Abstract: A system-in-package module with memory includes a non-memory chip, a substrate, and a memory chip. The non-memory chip has a first portion and a second portion. The substrate has a window and the substrate is electrically connected to the second portion of the non-memory chip. The memory chip is placed into the window of the substrate to electrically connect the first portion of the non-memory chip, and there is no direct metal connection between the memory chip and the substrate.

Abstract: A green bike comprises a frame, two wheels, a first internal-gear module and a second internal-gear module and a transmission element. The frame has a pedal, a front supporting unit, a rear supporting unit, and a seat unit. The two wheels are attached to the front supporting unit and the rear supporting unit, respectively. The transmission element is disposed in the frame or a tube shield linking to the frame. The first internal-gear module and the second internal-gear module are coupled with the pedal and at least one of the wheels. The transmission element links the first and the second internal-gear modules for delivering power to the at least one of the wheels.

Abstract: The embodiment provides a semiconductor MP wafer process including processing a plurality of MP wafers in a lot or batch with a first process step. The plurality of the MP wafers is split into an MP wafer group-1 and an MP wafer group-2. At least one of the MP wafers of the MP wafer group-1 is processed with a second process step-1 and at least one of the MP wafers of the MP wafer group-2 is processed with a second process step-2 to form different device components on the MP wafers of the MP wafer group-1 and group-2, respectively. At least one of the MP wafers of the MP wafer group-1 is processed with a third process step-3 and at least one of the MP wafers of the MP wafer group-2 is processed with a third process step-4 to form a substantially same device component on the MP wafers.