Patents by Inventor Wenjun Bill Chen

Wenjun Bill Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit chip test adapter
    Patent number: 6727717
    Abstract: An apparatus for testing an integrated circuit chip includes a printed circuit device having connector pads, contacts, and traces extending between at least some of the connector pads and the contacts. The printed circuit device has openings therethrough, intersecting the contacts, that are adapted to receive the pins extending from the integrated circuit chip so that the contacts may electrically contact the pins extending from the integrated circuit chip. The apparatus further includes a connector electrically interconnected with at least some of the connector pads. The apparatus is adapted to be disposed between the integrated circuit chip and a chip socket, such that the pins extending from the integrated circuit chip may be inserted through the printed circuit device and into the chip socket.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: April 27, 2004
    Assignee: Sun Microsystems, Inc.
    Inventors: David J. Kim, Anthony Kozaczuk, Wenjun Bill Chen
  • Integrated circuit chip test adapter
    Publication number: 20030057983
    Abstract: An apparatus for testing an integrated circuit chip includes a printed circuit device having connector pads, contacts, and traces extending between at least some of the connector pads and the contacts. The printed circuit device has openings therethrough, intersecting the contacts, that are adapted to receive the pins extending from the integrated circuit chip so that the contacts may electrically contact the pins extending from the integrated circuit chip. The apparatus further includes a connector electrically interconnected with at least some of the connector pads. The apparatus is adapted to be disposed between the integrated circuit chip and a chip socket, such that the pins extending from the integrated circuit chip may be inserted through the printed circuit device and into the chip socket.
    Type: Application
    Filed: September 27, 2001
    Publication date: March 27, 2003
    Inventors: David J. Kim, Anthony Kozaczuk, Wenjun Bill Chen