Patents by Inventor Wen Ke Huang

Wen Ke Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation module with heat pipe
    Patent number: 9257362
    Abstract: A heat dissipation module configured on a substrate having a heat producing element thereon includes a holder configured on the substrate and a heat sink having a base opposite to the heat producing element and pivotally connected to the holder and capable of joining to the substrate with the heat producing element covered by the base.
    Type: Grant
    Filed: July 19, 2013
    Date of Patent: February 9, 2016
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Wen Chi Hung, Tung Lin Tsai, Wen Ke Huang, Bo Han Huang, Tzu Chun Su
  • HEAT DISSIPATION MODULE WITH HEAT PIPE
    Publication number: 20140321059
    Abstract: A heat dissipation module configured on a substrate having a heat producing element thereon includes a holder configured on the substrate and a heat sink having a base opposite to the heat producing element and pivotally connected to the holder and capable of joining to the substrate with the heat producing element covered by the base.
    Type: Application
    Filed: July 19, 2013
    Publication date: October 30, 2014
    Inventors: Wen Chi Hung, Tung Lin TSAI, Wen Ke Huang, Bo Han Huang, Tzu Chun Su