Patents by Inventor Wenming MA

Wenming MA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973087
    Abstract: The present disclosure provides an array substrate and a method of manufacturing the same and a display panel, which belongs to the field of display technologies. The method of manufacturing the array substrate comprises: providing a base substrate; forming a drive circuit layer on the base substrate, wherein the drive circuit layer includes a switching transistor; forming an insulating material layer on one side of the drive circuit layer distal to the base substrate, wherein the insulating material layer has a connection via-hole exposing at least a part region of a drain electrode of the switching transistor; and forming an electrode layer on one side of the insulating material layer distal to the base substrate, wherein a surface of the electrode layer distal to the base substrate has groove structures extending to the connection via-hole. The manufacturing method may avoid the occurrence of poor coating in forming an orientation layer.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: April 30, 2024
    Assignees: Hefei Xinsheng Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Wenming Ren, Jinliang Hu, Jian Ma, Chengyong Zhan
  • Patent number: 11927858
    Abstract: An array substrate includes: a substrate, and a thin film transistor TFT, a first passivation layer and a transparent electrode disposed on the substrate. Only the first passivation layer is disposed between the transparent electrode and an active layer in the TFT. In this way, a film structure of the array substrate is effectively simplified because no organic insulation layer is disposed in the array substrate, thereby simplifying a manufacturing process of the array substrate and reducing the manufacturing cost of the array substrate.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: March 12, 2024
    Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jian Ma, Wenming Ren
  • Publication number: 20230392087
    Abstract: A process includes: cutting a hydrocarbon-containing feedstock oil into a light distillate oil and a heavy distillate oil; introducing the light distillate oil and a first catalyst into a down-flow reactor to produce a stream; subjecting the stream to a gas-solid separation to produce a first reaction hydrocarbon product and a first spent catalyst; or, introducing the stream into a fluidized bed reactor, and then subjecting to a gas-solid separation to produce a second reaction hydrocarbon product and a second spent catalyst; introducing a continuous catalyst, the heavy distillate oil and a second catalyst into an up-flow reactor, and then subjecting to a gas-solid separation to produce a third reaction hydrocarbon product and a third spent catalyst; separating out lower carbon olefins and light aromatics from reaction hydrocarbon products, separating out a light olefin fraction, and returning the light olefin fraction to the fluidized bed reactor or the up-flow reactor.
    Type: Application
    Filed: October 29, 2021
    Publication date: December 7, 2023
    Applicants: CHINA PETROLEUM & CHEMICAL CORPORATION, SINOPEC RESEARCH INSTITUTE OF PETROLEUM PROCESSING CO., LTD.
    Inventors: Jianhong GONG, Xieqing WANG, Chao YANG, Xiaoli WEI, Genquan ZHU, Wenming MA, Yun CHEN
  • Patent number: 11235406
    Abstract: The high-efficiency soldering apparatus for a winding head of a flat-wire motor includes a support base, a solder tray, a solder spot isolation and limit plate, a shaft lever and a movable tray. The solder tray is provided at the center of the support base. The solder spot isolation and limit plate is provided on the solder tray. The shaft lever is provided on the support base. The movable tray is provided on the shaft lever. The movable tray is located above the solder tray. The movable tray moves vertically along the shaft lever. A stator is placed at the center of the movable tray, and a winding head of the stator extends below the movable tray.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: February 1, 2022
    Assignee: HEFEI JEE POWER SYSTEMS Co., Ltd.
    Inventors: Lei Liu, Biaolong Zhu, Wenming Ma, Chunzhe Sun, Xu Tian
  • Publication number: 20210220936
    Abstract: The high-efficiency soldering apparatus for a winding head of a flat-wire motor includes a support base, a solder tray, a solder spot isolation and limit plate, a shaft lever and a movable tray. The solder tray is provided at the center of the support base. The solder spot isolation and limit plate is provided on the solder tray. The shaft lever is provided on the support base. The movable tray is provided on the shaft lever. The movable tray is located above the solder tray. The movable tray moves vertically along the shaft lever. A stator is placed at the center of the movable tray, and a winding head of the stator extends below the movable tray.
    Type: Application
    Filed: December 30, 2019
    Publication date: July 22, 2021
    Applicant: HEFEI JEE POWER SYSTEMS Co., Ltd.
    Inventors: Lei LIU, Biaolong ZHU, Wenming MA, Chunzhe SUN, Xu TIAN