Patents by Inventor Wenping Jia

Wenping Jia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12132249
    Abstract: An antenna module includes: a first insulation medium substrate, including a first section provided with a first groove and a second section, where an integrated circuit is disposed in the first groove; a flexible substrate including a conductive structure, where the flexible substrate is stacked on the first insulation medium substrate, and a part that is of the flexible substrate and that is located between the first section and the second section is bendable; and an antenna structure, including a first metal structure that is disposed on the first section and that is connected to the conductive structure and the integrated circuit, and a second metal structure that is disposed on the second section and that is connected to the conductive structure. This avoids a warping problem caused by different thermal expansion coefficients of a plastic packaging material and a substrate, and reduces a risk of product failure.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: October 29, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Rui Yu, Hsiang Hui Chang, Wenping Jia
  • Patent number: 12083757
    Abstract: A production line with automatic belt disassembling and assembling for rubber belt vulcanization is provided and includes a working platform, two sides of the working platform are respectively a raw rubber belt placement platform and a finished rubber belt placement platform; and a truss; a rubber belt clamping device, a circular die clamping device and a transferring device are arranged on the truss; the rubber belt clamping device transfers raw rubber belts from raw rubber belt unloading station to disassembling and assembling station, and transfers finished rubber belts from disassembling and assembling station to finished rubber belt loading station; the circular die clamping device controls circular dies to move between the two stations; the transferring device transfers the stacked raw rubber belts and circular dies into a vulcanization device, and transfers the vulcanized finished rubber belts and the circular die to the disassembling and assembling station.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: September 10, 2024
    Assignees: Taizhou Tianjun Technology Co., Ltd, Wenling Research Institute of Taizhou University, Taizhou University
    Inventors: Wenping Jia, Libiao Wang, Shusen Lin, Shisheng Zheng
  • Publication number: 20240208168
    Abstract: A production line with automatic belt disassembling and assembling for rubber belt vulcanization is provided and includes a working platform, two sides of the working platform are respectively a raw rubber belt placement platform and a finished rubber belt placement platform; and a truss; a rubber belt clamping device, a circular die clamping device and a transferring device are arranged on the truss; the rubber belt clamping device transfers raw rubber belts from raw rubber belt unloading station to disassembling and assembling station, and transfers finished rubber belts from disassembling and assembling station to finished rubber belt loading station; the circular die clamping device controls circular dies to move between the two stations; the transferring device transfers the stacked raw rubber belts and circular dies into a vulcanization device, and transfers the vulcanized finished rubber belts and the circular die to the disassembling and assembling station.
    Type: Application
    Filed: May 31, 2022
    Publication date: June 27, 2024
    Inventors: Wenping JIA, Libiao WANG, Shusen LIN, Shisheng ZHENG
  • Publication number: 20230170602
    Abstract: An antenna module includes: a first insulation medium substrate, including a first section provided with a first groove and a second section, where an integrated circuit is disposed in the first groove; a flexible substrate including a conductive structure, where the flexible substrate is stacked on the first insulation medium substrate, and a part that is of the flexible substrate and that is located between the first section and the second section is bendable; and an antenna structure, including a first metal structure that is disposed on the first section and that is connected to the conductive structure and the integrated circuit, and a second metal structure that is disposed on the second section and that is connected to the conductive structure. This avoids a warping problem caused by different thermal expansion coefficients of a plastic packaging material and a substrate, and reduces a risk of product failure.
    Type: Application
    Filed: March 3, 2021
    Publication date: June 1, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Rui Yu, Hsiang Hui CHANG, Wenping Jia