Patents by Inventor Wenguan Piao

Wenguan Piao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cryopump and baffle plate for cryopump
    Patent number: 11661931
    Abstract: A cryopump includes a cryopanel, a main body, and a baffle plate. The cryopanel is connected to a refrigerator. The main body accommodates the cryopanel. The baffle plate is located in a gas inlet of the main body. The baffle plate includes a first portion and a second portion. The first portion includes a center of the baffle plate and a first hole extending through the baffle plate. The second portion includes an edge of the baffle plate and a second hole extending through the baffle plate. The second portion has a greater conductance than the first portion.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: May 30, 2023
    Assignee: Ulvac Cryogenics Incorporated
    Inventors: Shunichi Sekiguchi, Junichi Yasuda, Wenguan Piao, Yoshinobu Murayama
  • CRYOPUMP AND BAFFLE PLATE FOR CRYOPUMP
    Publication number: 20220163025
    Abstract: A cryopump includes a cryopanel, a main body, and a baffle plate. The cryopanel is connected to a refrigerator. The main body accommodates the cryopanel. The baffle plate is located in a gas inlet of the main body. The baffle plate includes a first portion and a second portion. The first portion includes a center of the baffle plate and a first hole extending through the baffle plate. The second portion includes an edge of the baffle plate and a second hole extending through the baffle plate. The second portion has a greater conductance than the first portion.
    Type: Application
    Filed: September 28, 2021
    Publication date: May 26, 2022
    Applicant: Ulvac Cryogenics Incorporated
    Inventors: Shunichi Sekiguchi, Junichi Yasuda, Wenguan Piao, Yoshinobu Murayama