Patents by Inventor Wen-Hao Deng

Wen-Hao Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9019678
    Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: April 28, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Hsin-Hsien Yeh, Hong-Ching Lin, Tsung-Wen Chen, Wen-Hao Deng
  • Publication number: 20130044401
    Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.
    Type: Application
    Filed: August 16, 2012
    Publication date: February 21, 2013
    Inventors: Hsin-Hsien Yeh, Hong-Ching Lin, Tsung-Wen Chen, Wen-Hao Deng