Abstract: The present disclosure provides a processing chamber applied to semiconductor processing equipment, including a transfer chamber and a plurality of reaction chambers above the transfer chamber. The plurality of reaction chambers are all communicatively connected to the transfer chamber through bottom openings. A plurality of bases can ascend and descend between the reaction chambers and the transfer chamber. The processing chamber further includes a transfer mechanism and a carrier mechanism arranged in the transfer chamber. The transfer mechanism is configured to transfer wafers from outside the processing chamber to the carrier mechanism or onto the plurality of bases, and to transfer the wafers on the plurality of bases out of the processing chamber. The carrier mechanism is configured to carry the plurality of wafers and can transfer the plurality of wafers carried by the carrier mechanism onto the plurality of bases.