Abstract: An anti-cavitation damping composite metal structure for a flow passage component and a preparation method thereof are provided. The preparation method includes: cladding a gradient functional material layer by layer on a substrate of a flow passage component; forming periodic structures on a surface of each layer of the gradient functional material through etching by an ultrafast laser to absorb a part of an impact load energy caused by cavitation of the flow passage component, where the layers of the gradient functional material form a gradient coating with a toughness increasing layer by layer and a hardness decreasing layer by layer from bottom to top; and forming nano twins on a surface layer by a laser shock peening technique, and implanting a residual compressive stress to further improve anti-cavitation resistance of a surface.

Abstract: The invention provides a making method of modified polyvinyl alcohol embolic microspheres. First, polyvinyl alcohol dimethyl sulfoxide solution is added to acryloyl chloride dichloromethane solution for reaction, then taurine solution is added to the above solution for further reaction, so that functional groups are introduced into the side chains of polyvinyl alcohol, then blank microspheres are prepared by suspension crosslinking method, and finally, drug-loaded modified polyvinyl alcohol embolic microspheres are prepared. The invention aims at improving the drug loading rate and drug loading speed of the microspheres. Through modification, the crystallinity of polyvinyl alcohol is weakened, the swelling in water is accelerated, and the application effect of the microspheres is improved.

Abstract: The invention provides a making method of modified polyvinyl alcohol embolic microspheres. First, polyvinyl alcohol dimethyl sulfoxide solution is added to acryloyl chloride dichloromethane solution for reaction, then taurine solution is added to the above solution for further reaction, so that functional groups are introduced into the side chains of polyvinyl alcohol, then blank microspheres are prepared by suspension crosslinking method, and finally, drug-loaded modified polyvinyl alcohol embolic microspheres are prepared. The invention aims at improving the drug loading rate and drug loading speed of the microspheres. Through modification, the crystallinity of polyvinyl alcohol is weakened, the swelling in water is accelerated, and the application effect of the microspheres is improved.

Abstract: A device for diagnosing a fault in a bearing of a motor is provided. If the device operates in a fault diagnosis mode, a current signal acquisition unit acquires a real-time current signal of the motor, a residual signal acquisition unit extracts harmonic signals from the real-time current signal of the motor acquired by the current signal acquisition unit and remove a fundamental signal and a harmonic signal from the real-time current signal of the motor to acquire a residual signal, a fault feature extraction unit analyzes the residual signal in both time domain and frequency domain to extract a fault feature index of the bearing, and a fault diagnosis model unit performs, by using a bearing fault diagnosis model obtained through training, pattern recognition on the fault feature index to diagnose a fault state of the bearing.

Abstract: A device for diagnosing a fault in a bearing of a motor is provided. If the device operates in a fault diagnosis mode, a current signal acquisition unit acquires a real-time current signal of the motor, a residual signal acquisition unit extracts harmonic signals from the real-time current signal of the motor acquired by the current signal acquisition unit and remove a fundamental signal and a harmonic signal from the real-time current signal of the motor to acquire a residual signal, a fault feature extraction unit analyzes the residual signal in both time domain and frequency domain to extract a fault feature index of the bearing, and a fault diagnosis model unit performs, by using a bearing fault diagnosis model obtained through training, pattern recognition on the fault feature index to diagnose a fault state of the bearing.

Abstract: A stage for cutting process and cutting method thereof, processing apparatus are disclosed. The stage includes a support substrate and a driving unit disposed on the support substrate. The driving unit is configured to drive the support substrate to rotate around a first direction in a board surface of the support substrate so as to remove foreign matters on the support substrate. The driving unit disposed in the stage can drive the rotation of the stage to allow foreign matters on the stage to automatically slide down.

Abstract: A grinding method, an OGS substrate and a manufacturing method of an OGS mother substrate are provided. The grinding method is used to grind the OGS substrate comprising a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.

Abstract: An OGS substrate and a grinding method thereof are provided. The OGS substrate includes a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.

Abstract: An OGS substrate and a grinding method thereof are provided. The OGS substrate includes a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.

Abstract: A laser processing device and a laser processing method. The laser processing device includes a cutting table, configured to load a workpiece to be processed; a distance-measuring unit, configured to perform distance measurement on the workpiece along a predetermined processing path to obtain three-dimensional processing data of the workpiece; and a laser processing unit, configured to process the workpiece by using laser light according to the three-dimensional processing data.

Abstract: A grinding method, an OGS substrate and a manufacturing method of an OGS mother substrate are provided. The grinding method is used to grind the OGS substrate comprising a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.