Abstract: A semiconductor device includes a substrate, a first device, a second device, a ring structure, a lid structure, and a first adhesive layer. The first device is disposed on the substrate. The second device is adjacent to the first device and is disposed on the substrate. The ring structure is disposed over the substrate and the second device. The ring structure includes a cover and a leg extending out from the cover. The cover has a through opening. The lid structure is disposed over the ring structure and the first device. The lid structure includes a body and a protrusion protruding from the body. The protrusion of the lid structure is inserted into the through opening of the cover of the ring structure. The first adhesive layer is disposed between the body of the lid structure and the cover of the ring structure and includes phase change thermal interface material.

Abstract: In an embodiment, a device includes: an integrated circuit package including: a package component; and a package stiffener attached to the package component; and a heat spreader attached to the integrated circuit package, a main portion of the heat spreader disposed above the package stiffener, a protruding portion of the heat spreader extending through the package stiffener; an elastic adhesive material between the main portion of the heat spreader and the package stiffener; and a thermal interface material between the protruding portion of the heat spreader and the package component, the thermal interface material different from the elastic adhesive material.

Abstract: In an embodiment, a method includes: attaching a package component to a package substrate, the package component includes: a first die being disposed over an interposer; a second die being disposed over the interposer and laterally adjacent to the first die; and an encapsulant being disposed around the first die and the second die; attaching a thermal interface material to the first die and the second die; and attaching a lid structure to the package substrate, the lid structure includes: a lid cap being disposed over the thermal interface material; and a plurality of lid feet connecting the lid cap to the package substrate, in a plan view the plurality of lid feet forming a discontinuous loop around the package component.

Abstract: A semiconductor package includes a substrate, a package structure, and a lid structure. The package structure is disposed on the substrate. The lid structure is disposed over substrate, wherein the lid structure includes a main body covering and surrounding the package structure and a plurality of rib portions protruded from the main body and extended toward the package structure.

Abstract: Provided is a method for implementing compiled embedded Python. The method comprises: traversing an abstract syntax tree of Python source code to obtain semantic information about a program and generating corresponding C++ code according to said semantic information (S1); performing type annotation of the Python source code and thus generating C++ variable definitions and function definitions (S2); using a translator to translate into C++ source files the Python source code processed in the steps described above (S3); storing said C++ source files together with embedded chip-related files to form a file package, and compiling and linking said file package and generating an ASCII text file (S4). The method implements a source code translator on the basis of type annotations and static analysis, and integrates the translator into an embedded platform, enabling the editing, compiling, linking, and programming of Python source files.

Abstract: Provided is a method for implementing compiled embedded Python. The method comprises: traversing an abstract syntax tree of Python source code to obtain semantic information about a program and generating corresponding C++ code according to said semantic information (S1); performing type annotation of the Python source code and thus generating C++ variable definitions and function definitions (S2); using a translator to translate into C++ source files the Python source code processed in the steps described above (S3); storing said C++ source files together with embedded chip-related files to form a file package, and compiling and linking said file package and generating an ASCII text file (S4). The method implements a source code translator on the basis of type annotations and static analysis, and integrates the translator into an embedded platform, enabling the editing, compiling, linking, and programming of Python source files.