Patents by Inventor Wen-Long Liu

Wen-Long Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-functional detachable and replaceable wire bonding heating plate
    Patent number: 9165903
    Abstract: A multi-functional detachable and replaceable wire bonding heating plate is provided with a heat blocking layer, a heating layer, a heat equalization layer, and a top layer. The bottom of the heat blocking layer has a recessed portion and the heating layer is disposed on top of the heat blocking layer. The heat equalization layer is disposed on top of the heating layer. A detachable and replaceable top layer is disposed on top of the heat equalization layer wherein a protruding support block is disposed on top of the top layer. The heat equalization layer and the top layer can be securely bonded to each other by the attraction force method, the engaging method, and the vacuum method. The invention allows the top layer to be timely detached and properly replaced to meet the specifications of different lead frames or PCB substrates and can reduce the production cost.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: October 20, 2015
    Assignee: PRAM TECHNOLOGY INC.
    Inventor: Wen-Long Liu
  • Multi-functional detachable and replaceable wire bonding heating plate
    Publication number: 20140319199
    Abstract: A multi-functional detachable and replaceable wire bonding heating plate is provided with a heat blocking layer, a heating layer, a heat equalization layer, and a top layer. The bottom of the heat blocking layer has a recessed portion and the heating layer is disposed on top of the heat blocking layer. The heat equalization layer is disposed on top of the heating layer. A detachable and replaceable top layer is disposed on top of the heat equalization layer wherein a protruding support block is disposed on top of the top layer. The heat equalization layer and the top layer can be securely bonded to each other by the attraction force method, the engaging method, and the vacuum method. The invention allows the top layer to be timely detached and properly replaced to meet the specifications of different lead frames or PCB substrates and can reduce the production cost.
    Type: Application
    Filed: April 30, 2014
    Publication date: October 30, 2014
    Applicant: Pram Technology Inc.
    Inventor: Wen-Long Liu
  • Toughened polar thermoplastics
    Patent number: 5625001
    Abstract: Acrylic impact modifiers for polar thermoplastics such as poly(methyl methacrylate), polyamides, and poly(vinyl chloride) are prepared from emulsion polymer particles with hard methacrylate-rich domains in a continuous polyacrylate network.
    Type: Grant
    Filed: June 9, 1995
    Date of Patent: April 29, 1997
    Assignee: Rohm and Haas Company
    Inventors: Samuel J. Makower, Richard M. Kopchik, Wen-Long Liu, Alan D. Stein