Patents by Inventor Wenlu Wang

Wenlu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210014977
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Application
    Filed: September 30, 2020
    Publication date: January 14, 2021
    Applicant: Jabil Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Patent number: 10813230
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: October 20, 2020
    Assignee: Jabil Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Publication number: 20190394885
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Application
    Filed: September 5, 2019
    Publication date: December 26, 2019
    Applicant: Jabil Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Patent number: 10448517
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: October 15, 2019
    Assignee: Jabil Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Publication number: 20180132360
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Application
    Filed: November 4, 2016
    Publication date: May 10, 2018
    Applicant: Jabil Circuit, Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Patent number: 8937768
    Abstract: An optical component has a lens including a further optical component therein. The further optical component acts upon light propagating within a portion of the lens but not on light propagating within a second other portion of the lens. A simple configuration involves a lens having a slot for having the optical component inserted therein. Optical components including the lens with further optical component include beam splitters and beam combiners.
    Type: Grant
    Filed: May 4, 2011
    Date of Patent: January 20, 2015
    Assignee: Viscore Technologies Inc.
    Inventors: Wenlu Wang, Kinwai Leong, Yunqu Liu
  • Publication number: 20110273772
    Abstract: An optical component is disclosed having a lens including a further optical component therein. The further optical component acts upon light propagating within a portion of the lens but not on light propagating within a second other portion of the lens. A simple configuration involves a lens having a slot for having the optical component inserted therein.
    Type: Application
    Filed: May 4, 2011
    Publication date: November 10, 2011
    Applicant: VISCORE TECHNOLOGIES INC.
    Inventors: Wenlu Wang, Kinwai Leong, Yunqu Liu
  • Patent number: 7103288
    Abstract: Accordingly, an aspect of the present invention provides a method of dynamically controlling a bias point of a photodiode of an optical receiver. According to the present invention a performance parameter indicative of an eye opening of an optical signal received by the optical receiver is detected. A bias voltage of the photodiode s dynamically adjusted so as to optimize a value of the detected performance parameter.
    Type: Grant
    Filed: March 17, 2004
    Date of Patent: September 5, 2006
    Assignee: Nortel Networks Limited
    Inventor: Wenlu Wang
  • Publication number: 20050205759
    Abstract: Accordingly, an aspect of the present invention provides a method of dynamically controlling a bias point of a photodiode of an optical receiver. According to the present invention a performance parameter indicative of an eye opening of an optical signal received by the optical receiver is detected. A bias voltage of the photodiode s dynamically adjusted so as to optimize a value of the detected performance parameter.
    Type: Application
    Filed: March 17, 2004
    Publication date: September 22, 2005
    Applicant: NORTEL NETWORKS LIMITED
    Inventor: Wenlu Wang