Abstract: Methods using photothermal nanoparticles in rapid nucleic acid amplification and photothermal nanoparticles include forming a reaction mixture comprising a nucleic acid template, a polymerase enzyme, and a heating media. The heating media comprises a plurality of photothermal nanoparticles suspended in a solution, fabricated on a microchip, or on a surface of a well in a multi-well plate. The photothermal nanoparticles are nanoparticles having a particular geometric shape and comprise a single component or a multi-component. The plurality of photothermal nanoparticles are further categorized by surface plasmon resonance with a resonance wavelength in a particular range to convert energy absorbed from a light source to sufficiently heat a volume of a composition for the transcription of the new nucleic acid strand. The particular geometric shape of the photothermal nanoparticles is selected from the group consisting of: polyhedral, spheroid, torus, and hollow shapes.

Abstract: A hinge mechanism includes a base, first rotating components, second rotating components, a first connecting component, a second connecting component, a floating support component, and elastic reset members. In a case that the hinge mechanism is in a first state, at least one of the plurality of the second rotating components supports the floating support component, and the elastic reset members are in a stretched or compressed state. A distance between an outer wall of the base facing away from a rotation axis of the first rotating component and the floating support component is a first distance. In a case that the hinge mechanism is in a second state, the second rotating components avoid the floating support component, a distance between the outer wall of the base and the floating support component is a second distance, and the second distance is less than the first distance.

Abstract: Provided herein are compositions and methods for purifying and concentrating nucleic acids from large-volume samples. In particular, reagents are provided for non-specifically binding total nucleic acid to a solid surface, separating bound nucleic acid from a large-volume sample, separating nucleic acid from amplification inhibitors, and/or eluting nucleic acids into a small volume amenable to further analysis.

Abstract: An online system dynamically determines time periods during which interaction data points are collected for application states being tested as part of an application state experiment. The online system collects interaction data points that occurred after a time when instructions were transmitted to apply the first application state and labels those with a state label corresponding to the first application state. When the online system detects that an interaction data minimum has been met, the online system transmits instructions to the client devices to present a user interface in accordance with a second application state. The online system applies a transition period between when the second set of instructions are transmitted and when the online system starts labeling interaction data points with a state label for the second application state. After the transition period, the online system labels interaction data points with state labels for the second application state.

Abstract: A hinge assembly and an electronic device are provided. The hinge assembly includes: a base provided with a first fitting portion and a second fitting portion; a first synchronizing shaft; a second synchronizing shaft; a first movable piece; and a second movable piece. A first end of the first synchronizing shaft is able to be movably connected to the first fitting portion. A first end of the second synchronizing shaft is able to be movably connected to the second fitting portion. A first end of the first movable piece is provided with a first gear sleeve. An outer surface of the first gear sleeve is provided with a first gear end. The first gear sleeve is connected to and moves synchronously with the first synchronizing shaft. A first end of the second movable piece is provided with a second gear sleeve.

Abstract: A folding mechanism, a support structure, and an electronic device are provided. The folding mechanism includes a first screen supporting plate, a second screen supporting plate, a first housing base rotatably matching the first screen supporting plate, a second housing base rotatably matching the second screen supporting plate, and a base portion. The first housing base and the second housing base are rotatably connected to a plurality of first rotation portions of the base portion in a one-to-one correspondence manner by means of respective second rotation portions.

Abstract: One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.

Abstract: One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.

Abstract: One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.

Abstract: One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.