Abstract: Disclosed is a method for inducing Iris domestica seed buds to generate polyploid, including the following steps: seed bud induction: inducing Iris domestica seeds at a low temperature, then soaking, sterilizing and germinating the same to obtain Iris domestica seed buds; and polyploid induction: soaking the obtained Iris domestica seed buds in oryzalin solution for polyploid induction to obtain mutagenized buds. In the present disclosure, the Iris domestica seed buds are treated by soaking with oryzalin to induce polyploid, and a total of 737 new germplasms of polyploid Iris domestica are obtained. The breeding has a short experimental period, simple operations, and high polyploid induction efficiency. At the same time, polyploids with large flowers, bright colors and strong plants are obtained. The method lays the foundations for the polyploid breeding of Iris domestica and the cultivation of new varieties of Iris domestica with large flower type and strong resistance.

Abstract: A touch substrate (01) and a touch display device. The touch substrate (01) includes: a base substrate (101); a plurality of first touch electrodes (102) located on the base substrate (101); a plurality of second touch electrodes (103) located on a side, facing away from the base substrate (101), of a layer where the first touch electrodes (102) are located and insulated from the first touch electrodes (102); and a plurality of floating electrodes (104) insulated from the plurality of first touch electrodes (102) and the plurality of second touch electrodes (103), and arranged on the same layer as at least one of the first touch electrodes (102) or the second touch electrodes (103). Each floating electrode (104) has a grid shape, and at least part of the floating electrodes (104) is disconnected at at least part of dots.

Abstract: A light-emitting diode driving backplane and a display apparatus are provided, and belong to the field of display technology. The light-emitting diode driving backplane includes: a base substrate divided into luminescent lamp regions and a first wiring region around the luminescent lamp regions; at least one pair of first connection pads, signal traces and an auxiliary functional component on the base substrate. The at least one pair of first connection pads and the auxiliary functional component are in the luminescent lamp regions, the signal traces are in the first wiring region, each pair of first connection pads includes a positive pad and a negative pad, and the signal traces are electrically connected to the corresponding positive negative pads for providing driving signals thereto, and the auxiliary functional component and at least some signal traces are in the same layer.

Abstract: The present disclosure provides a touch substrate having a touch electrode area and a peripheral area surrounding the touch electrode area. The touch substrate includes: a touch electrode layer in the touch electrode area and an electrostatic release structure in the peripheral area. The touch electrode layer includes touch electrodes and dummy electrodes alternately arranged along a first direction and separated from each other, the touch electrodes and the dummy electrodes extend along a second direction intersecting the first direction, the touch electrodes and the dummy electrodes both are conductive mesh structures, and the dummy electrode has a first end and a second end along the second direction and includes at least one conductive path that is continuous between the first end and the second end. The at least one conductive path is electrically connected to the electrostatic release structure.

Abstract: An array substrate includes connecting leads, a signal channel region extending in a first direction, a first power voltage lead, and a second power voltage lead. Any one of the signal channel region includes at least two control region columns extending in the first direction, and any one of the control region columns includes a plurality of control regions arranged along the first direction. Any one of the control regions includes a pad connecting circuit and a first pad group for bonding a microchip, the first pad group is electrically connected to the first power voltage lead. The pad connection circuit includes a plurality of second pad groups, and is provided with a first end electrically connected to the first pad group, and a second end electrically connected to the second power voltage lead.

Abstract: The disclosure relates to the field of battery technology, and provides a cell, a battery and an electric device. At least one end of the cell is provided with a tab group. The tab group includes a plurality of layers of tabs arranged sequentially outward from the center of the cell, and each layer of the plurality of layers of tabs surround the center of the cell. Each layer of the plurality of layers of tabs includes a plurality of sub-tabs, a slit is provided between two adjacent sub-tabs in each layer of the plurality of layers of tabs, and the slits in two adjacent layers of the plurality of layers of tabs are misaligned, which is conducive to the flattening of the tabs and makes the tabs less likely to wrinkle, and in turn will not easily lead to poor welding between the tabs and the connecting member.

Abstract: Disclosed in the present application are a method for identifying the species of a eukaryotic sample on the basis of whole genome analysis, and the use thereof, wherein the species identification of a sample to be detected is achieved by means of a species-specific target sequence obtained by screening. The species identification method of the present invention has good specificity, high sensitivity and good repeatability, and can achieve rapid species identification without relying on large-scale professional instruments.

Abstract: A fast harmless treatment device for a hazardous flexible material is provided. The fast harmless treatment device includes a container body and a container lid, where a bottom plate is fixed at a near-bottom position of the container body; a movable plate is provided in the container body; there is a gap between an outer edge of the movable plate and an inner wall of the container body; a movement mechanism is configured to compress a hazardous flexible material on the movable plate towards the container lid; the container lid and the movable plate each are provided therein with a heating tube; and a heating tube and a blowing device are provided on the bottom plate to cause high-temperature convection and disinfect an aerosol-mixed gas.

Abstract: The present disclosure provides a thin film sensor and a method for preparing a thin film sensor. The thin film sensor includes: a base substrate; a first conductive mesh on the base substrate; where the first conductive mesh includes first metal wires arranged side by side along a first direction and each extending in a second direction, and second metal wires each extending in a third direction; and the first metal wires intersect with the second metal wires; and a second conductive mesh on a side of the first conductive mesh away from the base substrate; where the second conductive mesh includes first transparent conductive wires arranged side by side along the first direction and each extending in the second direction, and second transparent conductive wires each extending in the third direction; and the first transparent conductive wires intersect with the second transparent conductive wires.

Abstract: An array substrate includes connecting leads, a signal channel region extending in a first direction, a first power voltage lead, and a second power voltage lead. Any one of the signal channel region includes at least two control region columns extending in the first direction, and any one of the control region columns includes a plurality of control regions arranged along the first direction. Any one of the control regions includes a pad connecting circuit and a first pad group for bonding a microchip, the first pad group is electrically connected to the first power voltage lead. The pad connection circuit includes a plurality of second pad groups, and is provided with a first end electrically connected to the first pad group, and a second end electrically connected to the second power voltage lead.

Abstract: The present disclosure provides a thin film sensor and a method for preparing a thin film sensor. The thin film sensor includes: a base substrate; a first conductive mesh on the base substrate; where the first conductive mesh includes first metal wires arranged side by side along a first direction and each extending in a second direction, and second metal wires each extending in a third direction; and the first metal wires intersect with the second metal wires; and a second conductive mesh on a side of the first conductive mesh away from the base substrate; where the second conductive mesh includes first transparent conductive wires arranged side by side along the first direction and each extending in the second direction, and second transparent conductive wires each extending in the third direction; and the first transparent conductive wires intersect with the second transparent conductive wires.

Abstract: This application provides a display apparatus and an electronic device. A transparent dielectric layer is added to the display apparatus, metal is deposited on the transparent dielectric layer, to form a metal grid, and a part of the metal grid is used as a radiator of an antenna structure. After an antenna is integrated into the display apparatus, through optimization of an optical design, the metal grid may meet a requirement for optical transmittance, and display effect is not obviously affected. In addition, because the antenna structure is integrated into the display apparatus, coverage space of a wireless signal is increased. This avoids occurrence of a signal blind region, so that the electronic device has a more reliable connection in a millimeter-wave band, to meet a communication requirement.

Abstract: A light-emitting substrate and a display apparatus, comprising: a base substrate; a first electrically conductive layer, located on the base substrate, the fit electrically conductive layer comprising multiple common voltage lines and multiple first connection lines spaced apart from each other, and the multiple common voltage lines extending along a first direction and being arranged along a second direction; a first insulating layer, located at a side of the first electrically conductive layer distant from the base substrate; and a second electrically conductive layer, located at a side of the first insulating layer distant from the base substrate. The second electrically conductive layer comprises multiple first bridge parts spaced apart from each other.

Abstract: A driving backplane, a manufacturing method thereof, a light-emitting substrate are provided. In the driving backplane, a first conductive layer on a substrate; a first organic film layer is between the first conductive layer and second conductive layer, the first organic film layer has first via holes; a first inorganic film layer is on one side of first organic film layer away from the substrate; the second conductive layer is on one side of first inorganic film layer away from first organic film layer, the second conductive layer and the first conductive layer are connected through the first via holes; orthographic projections of the first conductive layer and second conductive layer have an overlapping region, the overlapping region includes a region including orthographic projection of the first via holes, and a first region, an orthographic projection of the first inorganic film layer covers parts of the first region.

Abstract: An array substrate includes: a substrate, a first conductive layer, a second conductive layer and at least two organic insulating layers; the first conductive layer is provided on a side of the substrate; the second conductive layer is provided on a side of the first conductive layer away from the substrate, and an orthographic projection of the second conductive layer on the substrate has an overlapped region with an orthographic projection of the first conductive layer on the substrate, the overlapped region includes a via region and a routing region; the at least two organic insulating layers are provided between the first conductive layer and the second conductive layer, and an orthographic projection of the at least two organic insulating layers on the substrate is overlapped with an orthographic projection of the routing region.

Abstract: A light emitting substrate (100) and a display device are provided. The light emitting substrate (100) includes a light emitting region (110) and a border region (160). The light emitting substrate (100) includes a base (10), and a plurality of light emitting units (102) and a plurality of signal lines (30) located on the base (10). The light emitting units (102) are located in the light emitting region (110), and each includes a driving circuit (103) and at least one light emitting element (104). The plurality of light emitting units (102) are arranged into M rows along a first direction (D1) and into N columns along a second direction (D2) intersecting the first direction (D1).

Abstract: A touch substrate (01) and a touch display device. The touch substrate (01) includes: a base substrate (101); a plurality of first touch electrodes (102) located on the base substrate (101); a plurality of second touch electrodes (103) located on a side, facing away from the base substrate (101), of a layer where the first touch electrodes (102) are located and insulated from the first touch electrodes (102); and a plurality of floating electrodes (104) insulated from the plurality of first touch electrodes (102) and the plurality of second touch electrodes (103), and arranged on the same layer as at least one of the first touch electrodes (102) or the second touch electrodes (103). Each floating electrode (104) has a grid shape, and at least part of the floating electrodes (104) is disconnected at at least part of dots.

Abstract: Provided are a driving backplane and a method for manufacturing the same, a display device. The method includes: forming a first conductive pattern including signal lines; forming an insulating layer having via holes; forming a second conductive pattern including pairs of coupling electrodes; sequentially forming an inorganic material layer and an organic material layer; performing step exposure and developing on the organic material layer to form an intermediate pattern including a hollow-out portion, a completely-reserved portion and a half-reserved portion; the completely-reserved portion is thicker than the half-reserved portion, a thickness of the half-reserved portion is x times that of the inorganic material layer; etching the inorganic material layer and the intermediate pattern until a part of the inorganic material layer, corresponding to the hollow-out portion, is removed; an etching selection ratio of the inorganic material layer to the intermediate pattern is 1:y, 0<x?y.

Abstract: Disclosed are a touch substrate and a preparation method thereof, and a touch apparatus. The touch substrate includes an electrostatic transmission layer, a first insulating layer, a first conductive layer, a second insulating layer, and a second conductive layer which are sequentially stacked, wherein the first conductive layer includes a first touch electrode, the second conductive layer includes a second touch electrode and a second dummy electrode which are insulated from each other, and the second dummy electrode is electrically connected to the electrostatic transmission layer by means of a via penetrating the first insulating layer and the second insulating layer; and/or, the first conductive layer further includes a plurality of first dummy electrodes insulated from one another, and the first dummy electrode and the first touch electrode are insulated from each other.