing of residual material removed from a patterned wafer surface by polishing.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: August 5, 2003
    Assignee: Rodel Holdings, Inc
    Inventors: Glenn C. Mandigo, Ross E. Barker, II, Craig D. Lack, Ian G. Sullivan, Wendy B. Goldberg
  • Method and composition for polishing by CMP
    Patent number: 6530824
    Abstract: A polishing composition for polishing a semiconductor wafer includes a source of chloride ions in solution, which reduces surface roughness of copper interconnects that are recessed in the wafer. High points on the copper interconnects are polished during a polishing operation, while the chloride ions migrate to electric fields concentrated at the high points. The chloride ions at the high points deter replating of copper ions from solution onto the high points. Instead the copper ions replate elsewhere on the interconnects, which reduces the surface roughness of the interconnects.
    Type: Grant
    Filed: March 9, 2001
    Date of Patent: March 11, 2003
    Assignee: Rodel Holdings, Inc.
    Inventors: Terence M. Thomas, Qianqiu Christine Ye, Joseph K. So, Wendy B. Goldberg, Wade Godfrey
  • Method and composition for polishing by CMP
    Publication number: 20020146965
    Abstract: A polishing composition for polishing a semiconductor wafer includes a source of chloride ions in solution, which reduces surface roughness of copper interconnects that are recessed in the wafer. High points on the copper interconnects are polished during a polishing operation, while the chloride ions migrate to electric fields concentrated at the high points. The chloride ions at the high points deter replating of copper ions from solution onto the high points. Instead the copper ions replate elsewhere on the interconnects, which reduces the surface roughness of the interconnects.
    Type: Application
    Filed: March 9, 2001
    Publication date: October 10, 2002
    Inventors: Terence M. Thomas, Qianqiu Ye, Joseph K. So, Wendy B. Goldberg, Wade Godfrey
  • Chemical mechanical planarization of metal substrates
    Publication number: 20020058426
    Abstract: A method of polishing a wafer in a carrier by a polishing pad, controlling a ratio of platen speed to carrier speed (PS to CS) within a specific range, or controlling a first polishing step with a PS to CS ratio in the range of about 150:1 to about 1:150 followed by a second polishing step with a platen speed of about 0 to 20 rpm while maintaining the carrier speed used in the first polishing step, which maximizes clearing of residual material removed from a patterned wafer surface by polishing.
    Type: Application
    Filed: August 9, 2001
    Publication date: May 16, 2002
    Inventors: Glenn C. Mandigo, Ross E. Barker, Craig D. Lack, Ian G. Sullivan, Wendy B. Goldberg
  • Biocides for polishing slurries
    Publication number: 20020025762
    Abstract: Compounds containing both a sulfur and a nitrogen in a five-membered ring structure are used as biocides in polishing solutions and slurries.
    Type: Application
    Filed: February 2, 2001
    Publication date: February 28, 2002
    Inventors: Qiuliang Luo, Wendy B. Goldberg, Qianqiu (Christine) Ye