Patents by Inventor Weng Wen-Pin

Weng Wen-Pin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip Package
    Publication number: 20090140425
    Abstract: The present provides the improved structure of a chip package, comprising an electrical contact surface of at least a chip configured with a under fill layer, the first solder mask layer, the first metal layer, dielectric material layer, the second metal layer, the second solder mask layer, and metal ball layer, characterized in the electrical contact surfaces among the first metal layer, the second metal layer, and the chip accomplish the electrical connection by employing the contacts of the surfaces of the conducting layers
    Type: Application
    Filed: December 1, 2008
    Publication date: June 4, 2009
    Applicant: Lunghwa University of Science and Technology
    Inventors: Weng Wen-Pin, Ko Wen Hui