Patents by Inventor Wenjie CHENG

Wenjie CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240356487
    Abstract: A low-temperature bifacial photovoltaic (PV) module includes a backsheet of PV module. A junction box is provided on one side of the backsheet of PV module, and a glass panel, a solar panel and a thermoelectric module layer are provided successively on the other side of the backsheet of PV module. The thermoelectric module layer includes a plurality of p/n-type semiconductors arranged in an array to achieve direct conversion from thermal energy to electrical energy by utilizing a temperature difference between the p/n-type semiconductors and the PV module.
    Type: Application
    Filed: December 28, 2022
    Publication date: October 24, 2024
    Inventors: Bo Yang, Shujuan Wang, Qiong Wu, Lei Zhao, Hang Xi, Wenji Cheng, Kai Niu, Zengbo Liu, Taijiang Li
  • Publication number: 20240268832
    Abstract: An intratumor turbulent flow device, comprising: a turbulent flow disc of a double-layer metal wire braided structure, a developing mark is provided in the center of the turbulent flow disc, and metal wires in the center of the turbulent flow disc are fixed in the developing mark; a distal end of a release portion is connected to the developing mark; a pushing guide wire is connected to the turbulent flow disc through the release portion; and a microcatheter for transporting the turbulent flow disc. The pushing guide wire pushes, into a tumor cavity of an aneurysm along the microcatheter. The turbulent flow disc expands in the tumor cavity and is fitted to the inner wall of the tumor cavity. The release portion is broken restoring the center of the turbulent flow disc, and the developing mark is prevented from forming an embolism in the blood vessel.
    Type: Application
    Filed: November 2, 2021
    Publication date: August 15, 2024
    Inventors: Lei Mu, Hang Tang, Yongsong Xu, Wenjie Cheng, Fei Chen, Wenji Fan, Hongqing Zhang, Yongzhao Wu
  • Patent number: 11801759
    Abstract: Embodiments of the present disclosure provide an autonomous mobile robot and a walking method thereof. The autonomous mobile robot includes a machine body, a driving wheel assembly and an obstacle crossing assembly. The driving wheel assembly is rotatably arranged on the machine body through a first rotating shaft. The driving wheel assembly includes a driving wheel. When the driving wheel moves from a first position to a second position relative to the machine body, the obstacle crossing assembly applies a force to the driving wheel assembly to make a change amplitude of positive pressure between the driving wheel and a traveling surface less than or equal to a set threshold value.
    Type: Grant
    Filed: February 10, 2022
    Date of Patent: October 31, 2023
    Assignee: ECOVACS ROBOTICS CO., LTD.
    Inventors: Wenjie Cheng, Jie Hou
  • Patent number: 11758654
    Abstract: The present invention discloses a circuit substrate including an insulation layer; a metal layer disposed on a first surface of the insulation layer; and a first solder pad and a second solder pad disposed on a second surface of the insulation layer opposite the metal layer. Shortest distances between soldering dots on the metal layer and a projected area of the first solder pad on the metal layer are shorter than a distance threshold, the shortest distance being a minimum value of vertical distances between each of the soldering dots on the metal layer and a side edge of the projected area of the first solder pad on the metal layer. The soldering dots on the metal layer correspond one-to-one to soldering dots on a corresponding die; and the side edge is adjacent to a projected area of the second solder pad on the metal layer.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: September 12, 2023
    Assignee: BITMAIN DEVELOPMENT PTE. LTD.
    Inventors: Tong Zou, Wenjie Cheng
  • Publication number: 20220161665
    Abstract: Embodiments of the present disclosure provide an autonomous mobile robot and a walking method thereof. The autonomous mobile robot includes a machine body, a driving wheel assembly and an obstacle crossing assembly. The driving wheel assembly is rotatably arranged on the machine body through a first rotating shaft. The driving wheel assembly includes a driving wheel. When the driving wheel moves from a first position to a second position relative to the machine body, the obstacle crossing assembly applies a force to the driving wheel assembly to make a change amplitude of positive pressure between the driving wheel and a traveling surface less than or equal to a set threshold value.
    Type: Application
    Filed: February 10, 2022
    Publication date: May 26, 2022
    Applicant: ECOVACS ROBOTICS CO., LTD.
    Inventors: Wenjie CHENG, Jie HOU
  • Patent number: 11273714
    Abstract: Embodiments of the present disclosure provide an autonomous mobile robot and a walking method thereof. The autonomous mobile robot includes a machine body, a driving wheel assembly and an obstacle crossing assembly. The driving wheel assembly is rotatably arranged on the machine body through a first rotating shaft. The driving wheel assembly includes a driving wheel. When the driving wheel moves from a first position to a second position relative to the machine body, the obstacle crossing assembly applies a force to the driving wheel assembly to make a change amplitude of positive pressure between the driving wheel and a traveling surface less than or equal to a set threshold value.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: March 15, 2022
    Assignee: ECOVACS ROBOTICS CO., LTD.
    Inventors: Wenjie Cheng, Jie Hou
  • Patent number: 11152278
    Abstract: A heat sink for an integrated circuit chip. The heat sink includes a base plate and a plurality of fins connected to the base plate. The base plate includes a first segment, a second segment, and a third segment that are sequentially connected; and the first segment and the third segment extend obliquely upward relative to the second segment.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: October 19, 2021
    Assignee: Bitmain Technologies Inc.
    Inventors: Tong Zou, Micree Zhan, Wenjie Cheng
  • Publication number: 20210161011
    Abstract: The embodiments of the present disclosure discloses a circuit substrate, a chip, a series circuit, a circuit board, and an electronic device. The circuit substrate includes: an insulation layer; a metal layer disposed on a first surface of the insulation layer; and a first soldering pad and a second soldering pad disposed on a second surface of the insulation layer facing away from the metal layer. Shortest distances between soldering dots on the metal layer and a projected area of the first soldering pad on the metal layer are all smaller than a distance threshold. The soldering dots on the metal layer are one-to-one corresponding to soldering dots on a corresponding die. Compared with the existing technology, in the embodiments of the present disclosure, distances between the soldering dots on the metal layer and the projected area of the first soldering pad on the metal layer are substantially short, and a corresponding resistance is substantially small.
    Type: Application
    Filed: February 28, 2019
    Publication date: May 27, 2021
    Inventors: Tong ZOU, Wenjie CHENG
  • Publication number: 20200238836
    Abstract: Embodiments of the present disclosure provide an autonomous mobile robot and a walking method thereof. The autonomous mobile robot includes a machine body, a driving wheel assembly and an obstacle crossing assembly. The driving wheel assembly is rotatably arranged on the machine body through a first rotating shaft. The driving wheel assembly includes a driving wheel. When the driving wheel moves from a first position to a second position relative to the machine body, the obstacle crossing assembly applies a force to the driving wheel assembly to make a change amplitude of positive pressure between the driving wheel and a traveling surface less than or equal to a set threshold value.
    Type: Application
    Filed: January 21, 2020
    Publication date: July 30, 2020
    Applicant: ECOVACS ROBOTICS CO., LTD.
    Inventors: Wenjie CHENG, Jie HOU
  • Publication number: 20200235031
    Abstract: A heat sink for an integrated circuit chip. The heat sink includes a base plate and a plurality of fins connected to the base plate. The base plate includes a first segment, a second segment, and a third segment that are sequentially connected; and the first segment and the third segment extend obliquely upward relative to the second segment.
    Type: Application
    Filed: April 8, 2020
    Publication date: July 23, 2020
    Applicant: Bitmain Technologies Inc.
    Inventors: Tong ZOU, Micree ZHAN, Wenjie CHENG
  • Publication number: 20150307596
    Abstract: The invention provides processes for preparing purified cell-binding agent cytotoxic agent conjugates comprising subjecting a mixture comprising a cell-binding agent cytotoxic agent conjugate and one or more impurities to an ion exchange chromatography membrane to remove at least a portion of the impurities from the mixture, thereby providing a purified cell-binding agent cytotoxic agent conjugate.
    Type: Application
    Filed: October 4, 2013
    Publication date: October 29, 2015
    Inventors: Xinfang Li, Wenjie CHENG