Abstract: A method for silicon carbide ingot peeling includes the steps of: placing the silicon carbide ingot between first and second suckers; having a pressing head disposed on a top surface of the first sucker to apply mechanical oscillatory energy to both the silicon carbide ingot and the second sucker through the first sucker; and, having an elastic element disposed under the second sucker to absorb part of the mechanical oscillatory energy to transmit longitudinal waves thereof to a modified layer of the silicon carbide ingot for propagating individually intermittent invisible cracks at the modified layer to break silicon carbide chains at different levels. Till the cracks connect together for forming a continuous crack across the silicon carbide ingot, a top portion of the silicon carbide ingot is then separable therefrom to form a wafer. In addition, an apparatus for silicon carbide ingot peeling is also provided.

Abstract: A method of die bonding, the method has steps of: heating a substrate to a predetermined temperature; sucking at least one die, the at least one die with a base temperature, the base temperature being less than the predetermined temperature; the at least one die bonding on the substrate; cooling the substrate with the bonded die; and moving the substrate with the bonded die to a loading and unloading position, heating another substrate to a predetermined temperature, and repeating the said steps.

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

Abstract: A robotic vacuum cleaner is disclosed in the present invention, which comprises a controller, at least a driving wheel module, and a dust-collecting module. The controller is disposed on a housing plate. The driving wheel module, electrically connecting to the controller, further includes: a driver; a wheel connecting to the output shaft of the driver; a linkage rod, having two ends pivotally fixed on the housing plate and the driver respectively; and a resilience element, having two ends pivotally connected to the housing plate and the driver respectively. The dust-collecting module, disposed on the housing plate, is capable of vacuuming for filtering and collecting dust.

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

Abstract: A robotic vacuum cleaner is disclosed in the present invention, which comprises a controller, at least a driving wheel module, and a dust-collecting module. The controller is disposed on a housing plate. The driving wheel module, electrically connecting to the controller, further includes: a driver; a wheel connecting to the output shaft of the driver; a linkage rod, having two ends pivotally fixed on the housing plate and the driver respectively; and a resilience element, having two ends pivotally connected to the housing plate and the driver respectively. The dust-collecting module, disposed on the housing plate, is capable of vacuuming for filtering and collecting dust.

Abstract: An ejector with multi-ejection pins is used in the post-processes of the semiconductor industry and is used by a selection device to choose a predetermined quantity of ejection pins. When a propelling device lifts the selection device, a pin-base vertical driver controls the vertical motion of a pin base, and a pin-base motion device controls the planar motion of the pin base; the chosen ejection pins can be lifted to elevate the respective dies for separation from adhesive film.

Abstract: An ejector with multi-ejection pins is used in the post-processes of the semiconductor industry and is used by a selection device to choose a predetermined quantity of ejection pins. When a propelling device lifts the selection device, a pin-base vertical driver controls the vertical motion of a pin base, and a pin-base motion device controls the planar motion of the pin base; the chosen ejection pins can be lifted to elevate the respective dies for separation from adhesive film.

Abstract: A tray-positioning device comprises a driving unit and a positioning unit, wherein the positioning unit provides a plurality of sidewalls that correspond to a plurality of upper sidewalls of a tray. By allowing the driving unit to move the positioning unit toward the tray or vice versa that said individual upper sidewalls are in close contact with the corresponding sidewalls, the tray-positioning device is capable of providing precise positioning for the tray.

Abstract: An air-suspended die sorter is disclosed, in particular an air-suspended die sorter capable of performing die sorting, die attaching and die pick-up in the semiconductor industry. The present invention provides an air-suspended die sorter capable of eliminating spring preload, and lowering mechanical friction so as to lift die sorting precision and elevate the success rate, and has a cylinder unit, a piston unit and a pressure unit. The piston type design and a precise control of pressure on top and on bottom of the piston, respectively, enables the present invention to offer an air-suspended state that has done away with stress problems associated with the use of springs. The present invention further provides a novel buffer design for reducing friction and die impact often encountered in prior art applications.

Abstract: A Tray input-output module, comprising a power unit, a clamp unit and a support unit, is capable of automatically retrieving a tray from a transport device and automatically delivering a tray to a transport device for facilitating automation in chip sorter operation, reducing manual work and raising productivity.

Abstract: An air-suspended die sorter is disclosed, in particular an air-suspended die sorter capable of performing die sorting, die attaching and die pick-up in the semiconductor industry. The present invention provides an air-suspended die sorter capable of eliminating spring preload, and lowering mechanical friction so as to lift die sorting precision and elevate the success rate, and has a cylinder unit, a piston unit and a pressure unit. The piston type design and a precise control of pressure on top and on bottom of the piston, respectively, enables the present invention to offer an air-suspended state that has done away with stress problems associated with the use of springs. The present invention further provides a novel buffer design for reducing friction and die impact often encountered in prior art applications.

Abstract: The invention is a device for fast taking out and putting in, especially the device can fast take out a chip from a wafer to put in another chip receptacle, wherein, the invention includes a gear set, which consists of a first big gear, a second big gear and a small gear; at least two driving device, which consists a first driving device and a second driving device; a link mechanism, which cooperates with the gear set to proceed that the link mechanism moves forth toward a non-horizontal direction and back toward the reverse direction, and moves down toward a non-vertical direction and up toward the reverse direction as well; a lift mechanism, which is driven by the first driving device, and a mold plate with gear set and link mechanism is then driven either to complete the actions of moving down toward a non-vertical direction and up toward the reverse direction as mentioned above.

Abstract: The invention is a device for fast taking out and putting in, especially the device can fast take out a chip from a wafer to put in another chip receptacle, wherein, the invention includes a gear set, which consists of a first big gear, a second big gear and a small gear; at least two driving device, which consists a first driving device and a second driving device; a link mechanism, which cooperates with the gear set to proceed that the link mechanism moves forth toward a non-horizontal direction and back toward the reverse direction, and moves down toward a non-vertical direction and up toward the reverse direction as well; a lift mechanism, which is driven by the first driving device, and a mold plate with gear set and link mechanism is then driven either to complete the actions of moving down toward a non-vertical direction and up toward the reverse direction as mentioned above.

Abstract: A Tray input-output module, comprising a power unit, a clamp unit and a support unit, is capable of automatically retrieving a tray from a transport device and automatically delivering a tray to a transport device for facilitating automation in chip sorter operation, reducing manual work and raising productivity.

Abstract: A tray-positioning device comprises a driving unit and a positioning unit, wherein the positioning unit provides a plurality of sidewalls that correspond to a plurality of upper sidewalls of a tray. By allowing the driving unit to move the positioning unit toward the tray or vice versa that said individual upper sidewalls are in close contact with the corresponding sidewalls, the tray-positioning device is capable of providing precise positioning for the tray.

Abstract: An automatic ball placing device can automatically attach the solder ball to the pad of BGA's (Ball Grid Array) substrate. It comprises mainly a BGA substrate fixing device, a stencil fixing seat at least, a horizontal driving device, a vertical driving device and a swinging device. The BGA substrate possesses multiple stencil. The horizontal driving device and the vertical driving device can drive the said BGA substrate fixing device to perform horizontal and vertical movement respectively so as to move the BGA substrate to the position below the stencil fixing seat and thereby, make the solder balls drop into the mesh of the stencil which facilitates the solder balls to attach to the pad of BGA's substrate.