Patents by Inventor Wendy Fransisca Johanna Gehoel Van Ansem

Wendy Fransisca Johanna Gehoel Van Ansem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8416385
    Abstract: A lithographic apparatus and device manufacturing method is provided in which exposure is carried out by projecting through a liquid having a pH of less than 7, the liquid being in contact with a substrate to be exposed. The liquid advantageously comprises an anti-reflective topcoat.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: April 9, 2013
    Assignee: ASML Netherlands B.V.
    Inventors: Bob Streefkerk, Marcel Mathijs Theodore Marie Dierichs, Wendy Fransisca Johanna Gehoel-Van Ansem
  • Patent number: 7808611
    Abstract: A lithographic apparatus and device manufacturing method is provided in which exposure is carried out by projecting through a liquid having a pH of less than 7, the liquid being in contact with a substrate to be exposed. The liquid advantageously comprises an anti-reflective topcoat.
    Type: Grant
    Filed: February 16, 2006
    Date of Patent: October 5, 2010
    Assignee: ASML Netherlands B.V.
    Inventors: Bob Streefkerk, Marcel Mathijs Theodore Marie Dierichs, Wendy Fransisca Johanna Gehoel-Van Ansem
  • Patent number: 7804574
    Abstract: A lithographic apparatus and device manufacturing method is provided in which exposure is carried out by projecting through a liquid having a pH of less than 7, the liquid being in contact with a substrate to be exposed. The liquid advantageously comprises an anti-reflective topcoat.
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: September 28, 2010
    Assignee: ASML Netherlands B.V.
    Inventors: Bob Streefkerk, Marcel Mathijs Theodore Marie Dierichs, Wendy Fransisca Johanna Gehoel-Van Ansem
  • Patent number: 7745095
    Abstract: A substrate processing method of a substrate provided with an anti-reflective coating which extends to or beyond a peripheral edge of the substrate is disclosed. The method includes removing a portion of the anti-reflective coating adjacent to and around a periphery of the substrate using a back-side removal process, depositing a layer of radiation sensitive material onto the anti-reflective coating, depositing a top-coat layer onto the layer of radiation sensitive material, and simultaneously removing a portion of the layer of radiation sensitive material and a portion of the top-coat layer from around an area adjacent to the periphery of the substrate using a top-side removal process.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: June 29, 2010
    Assignee: ASML Netherlands B.V.
    Inventors: Patrick Wong, Wendy Fransisca Johanna Gehoel Van Ansem, Rudolf Adrianus Joannes Maas, Suping Wang
  • Publication number: 20090011369
    Abstract: A substrate processing method of a substrate provided with an anti-reflective coating which extends to or beyond a peripheral edge of the substrate is disclosed. The method includes removing a portion of the anti-reflective coating adjacent to and around a periphery of the substrate using a back-side removal process, depositing a layer of radiation sensitive material onto the anti-reflective coating, depositing a top-coat layer onto the layer of radiation sensitive material, and simultaneously removing a portion of the layer of radiation sensitive material and a portion of the top-coat layer from around an area adjacent to the periphery of the substrate using a top-side removal process.
    Type: Application
    Filed: July 5, 2007
    Publication date: January 8, 2009
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Patrick Wong, Wendy Fransisca Johanna Gehoel Van Ansem, Rudolf Adrianus Joannes Maas, Suping Wang
  • Publication number: 20080160458
    Abstract: A double patterning process for printing dense lines is provided. In a first step, a first semi dense pattern of lines is printed in a first resist material layer overlaying a substrate provided with a bottom anti-reflection coating. In a second step, a second semi dense pattern of lines is printed in a second resist material layer provided over the cleared area. The first and second semi dense line patterns are positioned in interleaved position, to provide a desired dense pattern of lines and spaces. After development of the first resist material and before providing the second resist material to the substrate, a surface conditioning of the bottom anti-reflection coating is applied to the cleared area between lines of first resist material. The surface conditioning step is arranged to improve adhesion of a feature of second resist material to the surface of the cleared area.
    Type: Application
    Filed: December 10, 2007
    Publication date: July 3, 2008
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Koen Van Ingen Schenau, Wendy Fransisca Johanna Gehoel-Van Ansem, Johannes Anna Quaedackers, Patrick Wong