Abstract: A battery cover is applied to the electronic device and configured to couple to a housing of the electronic device, and includes a glass substrate. A non-transparent layer is disposed on a first side of the glass substrate. At least one first through-hole is disposed on the non-transparent layer opposite to a camera assembly disposed in the electronic device. A camera region is disposed on the first side of the glass substrate disposed opposite to the at least one first through-hole. A film-coated layer is disposed in the camera region of the glass substrate. An area of the camera region is greater than or equal to an area of the at least one first through-hole.

Abstract: A fingerprint module includes a fingerprint component, a button component, a support, and a resilient fixing element. The button component is fastened to a lower surface of the fingerprint component. The resilient fixing element is disposed on the lower surface of the fingerprint component and is located between the fingerprint component and the support. The resilient fixing element surrounds the button component, and the resilient fixing element resiliently connects the fingerprint component and the support. There is a gap between the button component and the support. When the fingerprint component is pressed, the resilient fixing element deforms, the gap becomes smaller, and the button component comes in contact with the support.

Abstract: A battery cover is applied to the electronic device and configured to couple to a housing of the electronic device, and includes a glass substrate. A non-transparent layer is disposed on a first side of the glass substrate. At least one first through-hole is disposed on the non-transparent layer opposite to a camera assembly disposed in the electronic device. A camera region is disposed on the first side of the glass substrate opposite to the at least one first through-hole. A film-coated layer is disposed in the camera region of the glass substrate. An area of the camera region is greater than or equal to an area of the at least one first through-hole.

Abstract: A component and an electronic device with the component includes a structural assembly and a cover assembly that matches the structural assembly. The structural assembly includes a bracket, the cover assembly includes a cover body, and a glare film is disposed on a surface that is of the cover body and that is close to the structural assembly. An isolation assembly configured to isolate the bracket from the glare film is disposed in some regions between the bracket and the glare film. A hardness of the isolation assembly is less than or equal to hardness of the glare film. A connection assembly configured to connect the bracket and the glare film is disposed in some or all regions that are between the bracket and the glare film and in which the isolation assembly is not disposed.

Abstract: A component and an electronic device with the component includes a structural assembly and a cover assembly that matches the structural assembly. The structural assembly includes a bracket, the cover assembly includes a cover body, and a glare film is disposed on a surface that is of the cover body and that is close to the structural assembly. An isolation assembly configured to isolate the bracket from the glare film is disposed in some regions between the bracket and the glare film. A hardness of the isolation assembly is less than or equal to hardness of the glare film. A connection assembly configured to connect the bracket and the glare film is disposed in some or all regions that are between the bracket and the glare film and in which the isolation assembly is not disposed.