Abstract: In some embodiments, a method receives quality metric values for profile levels in a plurality of profile levels for a segment of content. An available bandwidth and associated bitrates of profile levels in the plurality of profile levels are evaluated to select a first profile level. The quality metric values for profile levels in the plurality of profile levels are evaluated to select a second profile level. The method selects a profile level in the plurality of profile levels based on the first profile level and the second profile level. The profile level that is selected is requested for the segment.

Abstract: A method includes: a processor that obtains several lines of data in to-be-displayed display data to generate a data block; generates a synchronization flag corresponding to the data block; encapsulates the data block and the synchronization flag corresponding to the data block to obtain a data packet corresponding to the data block; and sends all data packets corresponding to the display data to the display system. The display system sequentially parses all the data packets sent by the processor to obtain a synchronization flag associated with each data packet, and determines a display location of each data block on a display panel based on the synchronization flag to display the display data.

Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. An integrated circuit (IC) die and a surface of a substrate each include hybrid bonding regions surrounded by hydrophobic structures. The hydrophobic structures include non-vertical inward sloping sidewalls or similar features to contain a liquid droplet that is applied to the die or substrate hybrid bonding region. After the hybrid bonding regions are brought together, capillary forces cause the die to self-align, and a hybrid bond is formed by evaporating the liquid and subsequent anneal. IC structures including the IC die and portions of the substrate are segmented and assembled.

Abstract: A surface of an integrated circuit (IC) die structure and a substrate to which the IC die structure is to be bonded include biphilic regions suitable for liquid droplet formation and droplet-based fine alignment of the IC die structure to the substrate. To ensure warpage of the IC die structure does not interfere with droplet-based fine alignment process, an IC die structure of greater thickness is aligned to the substrate and thickness of the IC die structure subsequently reduced. In some embodiments, a back side of the IC die structure is polished back post attachment. In some alternative embodiments, the IC die structure includes sacrificial die-level carrier is removed after fine alignment and/or bonding.

Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. An integrated circuit (IC) die backside surface and a surface of a structural substrate each include bonding regions surrounded by hydrophobic structures. A liquid droplet is applied to the die or structural substrate bonding region and the die is placed on the bonding region of the structural substrate. Capillary forces cause the die to self-align to the bonding region, and a bond is formed by evaporating the liquid and subsequent anneal. A hybrid bond is then formed between the opposing active surface of the die and a base substrate using wafer-to-wafer bonding. IC structures including the IC die and portions of the structural substrate and base substrate are segmented from the bonded wafers and assembled.

Abstract: Hybrid bonded multi-level die stacks, related apparatuses, systems, and methods of fabrication are disclosed. First-level integrated circuit (IC) dies and a base substrate each include hybrid bonding regions surrounded by hydrophobic structures. The hybrid bonding regions are brought together with a liquid droplet therebetween, and capillary forces cause the IC die to self-align. A hybrid bond is formed by evaporating the droplet followed by anneal. Hybrid bonding regions of second-level IC dies are similarly bonded to hybrid bonding regions on backsides of the first-level IC dies. This is repeated for any number of subsequent levels of IC dies. IC structures including the bonded IC dies and portions of the base substrate are segmented and assembled.

Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. One or both of an integrated circuit (IC) die hybrid bonding region and a base substrate hybrid bonding region surrounded by hydrophobic structures that include a cross-linked material. The hybrid bonding regions are brought together with a liquid droplet therebetween, and capillary forces cause the IC die to self-align. A hybrid bond is formed by evaporating the droplet and a subsequent anneal. The cross-linked material hydrophobic structures contain the liquid droplet for alignment and are resistant to plasma treatment prior to bonding.

Abstract: Hybrid bonded die stacks, related apparatuses, systems, and methods of fabrication are disclosed. One or both of an integrated circuit (IC) die hybrid bonding region and a base substrate hybrid bonding region are surrounded by a protective layer and hydrophobic structures on the protective layer. The protective layer is formed prior to pre-bond processing to protect the hybrid bonding region during plasma activation, clean test, high temperature processing, or the like. Immediately prior to bonding, the hydrophobic structures are selectively applied to the protective layer. The hybrid bonding regions are brought together with a liquid droplet therebetween, and capillary forces cause the IC die to self-align. A hybrid bond is formed by evaporating the droplet and a subsequent anneal. The hydrophobic structures contain the liquid droplet for alignment during bonding.

Abstract: A surface of at least one of an integrated circuit (IC) die structure or a substrate structure to which the IC die structure is to be bonded include a biphilic region suitable for liquid droplet confinement and droplet-based fine alignment of the IC die structure to the substrate structure. A biphilic region may include an inner region surrounded by bonding regions, or between an adjacent pair of bonding regions. The inner region may improve fine alignment, particularly if there is a significant amount of tilt between a bonding surface of the IC die structure and a bonding surface of the substrate structure during placement. The inner region may, for example, facilitate the confinement of two or more droplets on the bonding regions. Inner or outer regions of a biphilic structure may be segmented or contiguous and intersecting IC die edges may also be non-orthogonal.

Abstract: Provided are an information generation method and apparatus, and an electronic device.

Abstract: A flexible circuit board test device is disclosed. The flexible circuit board test device includes a main clamp, a first rotating shaft arm and a second rotating shaft arm; the first rotating shaft arm and the second rotating shaft arm are rotatably mounted on a first mobile table and a second mobile table through a first main shaft and a second main shaft respectively; the first rotating shaft arm and the second rotating shaft arm each are provided with a sandwich space for simulating a motion space of a flexible circuit board; the first mobile table is provided with a first driving component in transmission connection with the first main shaft, the second mobile table is provided with a second driving component in transmission connection with the second main shaft; and the first rotating shaft arm and the second rotating shaft arm are provided with auxiliary clamps.

Abstract: In some embodiments, a method analyzes flagged locations from a plurality of locations in an encoding of a video to form a cluster of locations. Draft micro-chunk boundaries for the cluster are determined based on searching for a first start location and a first end location in the encoding. The method searches in a first search range before the first start location and a second search range after the first end location for a second start location in the first search range and a second end location in the second search range. The second start location and the second end location form a micro-chunk. An encoding parameter set is determined for the micro-chunk formed by the second start location and the second end location based on content characteristics of the micro-chunk. The method uses the encoding parameter set to encode the micro-chunk for insertion in the encoding of the video.

Abstract: Dialogue summarization is challenging due to its multi-speaker standpoints, casual spoken language style, and limited labelled data. The embodiments are directed to a coarse-to-fine dialogue summarization model that improves abstractive dialogue summarization quality and enables granular controllability. A summary draft that includes key words for turns in a dialogue conversation history is created. The summary draft includes pseudo-labelled interrogative pronoun categories and noisy key phrases. The dialogue conversation history is divided into segments. A generate language model is trained to generate a segment summary for each dialogue segment using a portion of the summary draft that corresponds to at least one dialogue turn in the dialogue segment. A dialogue summary is generated using the generative language model trained using the summary draft.

Abstract: A sand shale formation physical property evaluation method and system for precise deep oil and gas navigation aims to solve the problem that the prior art cannot acquire a real-time and accurate logging-while-drilling (LWD) Rt curve. The method includes: acquiring basic data of a target well location as well as basic data and an LWD resistivity (Rt) of an adjacent well; dividing the data into different groups; retaining data with a maximum correlation value with the LWD Rt in each group of data; eliminating outliers, and performing standardization; constructing a two-dimensional input feature map by taking the correlation value and standardized data as a weight; acquiring an LWD Rt prediction curve based on the two-dimensional input feature map; calculating a hydrocarbon parameter in a window based on the LWD Rt prediction curve; and locating an area with a high hydrocarbon potential based on the hydrocarbon parameter at each position.

Abstract: A sand shale formation lithology evaluation method and system for precise deep oil and gas navigation aims to solve the problem in the prior art, that is, the accuracy of the logging-while-drilling (LWD) azimuthal resistivity is insufficient due to an equipment or technology deficiency. The method includes: acquiring density distribution data, gamma distribution data, and resistivity distribution data of a target location; amplifying the data to acquire amplified logging distribution data; clustering the data to acquire clustered logging data; adding stratigraphic information to the clustered data; performing dimensionality reduction by a principal component analysis (PCA) method, and taking dimensionality-reduced data as a weight of azimuthal logging data to acquire an LWD feature dataset; predicting missing LWD photoelectric data through the LWD feature dataset; and acquiring a formation lithology evaluation result based on an LWD photoelectric data prediction curve.

Abstract: A memory device includes a memory cell array having stacked first and second memory decks; and a peripheral circuit coupled to the memory cell array and configured to: when performing a program operation on a selected memory cell layer in the first memory deck, apply a voltage to a word line layer corresponding to the selected memory cell layer and apply a first voltage to a word line layer corresponding to an unselected memory cell layer in the first memory deck; apply a second voltage to the word line layer corresponding to the plurality of memory cell layers in the second memory deck; and apply a third voltage to the dummy word line layer corresponding to the at least one dummy memory cell layer at the junction position of the first memory deck and the second memory deck. The first voltage exceeds the second voltage, which exceeds the third voltage.

Abstract: The present application discloses a strengthened microcrystalline glass having a high scratch resistance comprising a compressive stress layer and a tensile stress layer. The glass has a main crystalline phase of (Zn, Mg)Al2O4 and comprises Na2O. It has a surface K2O concentration of ?7.00 wt %. Along the thickness direction of the glass, the glass has a depth of ?0.07 t, preferably 0.07 t to 0.10 t, which is from any surface of the glass to a location close to that surface and having the same potassium (K) concentration as that at the center of the glass, wherein t is the thickness of the glass. The strengthened microcrystalline glass has an excellent scratch resistance comparable to that of sapphire glass.

Abstract: The present invention belongs to the technical field of pharmaceutical chemistry, and particularly relates to a 1-aminobenzo[4,5]imidazo[1,2-a]pyrazine-3-formamide compound, and the preparation therefor and use thereof. The structure of the compound of the present invention is as shown in formula (I). The compound has a novel structure and is an adenosine receptor inhibitor, has good inhibitory activity on adenosine A2A receptors, has good subtype selectivity, and can be used as a targeted adenosine A2A receptor inhibitor for immunotherapy. By means of inhibiting the activity of the adenosine A2A receptor, the function of removing tumor cells by the immune system is released, so that the effect of treating tumors is achieved.

Abstract: In some embodiments, a grain analysis system is configured for analyzing a first video frame and outputting respective first film grain information for film grain that is included in the first video frame or configured for analyzing a second video frame and outputting second film grain information. At least one of a grain removal system and a grain synthesis system is included. The grain removal system is configured for removing the film grain from the first video frame using the first film grain information to generate a third video frame corresponding to the first video frame with film grain removed. The grain analysis system is separate from the grain removal system. The grain synthesis system is configured for synthesizing film grain for the third video frame using the first film grain information or the second film grain information. The grain analysis system is separate from the grain synthesis system.