Patents by Inventor WENHU LI

WENHU LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Toughened TiAl-based alloy sheet with periodically misaligned through-hole titanium alloy layers and preparation method thereof
    Patent number: 11253919
    Abstract: Some embodiments of the disclosure provide a toughened TiAl-based alloy sheet with periodically misaligned through-hole titanium alloy layers sequentially stacked together. A through structure is formed in the misaligned through-hole titanium alloy layer. Two openings of the through structure are respectively located on upper and lower surfaces of the titanium alloy layer. The misaligned opening position of the through structure is at a center position of a quadrangle formed by every four through holes in adjacent titanium alloy layers. The through structure is filled with a TiAl-based alloy. The TiAl-based alloy layers on adjacent sides of the titanium alloy layer are connected through the TiAl-based alloy in the through structure. The TiAl-based alloy layer is connected to the titanium alloy layer through a Ti3Al interface layer. The TiAl-based alloy and the titanium alloy in the through structure are connected through a Ti3Al interface layer.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: February 22, 2022
    Assignee: Shaanxi University of Technology
    Inventors: Fang Liu, Taotao Ai, Hongfeng Dong, Wenhu Li, Xinqiang Yuan, Zhifeng Deng, Jinhu Dong
  • TOUGHENED TIAL-BASED ALLOY SHEET WITH PERIODICALLY MISALIGNED THROUGH-HOLE TITANIUM ALLOY LAYERS AND PREPARATION METHOD THEREOF
    Publication number: 20200298312
    Abstract: Some embodiments of the disclosure provide a toughened TiAl-based alloy sheet with periodically misaligned through-hole titanium alloy layers sequentially stacked together. A through structure is formed in the misaligned through-hole titanium alloy layer. Two openings of the through structure are respectively located on upper and lower surfaces of the titanium alloy layer. The misaligned opening position of the through structure is at a center position of a quadrangle formed by every four through holes in adjacent titanium alloy layers. The through structure is filled with a TiAl-based alloy. The TiAl-based alloy layers on adjacent sides of the titanium alloy layer are connected through the TiAl-based alloy in the through structure. The TiAl-based alloy layer is connected to the titanium alloy layer through a Ti3Al interface layer. The TiAl-based alloy and the titanium alloy in the through structure are connected through a Ti3Al interface layer.
    Type: Application
    Filed: September 10, 2019
    Publication date: September 24, 2020
    Inventors: FANG LIU, TAOTAO AI, HONGFENG DONG, WENHU LI, XINQIANG YUAN, ZHIFENG DENG, JINHU DONG