Abstract: A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a supercritical fluid that transports heat from the devices to a heat sink in thermal contact with the enclosure.

Abstract: Methods of making a multi component module (130) utilize a reusable carrier substrate (111) where the reusable carrier substrate (111) is light transmissive in a frequency range of an adhesive (112) that is ablated by light of a certain frequency such as light from an excimer laser (122). An electronic component (118), such as a chip, die, or passive or active component, is adhered to the reusable carrier substrate (111) with the adhesive (112). An interconnect structure (117) is fabricated on the electronic component (118) to form a multi component module (130). The excimer laser (122) illuminates the reusable carrier substrate (111) with light in the frequency range after fabricating the interconnect structure (117) to ablate the adhesive (112) to remove the multi component module (130) from the reusable carrier substrate (111).