Abstract: This application relates to the field of electronic component technologies, and to a ferrite bead, a bias circuit, an optical module, and a communication device. The ferrite bead includes: a ferrite bead body, a first fastening terminal, a second fastening terminal, and an external terminal. The first fastening terminal and the second fastening terminal are connected to the ferrite bead body, and the first fastening terminal and the second fastening terminal are configured to fasten the ferrite bead body. The ferrite bead body includes a coil structure, and the coil structure has a first electrical connection end and a second electrical connection end. At least one of the first electrical connection end and the second electrical connection end is electrically connected to the external terminal. An area of the external terminal is less than an area of the first fastening terminal and an area of the second fastening terminal.

Abstract: A transmitter circuit, an optical module, and a communications device is disclosed. A transmitter circuit includes a driver and a directly modulated laser DML. A positive electrode of the driver is connected to a positive electrode of the DML, a negative electrode of the DML is connected to a voltage terminal, and the negative electrode of the DML is connected to a ground terminal through a capacitor. The driver is configured to generate a drive current based on an input signal, and output the drive current to the DML through the positive electrode of the driver. The DML inputs a first part of current of the drive current to the ground terminal through the capacitor, and the DML inputs a second part of current of the drive current to the voltage terminal.

Abstract: A transmitter circuit, an optical module, and a communications device is disclosed. A transmitter circuit includes a driver and a directly modulated laser DML. A positive electrode of the driver is connected to a positive electrode of the DML, a negative electrode of the DML is connected to a voltage terminal, and the negative electrode of the DML is connected to a ground terminal through a capacitor. The driver is configured to generate a drive current based on an input signal, and output the drive current to the DML through the positive electrode of the driver. The DML inputs a first part of current of the drive current to the ground terminal through the capacitor, and the DML inputs a second part of current of the drive current to the voltage terminal.

Abstract: Embodiments of this application disclose an optoelectronic component and a fabrication method thereof. The optoelectronic component includes a capacitor, an inductor, a carrier component, and an optoelectronic element, where the capacitor, the inductor, and the optoelectronic element are all disposed on the carrier component. The inductor and the capacitor are configured to form a resonant circuit, where a resonance frequency of the resonant circuit is correlated with a signal output frequency of the optoelectronic element. A first electrode of the optoelectronic element is connected to a first electrode of the carrier component through the inductor, and a second electrode of the optoelectronic element is connected to a second electrode of the carrier component. A first electrode of the capacitor is connected to the first electrode of the carrier component, and a second electrode of the capacitor is connected to the second electrode of the carrier component.

Abstract: Systems and methods that facilitate resistance and capacitance balancing are presented. In one embodiment, a system comprises: a plurality of ground lines configured to ground components; and a plurality of signal bus lines interleaved with the plurality of ground lines, wherein the interleaving is configured so that plurality of signal bus lines and plurality of ground lines are substantially evenly spaced and the plurality of signal bus lines convey a respective plurality of signals have similar resistance and capacitance constants that are balanced. The plurality of signals can see a substantially equal amount ground surface and have similar amounts of capacitance. The plurality of signal bus lines can have similar cross sections and lengths with similar resistances. The plurality of signal bus lines interleaved with the plurality of ground lines can be included in a two copper layer interposer design with one redistribution layer (RDL).

Abstract: In one embodiment, a system comprises: a plurality of aggressor bus lines; and a plurality of differential pair bus lines that are located in relatively parallel close proximity to the plurality of aggressor bus lines, wherein at least two of the plurality of differential pair bus lines change location with respect to each other at a point that has a cancelling affect on cross talk from the plurality of aggressor bus lines, wherein the change includes cross over routing. The plurality of differential pair bus lines can convey differential clock signals. The routing of the plurality of differential pair bus lines is substantially parallel to one another before and after the change.

Abstract: In one embodiment, a system comprises: a plurality of aggressor bus lines; and a plurality of differential pair bus lines that are located in relatively parallel close proximity to the plurality of aggressor bus lines, wherein at least two of the plurality of differential pair bus lines change location with respect to each other at a point that has a cancelling affect on cross talk from the plurality of aggressor bus lines, wherein the change includes cross over routing. The plurality of differential pair bus lines can convey differential clock signals. The routing of the plurality of differential pair bus lines is substantially parallel to one another before and after the change.

Abstract: Systems and methods that facilitate resistance and capacitance balancing are presented. In one embodiment, a system comprises: a plurality of ground lines configured to ground components; and a plurality of signal bus lines interleaved with the plurality of ground lines, wherein the interleaving is configured so that plurality of signal bus lines and plurality of ground lines are substantially evenly spaced and the plurality of signal bus lines convey a respective plurality of signals have similar resistance and capacitance constants that are balanced. The plurality of signals can see a substantially equal amount ground surface and have similar amounts of capacitance. The plurality of signal bus lines can have similar cross sections and lengths with similar resistances. The plurality of signal bus lines interleaved with the plurality of ground lines can be included in a two copper layer interposer design with one redistribution layer (RDL).