Patents by Inventor Wen-Jin Huang

Wen-Jin Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230223354
    Abstract: A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.
    Type: Application
    Filed: March 14, 2023
    Publication date: July 13, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei Da LIN, Meng-Jen WANG, Hung Chen KUO, Wen Jin HUANG
  • Patent number: 11605598
    Abstract: A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: March 14, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wei Da Lin, Meng-Jen Wang, Hung Chen Kuo, Wen Jin Huang
  • Publication number: 20210327822
    Abstract: A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.
    Type: Application
    Filed: April 17, 2020
    Publication date: October 21, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei Da LIN, Meng-Jen WANG, Hung Chen KUO, Wen Jin HUANG
  • Publication number: 20080211509
    Abstract: A system for monitoring the battery capacitor is disclosed. The system comprises an ADC (analog to digital converter), a CPU, a ROM, a clock generator, a SMbus (smart management bus) interface. A series of RTC interrupt signals are generated by the clock generator and feeds to the CPU. When the CPU receives a RTC interrupt, the CPU runs a program in said ROM to calculate the remaining capacity of the battery and stores it into register or RAM according to the digital signal outputs from the ADC, which converts an analog signal of the battery into a digital signal. The SM bus interface then fetches the calculated results from the CPU and displays them by LED in terms of lighting, dark and flashing.
    Type: Application
    Filed: March 2, 2007
    Publication date: September 4, 2008
    Inventors: Chang-Yu Ho, Wen-Jin Huang