Patents by Inventor Wenping KONG

Wenping KONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130090
    Abstract: The present disclosure provides a server heat dissipation system based on gravity heat pipe for dissipating heat from chip of a server, comprising: an evaporator arranged in a chassis of the server and being in thermal contact with the chip, said evaporator having a first cavity internally; a condenser arranged above the server, said condenser having a second cavity internally; and an heat-insulated pipe section passing through the chassis and connecting the evaporator and the condenser, and communicating the first cavity and the second cavity, wherein the evaporator, the condenser and the insulated pipe section are made to form a gravity heat pipe to accommodate working substance that realizes conversion cycles between liquid state and gaseous state by retracting and releasing heat; wherein the heat generated by the chip is transferred to the working substance in liquid state in the first cavity through the evaporator, the working substance absorbs heat and is converted into gaseous state, rising to the seco
    Type: Application
    Filed: April 17, 2023
    Publication date: April 18, 2024
    Inventors: Lei NIE, Shiyan LI, Man ZHANG, Wenping KONG, Su SUN