Abstract: A multi-photon reactive composition including: (a) at least one reactive species; and (b) multi-photon photoinitiator system; and (c) a plurality of substantially inorganic particles, wherein the particles have an average particle size of less than about 10 microns in diameter.

Abstract: A method for making an inorganic structure including: (a) applying a photoreactive composition to a substrate, wherein the composition includes: a reactive species, a photoinitiator system, and a plurality of substantially inorganic colloidal particles, wherein the particles have an average particle size of less than about 300 nm; (b) photopatterning the composition to define a structure; and (c) subjecting the structure to elevated temperature for a time sufficient to pyrolyze the reactive species and to at least partially fuse the particles.

Abstract: In one aspect, the invention provides a curable composition comprising a mixture of epoxy resin, catalyst and an epoxy reactive thioether-containing compound and the resulting adhesives. The resulting adhesives are water and/or solvent resistant and bond to plastics such as ABS, polycarbonate, and PMMA; polyimide; noble metals such as gold and palladium; and silicon-containing materials such as silicon wafer die and silicon dioxide.

Abstract: A multi-photon reactive composition including: (a) at least one reactive species; and (b) multi-photon photoinitiator system; and (c) a plurality of substantially inorganic particles, wherein the particles have an average particle size of less than about 10 microns in diameter.

Abstract: A method for making an inorganic structure including:

Abstract: A thermomechanical-shock-resistant cured composition for solventless, hydrophobic resin encapsulation of electronic components having a glass transition temperature below 0° C. and containing a non-silicone oligomer including a flexible hydrocarbon backbone with reactive functionality, up to about 40% by weight of an adhesion promoter, and a optional viscosity-modifying component.

Abstract: The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.

Abstract: The invention provides polyepoxide-based adhesives containing cycloaliphatic-containing polyepoxide resin, aromatic polyepoxide resin, and 9,9-bis(3-methyl-4-aminophenyl)fluorene. The adhesives provide improved peel and shear strength.

Abstract: The invention provides polyepoxide-based adhesives containing cycloaliphatic-containing polyepoxide resin, aromatic polyepoxide resin, and 9,9-bis(3-methyl-4-aminophenyl)fluorene. The adhesives provide improved peel and shear strength.

Abstract: The invention provides for a material comprising(a) a hardenable resin; and (b) a filler comprising (i) clusters of nano-sized particles, the clusters comprising non-beavy metal oxide particles and heavy metal oxides, and being not fully densified particles and (ii) non-agglomerated nano-sized particles selected from the group consisting of non-heavy metal oxide particles, heavy metal oxide particles, and combinations thereof. The material is suitable for use as dental materials.

Abstract: In one aspect, the invention provides a curable composition comprising a mixture of epoxy resin, catalyst and an epoxy reactive thioether-containing compound and the resulting adhesives. The resulting adhesives are water and/or solvent resistant and bond to plastics such as ABS, polycarbonate, and PMMA; polyimide; noble metals such as gold and palladium; and silicon-containing materials such as silicon wafer die and silicon dioxide.

Abstract: Compositions comprise (a) a curable resin sol comprising a colloidal dispersion of substantially spherical, substantially inorganic microparticles (e.g., surface-modified silica) in curable resin (e.g., epoxy resin); and (b) reinforcing fibers (e.g., carbon fibers). The compositions can be cured to provide fiber-reinforced composites which exhibit improved resin-dominated mechanical properties.

Abstract: A thermally-curable aromatic amine-epoxy composition comprises(a) at least one polyepoxy compound;(b) a curing amount of at least one aromatic polyamine compound; and(c) a catalytically effective amount of at least one cure accelerator compound which is a .pi.-electron acceptor, and which lowers the cure exotherm peak temperature (as measured by differential scanning calorimetry (DSC) at 10.degree. C. per minute) of the composition by at least about 8 percent relative to the corresponding composition without the cure accelerator. Such accelerator compounds moderate and/or accelerate the thermal curing of aromatic amine-epoxy resins, enabling cure to occur at lower temperatures and/or in shorter time periods than those required for the unaccelerated composition.