Patents by Inventor Wenhui ZENG

Wenhui ZENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Acid-labile surfactants
    Patent number: 11939311
    Abstract: Provided herein are surfactant compounds that can be used to aid in preparation of protein samples for analysis, for example by mass spectrometry.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 26, 2024
    Assignee: Promega Corporation
    Inventors: Joel Walker, Sergei Saveliev, Zhiyang Zeng, Robert Kargbo, Hui Wang, Sergiy Levin, Valerie Ressler, Jun Zhang, Ce Shi, Harry Tetsuo Uyeda, Jean Osterman, Min Zhou, Prabin Rai, Wenhui Zhou
  • FOLDING MECHANISM, SUPPORT STRUCTURE, AND ELECTRONIC DEVICE
    Publication number: 20240007552
    Abstract: A folding mechanism, a support structure, and an electronic device are provided. The folding mechanism includes a first screen supporting plate, a second screen supporting plate, a first housing base rotatably matching the first screen supporting plate, a second housing base rotatably matching the second screen supporting plate, and a base portion. The first housing base and the second housing base are rotatably connected to a plurality of first rotation portions of the base portion in a one-to-one correspondence manner by means of respective second rotation portions.
    Type: Application
    Filed: September 15, 2023
    Publication date: January 4, 2024
    Inventors: Dongcun CHENG, Dongqin ZHAO, Wenhui ZENG, Jingwei XU
  • Heat sink, heat dissipation apparatus, heat dissipation system, and communications device
    Patent number: 11502019
    Abstract: One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: November 15, 2022
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Shoubiao Xu, Shanjiu Chi, Wenhui Zeng
  • Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And Communications Device
    Publication number: 20210343621
    Abstract: One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.
    Type: Application
    Filed: May 14, 2021
    Publication date: November 4, 2021
    Inventors: Shoubiao XU, Shanjiu CHI, Wenhui ZENG
  • Heat sink, heat dissipation apparatus, heat dissipation system, and communications device
    Patent number: 11043442
    Abstract: One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: June 22, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Shoubiao Xu, Shanjiu Chi, Wenhui Zeng
  • Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And Communications Device
    Publication number: 20190206763
    Abstract: One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.
    Type: Application
    Filed: March 11, 2019
    Publication date: July 4, 2019
    Inventors: Shoubiao XU, Shanjiu CHI, Wenhui ZENG