Patents by Inventor Wenlu Wang
Wenlu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11926687Abstract: A grafted polypropylene resin is prepared by a grafting reaction of a polar monomer capable of absorbing microwave so as to raise its temperature in a microwave field to more than 200° C. and a solid polypropylene resin using microwave irradiation without adding an initiator. The polar grafted polypropylene resin that does not contain initiator residues and does not have a significant reduction in molecular mass compared with a resin before grafting is obtained.Type: GrantFiled: April 26, 2019Date of Patent: March 12, 2024Assignees: CHINA PETROLEUM & CHEMICAL CORPORATION, BEIJING RESEARCH INSTITUTE OF CHEMICAL INDUSTRY, CHINA PETROLEUM & CHEMICAL CORPORATIONInventors: Jinliang Qiao, Songhe Wang, Xiaohong Zhang, Guicun Qi, Zhihai Song, Chuanlun Cai, Xiang Wang, Jinmei Lai, Binghai Li, Haibin Jiang, Yue Ru, Jiangru Zhang, Jianming Gao, Hongbin Zhang, Peng Han, Wenlu Liu
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Patent number: 11926794Abstract: A continuous operation method is employed for the microwave high-temperature pyrolysis of a solid material containing an organic matter. The method includes the steps of mixing a solid material containing an organic matter with a liquid organic medium; transferring the obtained mixture to a microwave field; and in the microwave field, continuously contacting the mixture with a strong wave absorption material in an inert atmosphere or in vacuum. The strong wave absorption material continuously generates a high temperature under a microwave such that the solid material containing an organic matter and the liquid organic medium are continuously pyrolyzed to implement a continuous operation.Type: GrantFiled: September 27, 2019Date of Patent: March 12, 2024Assignees: CHINA PETROLEUM & CHEMICAL CORPORATION, BEIJING RESEARCH INSTITUTE OF CHEMICAL INDUSTRY, CHINA PETROLEUM & CHEMICAL CORPORATIONInventors: Haibin Jiang, Jinliang Qiao, Xiaohong Zhang, Wenlu Liu, Jianming Gao, Guicun Qi, Zhihai Song, Jinmei Lai, Chuanlun Cai, Binghai Li, Xiang Wang, Yue Ru, Hongbin Zhang, Peng Han, Jiangru Zhang, Chao Jiang, Zhaoyan Guo
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Publication number: 20240036260Abstract: This patent document discloses, among others, wavelength-selective switches (WSS) for redirecting optical WDM signals or channels based on a combination of spatially separating light in different optical polarizations in an optical birefringent material and using diffractive optics for separating light at different optical WDM wavelengths into spatially separated optical beam to perform wavelength-selective optical switching in optical WDM applications. Notably, the optics for processing the optical WDM signals in the disclosed optical WSS devices is designed to provide scalable optical WSS devices where different WDM signals share optical components to reduce designed optical components for different WDM signals.Type: ApplicationFiled: January 19, 2022Publication date: February 1, 2024Inventors: Chenjun Fan, Wenlu Wang, Zuowen Jiang
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Publication number: 20240008189Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: ApplicationFiled: September 18, 2023Publication date: January 4, 2024Applicant: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Patent number: 11765837Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: GrantFiled: October 19, 2021Date of Patent: September 19, 2023Assignee: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Publication number: 20230178923Abstract: An apparatus, system and method capable of providing a high precision connection between a plurality of pins of a C form factor pluggable (CFP) and a connection pad of a printed circuit board (PCB). The apparatus, system and method include: a connector mask suitable to receive therein a body of the CFP; a ruler suitable to receive therein the connector mask, and sized and shaped for direct physical associated with the PCB about the connection pad; and an adjustment mechanism at least partially passing through the ruler for contacting at least the connector mask and capable of adjusting the position of the pins in relation to the connection pad.Type: ApplicationFiled: May 5, 2021Publication date: June 8, 2023Applicant: JABIL INC.Inventors: MARCEL MOORTGAT, WENLU WANG
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Publication number: 20220095463Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: ApplicationFiled: October 19, 2021Publication date: March 24, 2022Applicant: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Patent number: 11233353Abstract: An apparatus, system and method capable of providing a high precision connection between a plurality of pins of a C form factor pluggable (CFP) and a connection pad of a printed circuit board (PCB). The apparatus, system and method include: a connector mask suitable to receive therein a body of the CFP; a ruler suitable to receive therein the connector mask, and sized and shaped for direct physical associated with the PCB about the connection pad; and an adjustment mechanism at least partially passing through the ruler for contacting at least the connector mask and capable of adjusting the position of the pins in relation to the connection pad.Type: GrantFiled: May 5, 2020Date of Patent: January 25, 2022Assignee: JABIL INC.Inventors: Wenlu Wang, Marcel Moortgat
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Patent number: 11191169Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: GrantFiled: September 30, 2020Date of Patent: November 30, 2021Assignee: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Publication number: 20210351540Abstract: An apparatus, system and method capable of providing a high precision connection between a plurality of pins of a C form factor pluggable (CFP) and a connection pad of a printed circuit board (PCB). The apparatus, system and method include: a connector mask suitable to receive therein a body of the CFP; a ruler suitable to receive therein the connector mask, and sized and shaped for direct physical associated with the PCB about the connection pad; and an adjustment mechanism at least partially passing through the ruler for contacting at least the connector mask and capable of adjusting the position of the pins in relation to the connection pad.Type: ApplicationFiled: May 5, 2020Publication date: November 11, 2021Applicant: JABIL INC.Inventors: Wenlu WANG, Marcel MOORTGAT
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Publication number: 20210345531Abstract: An apparatus, system and method of providing a tray suitable for holding an optoelectronic device during printed circuit board manufacturing processes. The apparatus, system and method includes a tray body having an inset for receiving the optoelectronic device; a plurality of positioners for the optoelectronic device within the inset; and a guide channel about a perimeter of the tray body suitable for receiving optical fibers of the optoelectronic device when the optoelectronic device is received in the inset, the guide channel comprising at least one retainer for retaining received ones of the optical fibers therewithin.Type: ApplicationFiled: September 4, 2018Publication date: November 4, 2021Applicant: JABIL INC.Inventors: Wenlu WANG, Marcel MOORTGAT
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Publication number: 20210014977Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: ApplicationFiled: September 30, 2020Publication date: January 14, 2021Applicant: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Patent number: 10813230Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: GrantFiled: September 5, 2019Date of Patent: October 20, 2020Assignee: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Publication number: 20190394885Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: ApplicationFiled: September 5, 2019Publication date: December 26, 2019Applicant: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Patent number: 10448517Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: GrantFiled: November 4, 2016Date of Patent: October 15, 2019Assignee: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Publication number: 20180132360Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: ApplicationFiled: November 4, 2016Publication date: May 10, 2018Applicant: Jabil Circuit, Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Patent number: 8937768Abstract: An optical component has a lens including a further optical component therein. The further optical component acts upon light propagating within a portion of the lens but not on light propagating within a second other portion of the lens. A simple configuration involves a lens having a slot for having the optical component inserted therein. Optical components including the lens with further optical component include beam splitters and beam combiners.Type: GrantFiled: May 4, 2011Date of Patent: January 20, 2015Assignee: Viscore Technologies Inc.Inventors: Wenlu Wang, Kinwai Leong, Yunqu Liu
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Publication number: 20110273772Abstract: An optical component is disclosed having a lens including a further optical component therein. The further optical component acts upon light propagating within a portion of the lens but not on light propagating within a second other portion of the lens. A simple configuration involves a lens having a slot for having the optical component inserted therein.Type: ApplicationFiled: May 4, 2011Publication date: November 10, 2011Applicant: VISCORE TECHNOLOGIES INC.Inventors: Wenlu Wang, Kinwai Leong, Yunqu Liu
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Patent number: 7103288Abstract: Accordingly, an aspect of the present invention provides a method of dynamically controlling a bias point of a photodiode of an optical receiver. According to the present invention a performance parameter indicative of an eye opening of an optical signal received by the optical receiver is detected. A bias voltage of the photodiode s dynamically adjusted so as to optimize a value of the detected performance parameter.Type: GrantFiled: March 17, 2004Date of Patent: September 5, 2006Assignee: Nortel Networks LimitedInventor: Wenlu Wang
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Publication number: 20050205759Abstract: Accordingly, an aspect of the present invention provides a method of dynamically controlling a bias point of a photodiode of an optical receiver. According to the present invention a performance parameter indicative of an eye opening of an optical signal received by the optical receiver is detected. A bias voltage of the photodiode s dynamically adjusted so as to optimize a value of the detected performance parameter.Type: ApplicationFiled: March 17, 2004Publication date: September 22, 2005Applicant: NORTEL NETWORKS LIMITEDInventor: Wenlu Wang