Abstract: A bus connection wire forward soldering structure includes a circuit board, a flat cable and a fixing member, and the circuit board has a solder area, a docking area, first and second surfaces and an outgoing line direction. The solder area is disposed on the first surface, the flat cable includes a solder terminal, first and second attaching sections, a folding section and a main body section, the solder terminal faces the docking area and is electrically connected to the solder area, the folding section is connected between the first and second attaching sections, the main body section extends along the outgoing line direction, the fixing member covers the solder terminal, the folding section, the first and second attaching sections, the fixing member has a notch defined corresponding to the second surface and located at junction of the second attaching section and the main body section junction.

Abstract: A bus connection cable reverse-welding structure includes a circuit board, a flat cable, and a first line. The circuit board includes a wiring side, an insertion side, a welding area, a first mating area. A wire exit direction is defined from the wiring side toward the insertion side. The welding area is on the wiring side, and the first mating area is on the insertion side. The flat cable includes a main segment, an attached segment, and a welding end. The main segment extends along the wire exit direction, and the attached segment is attached on the circuit board. The welding end is electrically connected to the welding area. The first line is arranged in the circuit board and includes a first embedded segment and a first extension segment. The first embedded segment is embedded in the circuit board and connected to the welding area.

Abstract: A deposition system provides a feature that may reduce costs of the sputtering process by increasing a target change interval. The deposition system provides an array of magnet members which generate a magnetic field and redirect the magnetic field based on target thickness measurement data. To adjust or redirect the magnetic field, at least one of the magnet members in the array tilts to focus on an area of the target where more target material remains than other areas. As a result, more ion, e.g., argon ion bombardment occurs on the area, creating more uniform erosion on the target surface.

Abstract: A deposition system is provided capable of measuring at least one of the film characteristics (e.g., thickness, resistance, and composition) in the deposition system. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition system in accordance with the present disclosure includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, and a target enclosing the substrate process chamber. A shutter disk including an in-situ measuring device is provided.

Abstract: The present invention relates to a semiconductor chemical mechanical polishing sludge recycling device, which includes a roasting device, a soaking and stirring device, a first centrifugal dehydration device, a cleaning device and a second centrifugal dehydration device arranged thereon. The roasting device heat-treats the semiconductor chemical mechanical polishing sludge to remove the impurities. The soaking and stirring device is connected with the roasting device. The roasted semiconductor chemical mechanical polishing sludge is placed in the soaking and stirring device. The first centrifugal dehydration device is connected with the soaking and stirring device. A product obtained by the soaking and stirring device is solidified and concentrated through the first centrifugal dehydration device. The cleaning device is connected with the first centrifugal dehydration device. The second centrifugal dehydration device is connected with the cleaning device.

Abstract: The present invention relates to a semiconductor chemical mechanical polishing sludge recycling method, which comprises the following steps: (1) drying out the CMP sludge into a condition of solid; (2) putting the solid sludge obtained in step (1) into a high-temperature furnace for roasting; (3) putting the solid sludge obtained in step (2) into a reaction tank and adding a impregnating liquid for soaking, (4) performing a solid-liquid separation in step (3) to obtain a solid and a liquid, (5) performing a concentration reaction on the liquid separated in step (4) to obtain a copper sulfate aqueous solution by-product; (6) taking out the solid sludge obtained in step (4) and adding water for washing; (7) dehydrating a product obtained in step (6); (8) obtaining the solid dehydrated is the goods, and a sum of silicon dioxide and aluminum oxide on a dry basis is greater than 94%.

Abstract: A fiber measurement system for obtaining a fiber bending loss data of a moving fiber when compared with a static fiber is provided.

Abstract: A wavelength to optical power converter and a method for converter a wavelength into an optical power are provided. The wavelength to optical power converter includes an input fiber pigtail for inputting an optical wavelength signal, a spiral fiber connected to the input fiber pigtail, a cylinder for fixing the spiral fiber, an output fiber pigtail extended from the spiral fiber, and an optical detector connected to the output fiber pigtail for reading a signal from the output fiber pigtail to generate the optical power, wherein the spiral fiber outputs the optical power in response to the optical wavelength signal, thereby performing a conversion from the wavelength into the optical power.

Abstract: A wavelength to optical power converter and a method for converter a wavelength into an optical power are provided. The wavelength to optical power converter includes an input fiber pigtail for inputting an optical wavelength signal, a spiral fiber connected to the input fiber pigtail, a cylinder for fixing the spiral fiber, an output fiber pigtail extended from the spiral fiber, and an optical detector connected to the output fiber pigtail for reading a signal from the output fiber pigtail to generate the optical power, wherein the spiral fiber outputs the optical power in response to the optical wavelength signal, thereby performing a conversion from the wavelength into the optical power.

Abstract: A dynamic optical coupling device for coupling an optical signal from a static optical fiber to a dynamic optical fiber is provided. The device includes: a static element for inputting the optical signal, a static ferrule adaptor for mounting the static element therein to pass therethrough, a dynamic element for outputting the optical signal, a dynamic ferrule adaptor for mounting the dynamic ferrule element therein to pass therethrough, wherein a free space is formed between the static ferrule adaptor and the dynamic ferrule adaptor, a ferrule adaptor connector for connecting the static ferrule adaptor and the dynamic ferrule adaptor, and a supporting frame mounting the ferrule adaptor connector therein.

Abstract: A fiber measurement system for obtaining a fiber bending loss data of a moving fiber when compared with a static fiber is provided.