Patents by Inventor Wenjun Chen

Wenjun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110059124
    Abstract: This invention discloses a kind of quality control method and application of Ganoderma lucidium spore oil fat emulsion. Which includes Ganoderma lucidium spore oil 2˜25%, emulsifier 0.5˜10%, isosmotic agent 0.2˜5%, the remaining content is water and the final pH of Fat emulsion is adjusted to 6˜9. The quality control method of this invention can accurately determine the content of 1,2-oleic-3-palmitic triglyceride and glycerol trioleate in the preparation, and accurately determine the ergosterol content, which serves as the method and basis for quality control of this product. Fingerprints are utilized to grasp the product quality from the overall characteristics of Chromatogram. This invention has clearly defined active ingredients, with excellent bioactivity, and is capable of tumor treatment, while improving the organism's immunity, as well as the life quality of tumor patients undergoing radiotherapy and chemotherapy, and relieving the drug toxicity after treatment.
    Type: Application
    Filed: February 26, 2008
    Publication date: March 10, 2011
    Applicant: Guangzhou Hanfang Natural Medicine Research & Development Co.Ltd
    Inventors: Lulin Chen, Fahuan Ge, Wenjun Chen, Ronghua Zeng, Genghai Meng, Aishao Zhang, Qingshui Lai, Zhaojian Jiang
  • Publication number: 20100262744
    Abstract: A device includes a connector having first and second signal pins adapted to, when the connector is being connected to a mating connector of another device, make a first connection using the first signal pin prior to making a second connection using the second signal pin, a first circuit operatively coupled to the first signal pin and configured to identify at least three pre-determined signal patterns receivable from the another device using the first connection, wherein each of the at least three pre-determined signal patterns corresponds to one of at least three pre-determined interface protocols, and a second circuit operatively coupled to the first circuit and the second signal pin, wherein the second circuit is configured, responsive to the first circuit identifying a pre-determined signal pattern of the at least three pre-determined signal patterns, to interface with the another device using at least the second signal pin, wherein to interface with the another device is according to a pre-determined in
    Type: Application
    Filed: April 14, 2009
    Publication date: October 14, 2010
    Applicant: SUN MICROSYSTEMS, INC.
    Inventors: Shailendra Deva, Richard A. Raffel, Wenjun Chen, Martin S. Mok
  • Patent number: 7814255
    Abstract: A device includes a connector having first and second signal pins adapted to, when the connector is being connected to a mating connector of another device, make a first connection using the first signal pin prior to making a second connection using the second signal pin, a first circuit operatively coupled to the first signal pin and configured to identify at least three pre-determined signal patterns receivable from the another device using the first connection, wherein each of the at least three pre-determined signal patterns corresponds to one of at least three pre-determined interface protocols, and a second circuit operatively coupled to the first circuit and the second signal pin, wherein the second circuit is configured, responsive to the first circuit identifying a pre-determined signal pattern of the at least three pre-determined signal patterns, to interface with the another device using at least the second signal pin, wherein to interface with the another device is according to a pre-determined in
    Type: Grant
    Filed: April 14, 2009
    Date of Patent: October 12, 2010
    Assignee: Oracle America, Inc.
    Inventors: Shailendra Deva, Richard A. Raffel, Wenjun Chen, Martin S. Mok
  • Patent number: 7036027
    Abstract: Disclosed are novel methods and apparatus for provision of efficient, effective, and/or flexible computer system layout and/or cooling configuration. In accordance with an embodiment of the present invention, a method of cooling a computer system is disclosed. The computer system may include a plurality of heat generating electrical components that require cooling. The method includes: providing at least two cooling fans arranged front to back of the computer system to create a push (inlet) and pull (outlet) airflow to cool the computer system and providing a plurality of temperature sensors located at various locations within the computer system to sense a local temperature.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: April 25, 2006
    Assignee: Sun Microsystems, Inc.
    Inventors: David K. Kim, William W. Ruckman, Anthony Kozaczuk, Wenjun Chen, Talal J. Ahwal
  • Patent number: 6909043
    Abstract: A method and apparatus for providing an EMI seal in a system chassis. The EMI seal is provided by a bezel assembly for a storage medium drive. The bezel assembly includes a front bezel having an aperture through which a tray can extend for loading and unloading of the storage medium drive, and a tray bezel attached to the tray. Attached to the front bezel is an electrically conductive link. Both the front bezel and the tray bezel include an electrically conductive inner surface. Upon closing the tray, the electrically conductive link provides an electrical connection between the inner surface front bezel and the inner surface of the tray bezel.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: June 21, 2005
    Assignee: Sun Microsystems, Inc.
    Inventors: David K. Kim, William W. Ruckman, Wenjun Chen
  • Publication number: 20040140548
    Abstract: Disclosed are novel methods and apparatus for provision of a modular debugger to adapt various chip sizes and/or signal analyzers. In an embodiment of the present invention, an integrated circuit (IC) assembly is disclosed. The IC assembly includes: a printed circuit board (PCB); a plurality of flex circuit connections electrically coupled to the PCB; a carrier electrically coupled to the PCB; a socket electrically coupled to the carrier; an application specific IC (ASIC) electrically coupled to the socket; and a PCB adapter card electrically couplable to at least one of the plurality of flex circuit connections. In another embodiment of the present invention, the PCB adapter card may include at least one connector to provide a communication channel between the ASIC and a signal analyzer.
    Type: Application
    Filed: January 22, 2003
    Publication date: July 22, 2004
    Inventors: Wenjun Chen, William W. Ruckman, David K. Kim
  • Publication number: 20040090768
    Abstract: A reflection mechanism for illuminating insignia on a computer system is provided. The reflection mechanism uses one or more angled reflectors that diffuse light through transparent insignia provided in the housing of the computer system. Such use of angled reflectors reduces hot spots typically attributable to direct light projection and provides uniform illumination of the transparent portions of the insignia.
    Type: Application
    Filed: November 8, 2002
    Publication date: May 13, 2004
    Inventors: David K.J. Kim, Milton C. Lee, Russell Brovald, William W. Ruckman, Wenjun Chen
  • Publication number: 20040075982
    Abstract: Disclosed are novel methods and apparatus for provision of a heat dissipation device with improved EMI suppression characteristics. In accordance with an embodiment of the present invention, an apparatus is disclosed. The apparatus may include a printed circuit board, which forms at least one grounding pad and at least one mounting hole. The apparatus may further include an integrated circuit, a heat dissipation device mounted on the integrated circuit, and a frame mounted on the printed circuit board through the mounting hole. The frame may include at least one frame leg in electrical contact with the grounding pad. The frame may form an electromagnetic interference (EMI) shield to limit an EMI leakage generated by the integrated circuit.
    Type: Application
    Filed: October 21, 2002
    Publication date: April 22, 2004
    Inventors: David K. Kim, William W. Ruckman, Wenjun Chen, James H. Poore
  • Publication number: 20040075981
    Abstract: Disclosed are novel methods and apparatus for provision of efficient, effective, and/or flexible computer system layout and/or cooling configuration. In accordance with an embodiment of the present invention, a method of cooling a computer system is disclosed. The computer system may include a plurality of heat generating electrical components that require cooling. The method includes: providing at least two cooling fans arranged front to back of the computer system to create a push (inlet) and pull (outlet) airflow to cool the computer system and providing a plurality of temperature sensors located at various locations within the computer system to sense a local temperature.
    Type: Application
    Filed: October 21, 2002
    Publication date: April 22, 2004
    Inventors: David K. Kim, William W. Ruckman, Anthony Kozaczuk, Wenjun Chen, Talal J. Ahwal
  • Patent number: 6627812
    Abstract: The present invention discloses methods and apparatus for installing printed circuit boards within an electronic assembly. One embodiment of the present invention is an electro-magnetic interference shielding apparatus for an electronic assembly comprising a shielding partition that separates a first compartment from a second compartment. The apparatus further comprises a top enclosure capable of engaging with the shielding partition to form a plurality of contact seams. The contact seams are capable of restricting electro-magnetic interference from passing through the shielding apparatus. The top enclosure can be capable of tool-free installation and removal to provide access to the interior of the electronic assembly.
    Type: Grant
    Filed: August 24, 2001
    Date of Patent: September 30, 2003
    Assignee: Sun Microsystems, Inc.
    Inventors: David K.J. Kim, William W. Ruckman, Anthony R. Fredericksson, Wenjun Chen
  • Publication number: 20030037941
    Abstract: The present invention discloses methods and apparatus for installing printed circuit boards within an electronic assembly. One embodiment of the present invention is an electro-magnetic interference shielding apparatus for an electronic assembly comprising a shielding partition that separates a first compartment from a second compartment. The apparatus further comprises a top enclosure capable of engaging with the shielding partition to form a plurality of contact seams. The contact seams are capable of restricting electro-magnetic interference from passing through the shielding apparatus. The top enclosure can be capable of tool-free installation and removal to provide access to the interior of the electronic assembly.
    Type: Application
    Filed: August 24, 2001
    Publication date: February 27, 2003
    Inventors: David K.J. Kim, William W. Ruckman, Anthony R. Fredericksson, Wenjun Chen