Weng Kong Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: A heat sink comprising: a body having an envelope including a flexible portion for thermal contact with a heat source, the envelope being filled with a thermally conductive liquid; and a thermosyphon having one end disposed at least partly within the liquid in the body to absorb heat from the heat source and another end disposed outside the envelope to dissipate heat.
Type:
Grant
Filed:
March 14, 2000
Date of Patent:
May 15, 2001
Assignee:
DSO National Laboratories
Inventors:
Kok Fah Choo, Chang Yu Liu, Yew Wah Wong, Weng Kong Chan, Kwok Woon Tou
Abstract: A heat sink comprising: a body having an envelope including a flexible portion for thermal contact with a heat source, the envelope being filled with a thermally conductive liquid; and a thermosyphon having one end disposed at least partly within the liquid in the body to absorb heat from the heat source and another end disposed outside the envelope to dissipate heat.
Type:
Grant
Filed:
December 22, 1997
Date of Patent:
May 16, 2000
Inventors:
Kok Fah Choo, Chang Yu Liu, Yew Wah Wong, Weng Kong Chan, Kwok Woon Tou
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