Patents by Inventor Wen-Fang Tang

Wen-Fang Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AGAINST CORONAVIRUS INFECTION WITH QUINOLINE COMPOUND
    Publication number: 20220088002
    Abstract: Disclosed herein is a method against coronavirus infection, which includes administering to a subject in need thereof an effective amount of 6-bromo-2-[1-(2,5-dimethylphenyl)-5-methyl-1H-pyrazol-4-yl]-quinoline-4-carboxylic acid or a pharmaceutically acceptable salt thereof.
    Type: Application
    Filed: May 28, 2021
    Publication date: March 24, 2022
    Inventors: Jim-Tong HORNG, Wen-Fang TANG, Hui-Ping TSAI, Chung-Fan HSIEH, Chia-Yi LIN, Guan-Hua LIN, Yu-Li CHEN, Po-Shiuan HSIEH, Tien-Yao CHANG, Yu-Hsiu CHANG
  • METHOD AGAINST CORONAVIRUS INFECTION WITH COUMARIN-DERIVED COMPOUND
    Publication number: 20220087974
    Abstract: Disclosed herein is a method against coronavirus infection, which includes administering to a subject in need thereof an effective amount of 8-benzoyl-4-methyl-9-phenyl-furo[2,3-h]chromen-2-one or a pharmaceutically acceptable salt thereof.
    Type: Application
    Filed: May 28, 2021
    Publication date: March 24, 2022
    Inventors: Jim-Tong HORNG, Wen-Fang TANG, Hui-Ping TSAI, Chung-Fan HSIEH, Chia-Yi LIN, Guan-Hua LIN, Yu-Li CHEN, Po-Shiuan HSIEH, Tien-Yao CHANG, Yu-Hsiu CHANG
  • METHOD AGAINST CORONAVIRUS INFECTION WITH WATER-EXTRACTED PRODUCT OF PERILLA FRUTESCENS
    Publication number: 20220088105
    Abstract: Disclosed herein is a method against coronavirus infection, which includes administering to a subject in need thereof a composition containing a water-extracted product of Perilla frutescens.
    Type: Application
    Filed: March 30, 2021
    Publication date: March 24, 2022
    Inventors: Jim-Tong Horng, Wen-Fang Tang, Hui-Ping Tsai, Tien-Yao Chang, Po-Shiuan Hsieh, Yu-Hsiu Chang, Chung-Fan Hsieh, Chia-Yi Lin, Guan-Hua Lin, Yu-Li Chen
  • Method and apparatus for eliminating wafer breakage during wafer transfer by a vacuum pad
    Patent number: 6530103
    Abstract: A method for eliminating wafer breakage during a wafer transfer process in a grinding apparatus by a wafer transfer pad and an apparatus for conducting such method are disclosed. In the method, a surface of the vacuum pad, or the wafer transfer pad, that is formed of sintered ceramic is first cleaned by contacting a rotating brush and a spray of cleaning solvent. The invention further discloses an apparatus for eliminating wafer breakage during the wafer transfer process by a vacuum pad by incorporating a pressure regulating valve situated in the vacuum conduit such that a vacuum pressure applied can be regulated at a rate not higher than 30 psi/sec. to the surface of the wafer transfer pad.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: March 11, 2003
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jeng-Yang Pan, Chia-Chun Wu, Wen-Fang Tang, Su-Yu Yeh, Huai-Tei Yang
  • METHOD AND APPARATUS FOR ELIMINATING WAFER BREAKAGE DURING WAFER TRANSFER BY A VACUUM PAD
    Publication number: 20020194689
    Abstract: A method for eliminating wafer breakage during a wafer transfer process in a grinding apparatus by a wafer transfer pad and an apparatus for conducting such method are disclosed. In the method, a surface of the vacuum pad, or the wafer transfer pad, that is formed of sintered ceramic is first cleaned by contacting a rotating brush and a spray of cleaning solvent. The invention further discloses an apparatus for eliminating wafer breakage during the wafer transfer process by a vacuum pad by incorporating a pressure regulating valve situated in the vacuum conduit such that a vacuum pressure applied can be regulated at a rate not higher than 30 psi/sec. to the surface of the wafer transfer pad.
    Type: Application
    Filed: June 21, 2001
    Publication date: December 26, 2002
    Applicant: Taiwan Semiconductor Manufacturing Co.,Ltd.
    Inventors: Jeng-Yang Pan, Chia-Chun WU, Wen-Fang Tang, Su-Yu Yeh, Huai-Tei Yang