Patents by Inventor Wenquan DU

Wenquan DU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mold with cavities for nanoimprint lithography and method of imprinting same
    Patent number: 10649327
    Abstract: A mold with cavities for nanoimprint lithography and a method of imprinting the same. The mold is a one-piece structure, including an upper mold and a lower mold which are welded together. The upper mold is evenly provided with a plurality of stepped holes. A plurality of grooves are provided at an upper surface of the lower mold. Both ends of each groove are respectively connected to an external high-pressure water pump and an external vacuum pump via pipelines. An airtight cavity is additionally provided at the interior of the mold to form a negative pressure in the cavity by vacuumizing during the imprint process. In the demolding, a crack is formed at the interface between the mold and the imprint resist by using water pressure and expands to the entire interface for the demolding of the imprinted structure.
    Type: Grant
    Filed: March 30, 2019
    Date of Patent: May 12, 2020
    Assignee: SHANDONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Qing Wang, Jintao Zhang, Rui Zhang, Xu Zheng, Lijun Ma, Xingyuan Zhang, Wenquan Du
  • MOLD WITH CAVITIES FOR NANOIMPRINT LITHOGRAPHY AND METHOD OF IMPRINTING SAME
    Publication number: 20190227430
    Abstract: A mold with cavities for nanoimprint lithography and a method of imprinting the same. The mold is a one-piece structure, including an upper mold and a lower mold which are welded together. The upper mold is evenly provided with a plurality of stepped holes. A plurality of grooves are provided at an upper surface of the lower mold. Both ends of each groove are respectively connected to an external high-pressure water pump and an external vacuum pump via pipelines. An airtight cavity is additionally provided at the interior of the mold to form a negative pressure in the cavity by vacuumizing during the imprint process. In the demolding, a crack is formed at the interface between the mold and the imprint resist by using water pressure and expands to the entire interface for the demolding of the imprinted structure.
    Type: Application
    Filed: March 30, 2019
    Publication date: July 25, 2019
    Inventors: Qing WANG, Jintao ZHANG, Rui ZHANG, Xu ZHENG, Lijun MA, Xingyuan ZHANG, Wenquan DU