Patents by Inventor Wenhui Zhu
Wenhui Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978996Abstract: A tunable external cavity laser with dual gain chips, including: a polarization beam splitter having a beam splitting surface arranged at an angle of 45° with respect to a first direction and a second direction perpendicular to the first direction; a first gain chip arranged in the first direction; a second gain chip arranged in the second direction; a feedback cavity arranged in the first direction, wherein the feedback cavity and the first gain chip are respectively arranged on two opposite sides of the polarization beam splitter, and the feedback cavity includes at least one independent Fabry-Perot etalon, at least one air gap Fabry-Perot cavity and a mirror that are arranged in the first direction. The polarization beam splitter and the two gain chips cooperate to share the feedback cavity, so that a wavelength and a phase may be adjusted, and a larger tuning range may be obtained.Type: GrantFiled: December 14, 2021Date of Patent: May 7, 2024Assignee: Institute of Semiconductors, Chinese Academy of SciencesInventors: Changda Xu, Dechao Ban, Wenhui Sun, Wei Chen, Ninghua Zhu, Ming Li
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Patent number: 11970107Abstract: A dimming mechanism, which is used for dimming a lighting unit and includes a fixed ball head connecting piece, a first adjustable ball head connecting piece, and a second adjustable ball head connecting piece; one end of the fixed ball head connecting piece is connected to the lighting unit, and the other end is connected to a support frame or lamp body; one end of the first adjustable ball head connecting piece is connected to the lighting unit, and the other end is supported on the support frame or lamp body; and a sliding slot is provided on the lighting unit, and one end of the second adjustable ball head connecting piece (1c) is slidingly connected to the sliding slot so that the sliding slot is, by means of the back and forth motion of the second adjustable ball head connecting piece, driven to rotate, and the lighting unit is, by means of the rotation of the sliding slot, driven to rotate so as to achieve dimming in a second direction.Type: GrantFiled: March 17, 2021Date of Patent: April 30, 2024Assignee: HASCO VISION TECHNOLOGY CO., LTD.Inventors: Zhiping Qiu, Langrun Jin, Cong Li, He Zhu, Wenhui Sang
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Patent number: 11971152Abstract: A lighting module for three-dimensional suspension imaging, includes a micro lens array and a micro image-text element, wherein a transparent medium layer is arranged between the micro lens array and the micro image-text element; the micro image-text element includes a micro image-text array corresponding to the micro lens array; and the micro image-text element is arranged in such a way that light is irradiated from the micro image-text array to the micro lens array through the transparent medium layer and forms a three-dimensional suspension image. The lighting module is used in a vehicle lamp, a vehicle accessory device and a vehicle, and can realize an image having a three-dimensional, suspension and dynamic effect, which image has a good visual effect.Type: GrantFiled: February 26, 2021Date of Patent: April 30, 2024Assignee: HASCO VISION TECHNOLOGY CO., LTD.Inventors: Zhiping Qiu, He Zhu, Wenhui Sang
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Patent number: 11959609Abstract: A lens unit, a lens for a low-beam illumination module, a low-beam illumination module and a vehicle. The lens unit includes a rear surface and a front surface; the lens unit has a focal line, and the focal line is a straight line perpendicular to a light emitting direction of the lens unit; the rear surface and the front surface are adapted to project light rays passing through the focal line into parallel light rays, and the front surface is a free-form curved surface. The lens unit has the optical characteristics of a cylindrical lens, and is able to cause parallel incident light to be focused into a line instead of a focal point upon passing through the lens unit.Type: GrantFiled: June 16, 2021Date of Patent: April 16, 2024Assignee: HASCO VISION TECHNOLOGY CO., LTD.Inventors: Xiangqian Chen, Zhaoyu Chen, Guomin Xu, Tao Zhang, Ying Li, He Zhu, Wenhui Sang
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Patent number: 11933467Abstract: A vehicle lighting apparatus comprising a headlight module comprising a light collecting part, a reflection part, a light outlet part, a first optical channel, and a second optical channel arranged in sequence along a light emitting direction, the first optical channel connecting the light collecting part and the reflection part, the second optical channel connecting the reflection part and the light output part, the connecting position of the lower surface of the second optical channel and the light output part provided with a low beam cut-off line structure for forming a low beam bright-dark cut-off line, the light collected by the light collecting part emitted toward the light outlet part after reflection by the reflection part. The present headlight module is miniaturised and has a high rate of light utilisation.Type: GrantFiled: January 13, 2021Date of Patent: March 19, 2024Assignee: HASCO VISION TECHNOLOGY CO., LTD.Inventors: He Zhu, Zhiping Qiu, Wenhui Sang
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Patent number: 11936614Abstract: The disclosure discloses a network device, an apparatus, and a network system. The network device receives a reply packet sent by a DHCP service device, and determines a first next-hop address from a plurality of next-hop addresses corresponding to a destination IP address of the reply packet, where the first next-hop address is a first tunnel endpoint IP address of the relay device and is different from a tunnel endpoint IP address of another relay device in a target anycast group to which the relay device belongs, and a communication connection is established between each relay device in the target anycast group and the client. The network device may forward the reply packet to the relay device based on the first next-hop address.Type: GrantFiled: July 8, 2022Date of Patent: March 19, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Jianping Gao, Wenhui Zhu
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Patent number: 11927318Abstract: A headlamp optical element with a III-region light shape forming structure that comprises a light collecting portion, a first light emitting portion, a reflecting portion, and optionally a second light emitting portion. The light collecting portion converges incident light and emits light via the first light emitting portion. Some light may be directly emitted to the second light emitting portion. The rest of the light may be reflected by the reflecting portion and emitted to the second light emitting portion. The reflecting portion is connected to the lower portion of the first light emitting portion, with a lower beam cut-off line structure at the other end thereof. The light emitting surface of the first light emitting portion comprises multiple step surfaces with segment differences or is a single curved surface.Type: GrantFiled: January 13, 2021Date of Patent: March 12, 2024Assignee: HASCO VISION TECHNOLOGY CO., LTD.Inventors: He Zhu, Zhiping Qiu, Wenhui Sang
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Patent number: 11927317Abstract: A vehicle light optical element assembly of a vehicle lamp, and a vehicle lighting device, a vehicle lamp and a vehicle comprising the vehicle light optical element assembly of the vehicle lamp. The vehicle light optical element assembly comprises a low-beam primary optical element, a high-beam primary optical element provided below the low-beam primary optical element, and a lens provided on the front end of the low-beam primary optical element and/or the high-beam primary optical element, wherein the low-beam primary optical element and/or the high-beam primary optical element are integrated with the lens, and the low-beam primary optical element and the high-beam primary optical element are suitable for light convergence and collimation to then pass through the lens to form a low-beam illumination light shape and a high-beam illumination light shape. The vehicle light optical element assembly has the advantages of a compact structure, small volume, and high assembly accuracy.Type: GrantFiled: November 17, 2020Date of Patent: March 12, 2024Assignee: HASCO VISION TECHNOLOGY CO., LTD.Inventors: He Zhu, Zhiping Qiu, Wenhui Sang
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Patent number: 11926254Abstract: An optical element, comprising a light guide body. The light guide body comprises a plurality of light-incident parts arranged along a length extension direction of the light guide body, a light guide part and a light-emitting part; each light-incident part is provided with at least one light-incident unit; the light guide part is configured to guide light received by each light-incident unit to be emitted toward the light-emitting part; the shape of a forward projection plane of the light-emitting part is of a strip shape. The optical element can reduce the occupied space and improve the space utilization rate, facilitates reducing positioning mounting errors, has an appearance with a narrow and elongated shape, and can be applied in vehicle lamp modules, vehicle lamps and vehicles.Type: GrantFiled: December 10, 2020Date of Patent: March 12, 2024Assignee: HASCO VISION TECHNOLOGY CO., LTD.Inventors: He Zhu, Wenhui Sang, Cong Li, Dapan Zhang, Zhiping Qiu
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Patent number: 11920755Abstract: An automotive headlamp system and an automotive lamp. The automotive headlamp system comprises a light source, a primary optical element, an automotive signal lamp structure, and a secondary optical element arranged sequentially along the light emitting direction. The automotive signal lamp structure comprises a light-transmitting portion and a rotating shaft. The light-transmitting portion comprises at least one light-transmitting plate mounted on the rotating shaft which can be driven to rotate by the rotating shaft. By means of rotation, light from the light source exits from the primary optical element, then selectively passes through one of or none of the light-transmitting plates, and is then projected by means of the secondary optical element to achieve a corresponding signal lamp function. The light-transmitting plate mounted on the rotating shaft is used to replace an existing signal lamp, reducing the space occupied by the original signal lamp, decreasing the volume of a headlamp.Type: GrantFiled: August 31, 2021Date of Patent: March 5, 2024Assignee: HASCO VISION TECHNOLOGY CO., LTD.Inventors: Meng Li, Zhaoyu Chen, Ying Li, Xiangqian Chen, He Zhu, Wenhui Sang
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Publication number: 20240068635Abstract: A primary optical element, a primary optical assembly, an optical assembly, a vehicle lamp lighting device and a vehicle. The primary optical element comprises a primary optical element main body comprising a light guiding portion and a fusion light-emitting portion which are provided from rear to front, a front end surface of the fusion light-emitting portion is provided as a light-emitting surface, and the light guiding portion comprises a plurality of light guiding columns, the thickness of the fusion light-emitting portion in the up-down direction greater than the thickness of the light guiding portion in the up-down direction, and the fusion light-emitting portion able to fuse light transmitted by the plurality of light guiding columns to the fusion light-emitting portion, and then emit the light by means of the light-emitting surface. The primary optical assembly, the optical assembly, the vehicle lamp lighting device, and the vehicle comprise the optical assembly.Type: ApplicationFiled: February 5, 2021Publication date: February 29, 2024Applicant: HASCO VISION TECHNOLOGY CO., LTD.Inventors: Weigang GONG, Zhiping QIU, He ZHU, Wenhui SANG
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Publication number: 20230015922Abstract: A media access control (MAC) address sending method, apparatus, and system, and a related device are provided. The method is implemented by a first network device connected to a first virtual machine and a second virtual machine. The first network device obtains a MAC address of the first virtual machine; and when the first virtual machine and the second virtual machine have a same MAC address and are located in different virtual local area networks, sends a route to a second network device, where the route includes route information, and the route information includes the MAC address, first virtual local area network information of the first virtual machine, and second virtual local area network information of the second virtual machine. In this method, information about virtual machines having a same MAC address in different virtual local area networks is aggregated to one route.Type: ApplicationFiled: September 22, 2022Publication date: January 19, 2023Inventor: Wenhui Zhu
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Publication number: 20220345440Abstract: The disclosure discloses a network device, an apparatus, and a network system. The network device receives a reply packet sent by a DHCP service device, and determines a first next-hop address from a plurality of next-hop addresses corresponding to a destination IP address of the reply packet, where the first next-hop address is a first tunnel endpoint IP address of the relay device and is different from a tunnel endpoint IP address of another relay device in a target anycast group to which the relay device belongs, and a communication connection is established between each relay device in the target anycast group and the client. The network device may forward the reply packet to the relay device based on the first next-hop address.Type: ApplicationFiled: July 8, 2022Publication date: October 27, 2022Inventors: Jianping GAO, Wenhui ZHU
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Patent number: 9397068Abstract: A manufacturing method for Package in Package (PiP) electronic device based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves. The upper surface of plate metallic base material is half-etched to form chip pad and multi-row of leads. Encapsulating IC chip for wire bonding, adhesive material, metal wire, chip pad and a plurality of leads to form a multi-row QFN package as an inner package. Flip-chip bonding IC chip with solder bumps on the first metal material layer of leads. Encapsulating IC chip with solder bumps, the multi-row QFN package, adhesive material, and leads to form an array of PiP electronic devices. Sawing and separating the PiP electronic device array, forming PiP electronic device unit.Type: GrantFiled: December 4, 2012Date of Patent: July 19, 2016Assignee: BEIJING UNIVERSITY OF TECHNOLOGYInventors: Fei Qin, Guofeng Xia, Tong An, Wei Wu, Chengyan Liu, Wenhui Zhu
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Patent number: 9275941Abstract: The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package.Type: GrantFiled: August 31, 2012Date of Patent: March 1, 2016Assignees: TIANSHUI HUATIAN TECHNOLOGY CO., HUATIAN TECHNOLOGY (XI'AN) CO., LTD.Inventors: Wenhui Zhu, Wei Mu, Zhaoming Xu, Xiaowei Guo
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Publication number: 20150348934Abstract: A manufacturing method for Package in Package (PiP) electronic device based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves. The upper surface of plate metallic base material is half-etched to form chip pad and multi-row of leads. Encapsulating IC chip for wire bonding, adhesive material, metal wire, chip pad and a plurality of leads to form a multi-row QFN package as an inner package. Flip-chip bonding IC chip with solder bumps on the first metal material layer of leads. Encapsulating IC chip with solder bumps, the multi-row QFN package, adhesive material, and leads to form an array of PiP electronic devices. Sawing and separating the PiP electronic device array, forming PiP electronic device unit.Type: ApplicationFiled: December 4, 2012Publication date: December 3, 2015Applicant: BEIJING UNIVERSITY OF TECHNOLOGYInventors: Fei Qin, Guofeng Xia, Tong An, Wei Wu, Chengyan Liu, Wenhui Zhu
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Publication number: 20150102476Abstract: The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package.Type: ApplicationFiled: August 31, 2012Publication date: April 16, 2015Applicants: HUATIAN TECHNOLOGY (XI'AN) CO., LTD., TIANSHUI HUATIAN TECHNOLOGY CO., LTD.Inventors: Wenhui Zhu, Wei Mu, Zhaoming Xu, Xiaowei Guo
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Patent number: 8951840Abstract: A manufacturing method for Flip Chip on Chip (FCoC) package based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves. The upper surface of plate metallic base material is half-etched to form chip pad and multi-row of leads. Encapsulating first IC chip, second IC chip, solder bumps, underfill material, and metal wire to form an array of FCoC package based on the type of multi-row QFN package. Sawing and separating the FCoC package array, and forming FCoC package unit.Type: GrantFiled: December 4, 2012Date of Patent: February 10, 2015Assignee: Beijing University of TechnologyInventors: Fei Qin, Guofeng Xia, Tong An, Chengyan Liu, Wei Wu, Wenhui Zhu
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Patent number: D1019995Type: GrantFiled: September 11, 2021Date of Patent: March 26, 2024Assignee: HASCO VISION TECHNOLOGY CO., LTD.Inventors: Cong Li, Haiyue Yan, He Zhu, Wenhui Sang
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Patent number: D1023427Type: GrantFiled: July 1, 2021Date of Patent: April 16, 2024Assignee: HASCO VISION TECHNOLOGY CO., LTD.Inventors: Hui Li, Langrun Jin, Zhiping Qiu, He Zhu, Wenhui Sang