Patents by Inventor Wenmin NIU

Wenmin NIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250065386
    Abstract: A method for preparing a thin-walled composite pipe is provided, in which an AlN particle/zinc-aluminum 27 (AlNp/ZA27) composite billet is subjected to multi-pass reciprocating extrusion at 250-350° C., and then loaded into a pipe extrusion die. The composite billet is heated with the temperature being in an ascending gradient distribution (within a range of 250-350° C.) along an extrusion direction from the billet to an outlet of the die, then kept a preset temperature for a period of time, and finally extruded at a rate of 0.1-0.5 mm/s to obtain the thin-walled composite pipe. A thin-walled composite pipe prepared by this method is also provided, including an AlN particle and a ZA27 alloy.
    Type: Application
    Filed: November 11, 2024
    Publication date: February 27, 2025
    Inventors: Shengqiang MA, Ping LV, Yusheng LIU, Jiandong XING, Jing XU, Jiankang ZHANG, Jiaxu CHEN, Maojiang YE, Gaofeng MA, Wenmin NIU
  • Publication number: 20240117470
    Abstract: A high-thermal conductivity composite material is AlNp/ZA27 composite material, including 2%, 4%, 6%, or 8% by volume of aluminum nitride (AlN) ceramic particles and zinc-aluminium-27 (ZA27) alloy. The ZA27 alloy includes 70.52-71.08% by weight of Zn, 25.58˜27.65% by weight of Al, 1.27˜3.45% by weight of Cu, and 0.50% or less by weight of Mg. In the preparation of the high-thermal conductivity composite material, an as-cast AlNp/ZA27 composite material is subjected to homogenizing annealing and reciprocating extrusion.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Inventors: Shengqiang MA, Ping LV, Xudong CUI, Yusheng LIU, Xuebin HE, Jiaxu CHEN, Jiankang ZHANG, Jiandong XING, Wenmin NIU