Abstract: A method for automatically sensing attack behaviors, the method including: distributing a service request from a network switch to a response module, where the response module includes a main controller configured for data interaction processing and an auxiliary controller configured for interactive data processing; generating, by the main controller and the auxiliary controller in the response module, respective response data according to the service request, respectively; and comparing the respective response data of the main controller with the respective response data of the auxiliary controller; if a result of comparison is inconsistent, indicating the network switch is abnormal, an administrator is informed, and the response data generated by the auxiliary controller is fed back to the network switch; and, if the result of comparison is consistent, the response data generated by the main controller is fed back to the network switch.

Abstract: A method for automatically sensing attack behaviors, the method including: distributing a service request from a network switch to a response module, where the response module includes a main controller configured for data interaction processing and an auxiliary controller configured for interactive data processing; generating, by the main controller and the auxiliary controller in the response module, respective response data according to the service request, respectively; and comparing the respective response data of the main controller with the respective response data of the auxiliary controller; if a result of comparison is inconsistent, indicating the network switch is abnormal, an administrator is informed, and the response data generated by the auxiliary controller is fed back to the network switch; and, if the result of comparison is consistent, the response data generated by the main controller is fed back to the network switch.

Abstract: The present disclosure provides a dual-energy detection apparatus and method. The dual-energy detection apparatus includes an X-ray source configured to send a first X-ray beam to an object to be measured; a scintillation detector configured to work in an integration mode, and receive a second X-ray beam penetrating through the object to be measured to generate a first electrical signal; a Cherenkov detector configured to be located behind the scintillation detector, work in a counting mode, and receive a third X-ray beam penetrating through the scintillation detector to generate a second electrical signal; and a processor configured to output image, thickness and material information of the object to be measured according to the first electrical signal and the second electrical signal. The dual-energy detection method provided by the present disclosure may acquire an image of the object to be measured that is clearer and contains more information.

Abstract: The present disclosure discloses an afterglow detection device and an afterglow detection method. The afterglow detection device comprises: an X-ray tube for emitting an X-ray beam; a first reading circuit for receiving a first detected signal from a to-be-detected detector to form and output a first measurement signal according to the first detected signal, the to-be-detected detector being connected to the first reading circuit and disposed on a beam-out side of the X-ray tube to receive radiation of the X-ray beam and outputting the first detected signal to the first reading circuit at the time of detection; a residual ray detector disposed on a beam-out side of the X-ray tube; a second reading circuit connected to the residual ray detector for receiving a second detected signal from the residual ray detector to form and output a second measurement signal according to the second detected signal.

Abstract: Embodiments of the present disclosure disclose a backside processing method for a back-illuminated photoelectric device. The backside processing method includes: mechanically thinning the back-illuminated photoelectric device such that a thickness of the back-illuminated photoelectric device reaches a first desired thickness; and chemically thinning and chemically polishing the back side of the mechanically thinned back-illuminated photoelectric device by using a nitric acid solution and a hydrofluoric acid solution such that the thickness of the mechanically thinned back-illuminated photoelectric device reaches a second desired thickness and a surface roughness of the back side of the back-illuminated photoelectric device reaches a desired surface roughness.

Abstract: Embodiments include herein are directed towards a method for electronic circuit design and more specifically towards determining return path quality in an electrical circuit. Embodiments may include providing, using a processor, an electronic circuit design and identifying at least one net associated with the electronic circuit design. Embodiments may further include extracting an ideal loop inductance for the at least one net and extracting a real loop inductance for the at least one net. Embodiments may also include calculating a return path quality factor based upon, at least in part, the ideal loop inductance and the real loop inductance.

Abstract: The present disclosure proposes a packaging structure for a metallic bonding based opto-electronic device and a manufacturing method thereof. According to the embodiments, the packaging structure for an opto-electronic device may comprise an opto-electronic chip and a packaging base. The opto-electronic chip comprises: a substrate having a first substrate surface and a second substrate surface opposite to each other; an opto-electronic device formed on the substrate; and electrodes for the opto-electronic device which are formed on the first substrate surface. The packaging base has a first base surface and a second base surface opposite to each other, and comprises conductive channels extending from the first base surface to the second base surface.

Abstract: The present disclosure discloses an afterglow detection device and an afterglow detection method. The afterglow detection device comprises: an X-ray tube for emitting an X-ray beam; a first reading circuit for receiving a first detected signal from a to-be-detected detector to form and output a first measurement signal according to the first detected signal, the to-be-detected detector being connected to the first reading circuit and disposed on a beam-out side of the X-ray tube to receive radiation of the X-ray beam and outputting the first detected signal to the first reading circuit at the time of detection; a residual ray detector disposed on a beam-out side of the X-ray tube; a second reading circuit connected to the residual ray detector for receiving a second detected signal from the residual ray detector to form and output a second measurement signal according to the second detected signal.

Abstract: The present disclosure provides a dual-energy detection apparatus and method. The dual-energy detection apparatus includes an X-ray source configured to send a first X-ray beam to an object to be measured; a scintillation detector configured to work in an integration mode, and receive a second X-ray beam penetrating through the object to be measured to generate a first electrical signal; a Cherenkov detector configured to be located behind the scintillation detector, work in a counting mode, and receive a third X-ray beam penetrating through the scintillation detector to generate a second electrical signal; and a processor configured to output image, thickness and material information of the object to be measured according to the first electrical signal and the second electrical signal. The dual-energy detection method provided by the present disclosure may acquire an image of the object to be measured that is clearer and contains more information.

Abstract: A radiation detector assembly and a method of manufacturing the same are provided. The radiation detector assembly includes a base and an outer encapsulation layer. The base includes a scintillator having a light-entering surface and a light-exiting surface on both ends thereof, respectively; a reflection layer provided on the light-entering surface and an outer peripheral surface of the scintillator; a photosensor comprising a photosensitive surface and an encapsulation housing, the photosensitive surface is coupled to the light-exiting surface via an optical adhesive; and an inner encapsulation layer adhered to an outer surface of the reflection layer and hermetically encapsulates a coupling portion where the scintillator and the photosensor connected with each other. The outer encapsulation layer is provided on the outer surface of the base.

Abstract: A radiation detector assembly and a method of manufacturing the same are provided. The radiation detector assembly includes a base and an outer encapsulation layer. The base includes a scintillator having a light-entering surface and a light-exiting surface on both ends thereof, respectively; a reflection layer provided on the light-entering surface and an outer peripheral surface of the scintillator; a photosensor comprising a photosensitive surface and an encapsulation housing, the photosensitive surface is coupled to the light-exiting surface via an optical adhesive; and an inner encapsulation layer adhered to an outer surface of the reflection layer and hermetically encapsulates a coupling portion where the scintillator and the photosensor connected with each other. the outer encapsulation layer is provided on the outer surface of the base.

Abstract: The present disclosure proposes a packaging structure for a metallic bonding based opto-electronic device and a manufacturing method thereof. According to the embodiments, the packaging structure for an opto-electronic device may comprise an opto-electronic chip and a packaging base. The opto-electronic chip comprises: a substrate having a first substrate surface and a second substrate surface opposite to each other; an opto-electronic device formed on the substrate; and electrodes for the opto-electronic device which are formed on the first substrate surface. The packaging base has a first base surface and a second base surface opposite to each other, and comprises conductive channels extending from the first base surface to the second base surface.

Abstract: The invention discloses a safety inspection detector and a goods safety inspection system. The safety inspection detector at least comprises a circuit board, a first housing, a second housing, a detection module and a connecting interface. The detection module and the connecting interface are mounted on the circuit board. The first housing is pressed and connected to a first surface of the circuit board, and the second housing is pressed and connected to a second surface of the circuit board. The first housing and the second housing can hermetically wrap the detection module and electronic devices on the circuit board, but bypass the connecting interface to realize leading-out and connection with related interconnected cables by utilizing the connecting interface. The housings can be used for sealing and protecting sensitive electronic devices in the detector, thus being moisture proof and preventing interference.

Abstract: A configuration method, detection method and equipment for control channels of a relay system are provided in the present invention. The configuration method comprises: the network side transmits a Relay-Physical Downlink Control Channel (R-PDCCH) of a control channel to its service relay equipment, the related control information of said relay equipment is included in said R-PDCCH, said R-PDCCH is a dedicated R-PDCCH of said relay equipment. In the present invention, the dedicated control channel of the relay system is configured according to the number of Orthogonal Frequency Division Multiplexing (OFDM) symbols occupied by a R-PDCCH, and the mapping from a R-PDDCH/Relay-Physical Downlink Shared Channel (R-PDSCH) to a Resource Element (RE), and the demand that one relay node dedicates a R-PDCCH is satisfied.

Abstract: A method for processing a ceramic scintillator array, characterized in that, comprising the following steps: (a) forming, in a first direction, a predetermined number of straight first-direction through-cuts which are parallel to each other and spaced from each other on a scintillator substrate by using laser; (b) adequately filling the first-direction through-cuts with an adhesive and solidifying the adhesive; (c) forming, in a second direction. a predetermined number of second direction through-cuts which are parallel to each other at a predetermined interval on the scintillator substrate by using laser, wherein the second direction is perpendicular to the first direction; and (d) adequately filling the second direction through-cuts with the adhesive and solidifying the adhesive bond.

Abstract: The invention provides formulations to prevent or treat decreasing platelet cell counts. The formulations essentially consist of peanut skins, papaya leaves, folic acid, vitamin B12, vitamin C, vitamin D, vitamin E, selenium, and iron. In some formulations, some vitamins are replaced by fruit or vegetable juice.

Abstract: The present disclosure is directed to a rapid process for the preparation of gadolinium oxysulfide having a general formula of Gd2O2S, referred to as GOS, scintillation ceramics by using the combination of spark plasma primary sintering (SPS) and hot isostatic pressing secondary sintering.

Abstract: The present disclosure is directed to a low cost sintering process for the preparation of gadolinium oxysulfide having a general formula of Gd2O2S, referred to as GOS, scintillation ceramics, comprising uniaxial hot pressing primary sintering and hot isostatic pressing secondary sintering.

Abstract: The invention discloses a safety inspection detector and a goods safety inspection system. The safety inspection detector at least comprises a circuit board, a first housing, a second housing, a detection module and a connecting interface. The detection module and the connecting interface are mounted on the circuit board. The first housing is pressed and connected to a first surface of the circuit board, and the second housing is pressed and connected to a second surface of the circuit board. The first housing and the second housing can hermetically wrap the detection module and electronic devices on the circuit board, but bypass the connecting interface to realize leading-out and connection with related interconnected cables by utilizing the connecting interface. The housings can be used for sealing and protecting sensitive electronic devices in the detector, thus being moisture proof and preventing interference.