Patents by Inventor Wen-Sen Chen

Wen-Sen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136420
    Abstract: A thin film transistor includes a substrate, a semiconductor layer, a gate insulating layer, a gate, a source and a drain. The semiconductor layer is located above the substrate. The gate insulating layer is located above the semiconductor layer. The gate is located above the gate insulating layer and overlapping with the semiconductor layer. The gate includes a first portion, a second portion and a third portion. The first portion is extending along the surface of the gate insulating layer and directly in contact with the gate insulating layer. The second portion is separated from the gate insulating layer. Taking the surface of the gate insulating layer as a reference, the top surface of the second portion is higher than the top surface of the first portion. The third portion connects the first portion to the second portion. The source and the drain are electrically connected to the semiconductor layer.
    Type: Application
    Filed: December 1, 2022
    Publication date: April 25, 2024
    Applicant: AUO Corporation
    Inventors: Kuo-Jui Chang, Wen-Tai Chen, Chi-Sheng Chiang, Yu-Chuan Liao, Chien-Sen Weng, Ming-Wei Sun
  • Patent number: 11929767
    Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: March 12, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
  • Patent number: 4823112
    Abstract: The sound producing device is composed of three independent parts: (1) a push-button for generating a sound-wave; (2) an assembly comprising a sound-wave sensing switch, a magnet and magnetic-reed switch, an integrated circuit amplifier and a door bell; and (3) a fixed magnet. The three parts have their own self-sticking glue, so that no wire is required when installed, and it can be adhered on the front of the door, inside the door, and by the side of the door frame, respectively. Dry cells may be located in the interior of the assembly. The device serves several functions because it notifies people (1) that the door is not well closed, (2) that a burglar is trying to get into the house and (3) it serves the normal function of a door bell.
    Type: Grant
    Filed: June 8, 1987
    Date of Patent: April 18, 1989
    Inventor: Wen-Sen Chen