Patents by Inventor Wenjian Huang

Wenjian Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153819
    Abstract: A substrate manufacturing method, an embedded substrate and a semiconductor are disclosed. The method includes: manufacturing a first semi-finished substrate including first circuit layers and a first dielectric layer arranged in staggered and laminated manner; arranging a viscous material layer on the first circuit layer to form a device adhering area; adhering an embedded device on the device adhering area, a pin face of the embedded device facing away from the viscous material layer; laminating a second dielectric layer on the first circuit layer, which covers the viscous material layer and the embedded device; manufacturing a first conductive pillar, a second conductive pillar and a second circuit layer, the first conductive pillar extending through the second dielectric layer and configured for connecting the second circuit layer with the first circuit layer, the second conductive pillar being configured for connecting the embedded device with the second circuit layer.
    Type: Application
    Filed: August 22, 2023
    Publication date: May 9, 2024
    Applicant: Zhuhai ACCESS Semiconductor Co., LTD.
    Inventors: Xianming CHEN, Gao HUANG, Wenjian LIN, Yejie HONG, Benxia HUANG, Juchen HUANG
  • Publication number: 20240071852
    Abstract: A manufacturing method for an embedded flip chip package substrate includes laminating a first dielectric layer on the first line layer formed on a carrier plate, forming a first window on the first dielectric layer, filling a first copper post in the first window, forming a second window on the first dielectric layer, mounting a flip chip to the second window, sequentially stacking a packaging layer and a second dielectric layer covered with a first metal layer on the first dielectric layer, pressing a packaging layer encapsulating the first copper post and the flip chip and a second dielectric layer, curing the packaging layer, opening a hole through the first metal layer, the second dielectric layer and the packaging layer to form an interlayer conducting blind hole, forming a second line layer on the first metal layer, and removing the carrier plate to obtain a package substrate.
    Type: Application
    Filed: July 13, 2023
    Publication date: February 29, 2024
    Inventors: Xianming CHEN, Wenjian LIN, Gao HUANG, Benxia HUANG
  • Publication number: 20220053126
    Abstract: This application provides a photographing apparatus, an unmanned aerial vehicle (UAV), a control terminal, and a method for photographing. The photographing apparatus includes an image sensor, a display screen, a random-access memory (RAM), a storage device, a processor and an instruction stored in the memory and executable by the processor. The processor executes the instruction to implement: receiving a continuous-shooting command; partitioning the RAM according to the continuous-shooting command to obtain an at least one buffering storage space; controlling the image sensor to obtain original image data; storing the original image data in the at least one buffering storage space; and controlling the display screen to display image data generated according to original image data.
    Type: Application
    Filed: October 28, 2021
    Publication date: February 17, 2022
    Applicant: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Dongxiang ZHAO, Bo WANG, Wenjian HUANG, Chao ZHU
  • Patent number: 8948445
    Abstract: A two dimensional barcode containing encoded information can be embedded with an image with a high visual quality. The encoded information within the barcode is meaningful to machines, while the image is meaningful to humans. The two dimensional barcode embedded with the image is designed such that machines can decode the information encoded within the two dimensional barcode even with the distortion from the image. The subject application describes various systems, methods and devices that can facilitate embedding the image within the two dimensional barcode, detecting the two dimensional barcode embedded with the image within a practical environment, and decoding the encoded information from the two dimensional barcode even with the distortion from the image.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: February 3, 2015
    Assignee: The Hong Kong University of Science and Technology
    Inventors: Wai Ho Mow, Chi Yeung Au, Cheuk Yin Chiu, Ka Shun Li, Wenjian Huang
  • Publication number: 20130301870
    Abstract: A two dimensional barcode containing encoded information can be embedded with an image with a high visual quality. The encoded information within the barcode is meaningful to machines, while the image is meaningful to humans. The two dimensional barcode embedded with the image is designed such that machines can decode the information encoded within the two dimensional barcode even with the distortion from the image. The subject application describes various systems, methods and devices that can facilitate embedding the image within the two dimensional barcode, detecting the two dimensional barcode embedded with the image within a practical environment, and decoding the encoded information from the two dimensional barcode even with the distortion from the image.
    Type: Application
    Filed: May 2, 2013
    Publication date: November 14, 2013
    Inventors: Wai Ho Mow, Chi Yeung Au, Cheuk Yin Chiu, Ka Shun Li, Wenjian Huang