Patents by Inventor Weng-Hung Tseng

Weng-Hung Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9929153
    Abstract: A method of fabricating a fin-like field-effect transistor (FinFET) device is disclosed. The method includes forming a mandrel features over a substrate, the mandrel feature and performing a coarse cut to remove one or more mandrel features to form a coarse space. After the coarse cut, the substrate is etched by using the mandrel features, with the coarse space as an etch mask, to form fins. A spacer layer is deposited to fully fill in a space between adjacent fins and cover sidewalls of the fins adjacent to the coarse space. The spacer layer is etched to form sidewall spacers on the fins adjacent to the coarse space. A fine cut is performed to remove a portion of one or more mandrel features to form an end-to-end space. An isolation trench is formed in the end-to-end space and the coarse space.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: March 27, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Feng Shieh, Weng-Hung Tseng, Tzung-Hua Lin, Hung-Chang Hsieh
  • Publication number: 20160379889
    Abstract: A method of fabricating a fin-like field-effect transistor device is disclosed. The method includes forming mandrel features over a substrate and performing a first cut to remove mandrel features to form a first space. The method also includes performing a second cut to remove a portion of mandrel features to form a line-end and an end-to-end space. After the first and the second cuts, the substrate is etched using the mandrel features, with the first space and the end-to-end space as an etch mask, to form fins. Depositing a space layer to fully fill in a space between adjacent fins and cover sidewalls of the fins adjacent to the first space and the end-to-end space. The spacer layer is etched to form sidewall spacers on the fins adjacent to the first space and the end-to-end space and an isolation trench is formed in the first space and the end-to-end space.
    Type: Application
    Filed: September 6, 2016
    Publication date: December 29, 2016
    Inventors: Ming-Feng Shieh, Weng-Hung Tseng, Tzung-Hua Lin, Hung-Chang Hsieh
  • Patent number: 9437497
    Abstract: A method of fabricating a fin-like field-effect transistor device is disclosed. The method includes forming mandrel features over a substrate and performing a first cut to remove mandrel features to form a first space. The method also includes performing a second cut to remove a portion of mandrel features to form a line-end and an end-to-end space. After the first and the second cuts, the substrate is etched using the mandrel features, with the first space and the end-to-end space as an etch mask, to form fins. Depositing a space layer to fully fill in a space between adjacent fins and cover sidewalls of the fins adjacent to the first space and the end-to-end space. The spacer layer is etched to form sidewall spacers on the fins adjacent to the first space and the end-to-end space and an isolation trench is formed in the first space and the end-to-end space.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: September 6, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ming-Feng Shieh, Weng-Hung Tseng, Tzung-Hua Lin, Hung-Chang Hsieh
  • Publication number: 20150111362
    Abstract: A method of fabricating a fin-like field-effect transistor device is disclosed. The method includes forming mandrel features over a substrate and performing a first cut to remove mandrel features to form a first space. The method also includes performing a second cut to remove a portion of mandrel features to form a line-end and an end-to-end space. After the first and the second cuts, the substrate is etched using the mandrel features, with the first space and the end-to-end space as an etch mask, to form fins. Depositing a space layer to fully fill in a space between adjacent fins and cover sidewalls of the fins adjacent to the first space and the end-to-end space. The spacer layer is etched to form sidewall spacers on the fins adjacent to the first space and the end-to-end space and an isolation trench is formed in the first space and the end-to-end space.
    Type: Application
    Filed: October 18, 2013
    Publication date: April 23, 2015
    Inventors: Ming-Feng Shieh, Weng-Hung Tseng, Tzung-Hua Lin, Hung-Chang Hsieh
  • Publication number: 20150108551
    Abstract: A method of fabricating a fin-like field-effect transistor (FinFET) device is disclosed. The method includes forming a mandrel features over a substrate, the mandrel feature and performing a coarse cut to remove one or more mandrel features to form a coarse space. After the coarse cut, the substrate is etched by using the mandrel features, with the coarse space as an etch mask, to form fins. A spacer layer is deposited to fully fill in a space between adjacent fins and cover sidewalls of the fins adjacent to the coarse space. The spacer layer is etched to form sidewall spacers on the fins adjacent to the coarse space. A fine cut is performed to remove a portion of one or more mandrel features to form an end-to-end space. An isolation trench is formed in the end-to-end space and the coarse space.
    Type: Application
    Filed: October 18, 2013
    Publication date: April 23, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Feng Shieh, Weng-Hung Tseng, Tzung-Hua Lin, Hung-Chang Hsieh