Patents by Inventor Wenjun CUI

Wenjun CUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113068
    Abstract: A method for forming an ultrafine-pitch all-copper interconnect structure is provided. Nano-copper particles are mixed with a solvent, a dispersant and a viscosity modifier to prepare a nano-copper paste. A chip with a preset number of copper pillars having a preset diameter and a substrate are selected, cleaned and pretreated. The chip is sucked and flipped by a bonding machine to make the copper pillars face outward. The chip is sucked through a suction nozzle of the bonding machine and dipped in the nano-copper paste. A protective gas is fed, and the copper pillars are aligned with copper pads on the substrate through an optical system of the bonding machine, bonded with the substrate at a preset pressure and temperature under ultrasonication, and cooled at room temperature to obtain the interconnect structure. An ultrafine-pitch all-copper interconnect structure fabricated by the method is also provided.
    Type: Application
    Filed: November 2, 2023
    Publication date: April 4, 2024
    Inventors: Yu ZHANG, Ranyuan ZHANG, Junyu HE, Wenjun HUANG, Chengqiang CUI, Guannan YANG
  • Patent number: 11365260
    Abstract: An agonistic 4-1BB monoclonal antibody or an antigen binding fragment thereof, comprising a heavy chain variable region and a light chain variable region, the heavy chain variable region comprising: a CDR1 region having an amino acid sequence as shown in SEQ ID NO: 1, a CDR2 region having an amino acid sequence as shown in SEQ ID NO: 2, and a CDR3 region having an amino acid sequence as shown in SEQ ID NO: 3, the light chain variable region comprising: a CDR1 region having an amino acid sequence as shown in SEQ ID NO: 4, a CDR2 region having an amino acid sequence as shown in SEQ ID NO: 5, and a CDR3 region having an amino acid sequence as shown in SEQ ID NO: 6. The monoclonal antibody is targeted towards h4-1BB, and specifically binds to h4-1BB to activate T cells for treatment of a variety of cancers.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: June 21, 2022
    Assignee: REYOUNG (SUZHOU) BIOLOGY SCIENCE & TECHNOLOGY CO., LTD
    Inventors: Wenjun Cui, Shuhua Guo
  • Publication number: 20210261658
    Abstract: Provided are an anti-human claudin 18.2 monoclonal antibody and application thereof. The antibody has three heavy chain complementarity-determining regions (heavy chain CDR1, heavy chain CDR2, and heavy chain CDR3) and three light chain complementarity-determining regions (light chain CDR1, light chain CDR2, and light chain CDR3).
    Type: Application
    Filed: August 21, 2019
    Publication date: August 26, 2021
    Inventors: Yanyan WU, Wenjun CUI, Chenfei HU
  • Publication number: 20200325236
    Abstract: An agonistic 4-1BB monoclonal antibody or an antigen binding fragment thereof, comprising a heavy chain variable region and a light chain variable region, the heavy chain variable region comprising: a CDR1 region having an amino acid sequence as shown in SEQ ID NO: 1, a CDR2 region having an amino acid sequence as shown in SEQ ID NO: 2, and a CDR3 region having an amino acid sequence as shown in SEQ ID NO: 3, the light chain variable region comprising: a CDR1 region having an amino acid sequence as shown in SEQ ID NO: 4, a CDR2 region having an amino acid sequence as shown in SEQ ID NO: 5, and a CDR3 region having an amino acid sequence as shown in SEQ ID NO: 6. The monoclonal antibody is targeted towards h4-1BB, and specifically binds to h4-1BB so as to activate T cells. The monoclonal antibody has application potential for treating a variety of cancers by means of an immunomodulatory effect.
    Type: Application
    Filed: November 21, 2018
    Publication date: October 15, 2020
    Applicant: REYOUNG (SUZHOU) BIOLOGY SCIENCE & TECHNOLOGY CO., LTD
    Inventors: Wenjun CUI, Shuhua GUO