Patents by Inventor Wenjun Ben Cao

Wenjun Ben Cao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220077455
    Abstract: An electrode active layer is disclosed that includes a network of high aspect ratio carbon elements (e.g., carbon nanotubes, carbon nanotube bundles, graphene flakes, or the like) that provides a highly electrically conductive scaffold that entangles or enmeshes the active material, thereby supporting the layer. A surface treatment can be applied to the high aspect ratio carbon elements to promote adhesion to the active material and any underlying electrode layers improving the overall cohesion and mechanical stability of the active layer. This surface treatment forms only a thin (in some cases even monomolecular) layer on the network, leaving the large void spaces that are free of any bulk binder material and so may instead be filled with active material. The resulting active layer may be formed with excellent mechanical stability even at large thickness and high active material mass loading.
    Type: Application
    Filed: December 7, 2020
    Publication date: March 10, 2022
    Inventors: Nicolo Brambilla, Jin Yan, Ki T. Park, Ting Du, Xujie Chen, Wenjun Ben Cao
  • Publication number: 20210265634
    Abstract: An electrode active layer is disclosed that includes a network of high aspect ratio carbon elements (e.g., carbon nanotubes, carbon nanotube bundles, graphene flakes, or the like) that provides a highly electrically conductive scaffold that entangles or enmeshes the active material, thereby supporting the layer. A surface treatment can be applied to the high aspect ratio carbon elements to promote adhesion to the active material and any underlying electrode layers improving the overall cohesion and mechanical stability of the active layer. This surface treatment forms only a thin (in some cases even monomolecular) layer on the network, leaving the large void spaces that are free of any bulk binder material and so may instead be filled with active material. The resulting active layer may be formed with excellent mechanical stability even at large thickness and high active material mass loading.
    Type: Application
    Filed: May 10, 2021
    Publication date: August 26, 2021
    Inventors: Nicolo Brambilla, Jin Yan, Ki T. Park, Ting Du, Xujie Chen, Wenjun Ben Cao