Abstract: A configurable, compact multi-resolution linear image sensor array is disclosed. The multi-resolution image sensor array employs a spatial array of photoelectric sites with each site having an image output terminal and a cluster of switched photo-detector elements. To effect a high quality snapshot operation mode for a high pixel count array, a transfer control switch is added bridging each photo-detector element and its correspondingly connected negative input terminal of an operational amplifier to form an active pixel sensor circuit. To minimize a reset kTC noise associated with numerous traditional active pixel sensor circuits, an in-pixel KTC noise-correlated correlated multiple sampling (CMS) circuitry is also proposed to replace an otherwise traditional correlated double sampling (CDS) circuitry.

Abstract: A multi-lightguide document imaging device is proposed for scanning a document transported atop it. The device includes a line image sensor module having a top sensing area and built-in circuitry for converting an incident line image into video signal output; an intervening rod lens for focusing line image lights from the document onto the sensing area; a number or lightguides lightguide-j (j=1,2, . . . ,N) disposed below the document where each lightguide-j has its own built-in light sources, a transverse cross section spaced at a distance SPCj from the scan line an oriented angularly along a ?-coordinate so as to project a line-illumination aiming at the scan line; and an imager frame having a base for holding the line image sensor module, a multi-element support for holding the rod lens plus the lightguides and a scan line backing portion for backing the document.

Abstract: A multi-lightguide document imaging device is proposed for scanning a document transported atop it. The device includes: a line image sensor module having a top sensing area and built-in circuitry for converting an incident line image into video signal output. an intervening rod lens for focusing line image lights from the document onto the sensing area. a number of lightguides lightguide-j (j=1, 2, . . . , N) disposed below the document where each lightguide-j has its own built-in light sources, a transverse cross section spaced at a distance SPCj from the scan line and oriented angularly along a ?-coordinate so as to project a line-illumination aiming at the scan line. an imager frame having a base for holding the line image sensor module, a multi-element support for holding the rod lens plus the lightguides and a scan line backing portion for backing the document.

Abstract: A high efficiency illumination device has a light guide with a light entrance for converting entering lights into lights exiting through light exit surfaces. Numerous light emitting elements are arranged near the light entrance. A mounting mechanism is interposed between the light emitting elements and the light entrance for affixing them to each other. For each light emitting element, the mounting mechanism also includes an integrated lens for collecting and collimating lights emanated from the light emitting element into the light entrance. In one embodiment, the illumination device further includes an anti-reflection layer placed between the integrated lens and the light entrance to minimize light loss due to Fresnel reflection at the interface between them. The anti-reflection layer can be made of a transparent and non-evaporating liquid material to form an intimately conforming, long lasting air-free bridge between the integrated lens and the light entrance.

Abstract: A sensor chip with an on-chip operational amplifier is described for the formation into a sensor array of a Contact Image Sensor (CIS) module. A number of extra on-chip bonding pads are provided which are electrically connected to the operational amplifier, the associated input resistor and the charge integration capacitor in a selective manner. A number of extra off-chip common conductor stripes are also provided on the substrate for the chip array. A set of wiring patterns are then used to selectively connect these on-chip bonding pads with their corresponding off-chip common conductor stripes resulting in a CIS module which provides both a variable gain of a selected single operational amplifier and an equivalent charge integration capacitance which is the summation of the capacitors from the individual sensor chips within the chip array. Additionally, the associated input resistors can be replaced with an MOS transistor whose control gate can be similarly programmed with the wiring pattern.

Abstract: A sensor chip with an on-chip operational amplifier is described for the formation into a sensor array of a Contact Image Sensor (CIS) module. A number of extra on-chip bonding pads are provided which are electrically connected to the operational amplifier, the associated input resistor and the charge integration capacitor in a selective manner. A number of extra off-chip common conductor stripes are also provided on the substrate for the chip array. A set of wiring patterns are then used to selectively connect these on-chip bonding pads with their corresponding off-chip common conductor stripes resulting in a CIS module which provides both a variable gain of a selected single operational amplifier and an equivalent charge integration capacitance which is the summation of the capacitors from the individual sensor chips within the chip array. Additionally, the associated input resistors can be replaced with an MOS transistor whose control gate can be similarly programmed with the wiring pattern.

Abstract: An image sensor system having very long Depth Of Focus (DOF) on the document plane and very short optical distance from the document plane to the image plane provides the advantages of both a lens reduction image sensor system and a contact type image sensor system. The inventive image sensor system thus provides a Long depth of Focus Contact type Image Sensor (Lf-cis) system that can be assembled in a compact and light weight module that is suitable for use in current image scanning systems (for example, flatbed type, paper feeder type, and handheld type). The invention also provides a compact and light weight flatbed type image scanning system. The CIS module may be modified such that two ends of the module higher than the rest of the module, a steel bracket holds the module and maintains the optical path in alignment, and a metal carriage having metal spring holds the module. The CIS module is self aligned to the bottom of the scanner glass.

Abstract: A contact image sensing system that eliminates the use of npn phototransistors. The device comprises a plurality of sensing elements, a like number of dummy sensing elements, control and drive clocks, a digital scanning shift register, and a differential amplifier. The device operates by sequentially reading the voltage output of the sensors, then comparing that output with the output of the dummy sensors so that any noise or offset in the signal can be cancelled by a differential amplifier.

Abstract: A color-reproducing contact image sensing (CORCIS) system that eliminates the use of multiple arrays of photodetectors with separate color filters and which permits the use of any of various signal-processing improvements such as voltage pickoff, transducer gain and correlated double sample and hold processing. The device operates by sequentially illuminating the colored object to be reproduced by primary color illumination means, with each illumination transferring in parallel the appropriate color response to a readout register for sequential readout. The sample and hold, and the parallel transfer operation, allow the CORCIS system to be able to read out signal while the detector array is integrating the next color signal, thus improving the sensitivity.

Abstract: An improved contact image sensor (CIS) which uses a two-phase shift register is disclosed. The shift register is clocked by both phases of the clock signal, thereby doubling its speed. A transmission gate in the shift register is eliminated and combined with one of the inverters to allow two-phase operation and reduce the number of transistors required to implement the shift register.