Abstract: Methods and apparatuses implement a thermal memory effect for a solid state power controller. A solid state power controller trip apparatus with thermal memory according to one embodiment comprises: a trip module including a first capacitor (156) and a counter (174), wherein the first capacitor (156) charges multiple times, when an over current event occurs, and the counter (174) accumulates a count related to the charging of the first capacitor (156) for the multiple times, to detect a trip condition; and a discharging module connected to the trip module, the discharging module including a resistor (166) and a second capacitor (158), wherein an electrical parameter associated with the count decays with time using the resistor (166) and the second capacitor (158).

Abstract: A method and apparatuses detect arc faults. The apparatus according to one embodiment comprises: a master node (111) for digitally detecting a current signal and a voltage signal at a first point in a wiring system (131); a slave node (122) for digitally detecting a current signal and a voltage signal at a second point in the wiring system (131); and a detection unit for detecting an arc fault in the wiring system (131) by comparing the current signals from the master node (111) and from the slave node (122), and comparing the voltage signals from the master node (111) and from the slave node (122).

Abstract: Redundant functionality is implemented in a control of solid state power switching controller (SSPC) (1) to ensure that each power switching channel operates according to a default configuration in case of failure. Each power switching channel in the SSPC includes a solid state switching device (SSSD) (120) that is controlled by a supervisory controller (10) to perform power switching functions for a corresponding load. The SSPC further includes a nonvolatile memory device (44) that stores default commands for controlling the SSSDs in case the SSPC enters into a backup mode, e.g., due to a failure in the supervisory controller. The nonvolatile memory device may be assembled on the same SSPC circuit board as the power switching channels, thereby ensuring that backup control is performed locally in the SSPC device.