Patents by Inventor Wensheng Xiang

Wensheng Xiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11644750
    Abstract: Provided is a negative photoresist used for a semiconductor encapsulation process, belonging to the technical field of semiconductor processing. A negative photoresist formulation includes 40-65 wt % of modified epoxy acrylate, 3-6 wt % of photosensitizer, 100-1000 ppm of leveling agent, and the remainder of solvent; the leveling agent is a solution of a 7:3 mass ratio of polydimethylsiloxane copolymer having a molecular weight of 3000-6000 and propylene glycol monomethyl ether acetate. If the negative photoresist is coated at a thickness of about 50 um, the coating uniformity can be controlled to below 5%, ensuring the quality of exposure such that the thickness of electroplated copper meets requirements.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: May 9, 2023
    Assignee: Jiangsu Aisen Semiconductor Material Co., Ltd.
    Inventors: Wensheng Xiang, Kun Zhu, Lan Lu, Bing Zhang, Jianlong Zhao
  • Publication number: 20210018838
    Abstract: Provided is a negative photoresist used for a semiconductor encapsulation process, belonging to the technical field of semiconductor processing. A negative photoresist formulation includes 40-65 wt % of modified epoxy acrylate, 3-6 wt % of photosensitizer, 100-1000 ppm of leveling agent, and the remainder of solvent; the leveling agent is a solution of a 7:3 mass ratio of polydimethylsiloxane copolymer having a molecular weight of 3000-6000 and propylene glycol monomethyl ether acetate. If the negative photoresist is coated at a thickness of about 50 um, the coating uniformity can be controlled to below 5%, ensuring the quality of exposure such that the thickness of electroplated copper meets requirements.
    Type: Application
    Filed: December 11, 2019
    Publication date: January 21, 2021
    Applicant: JIANGSU AISEN SEMICONDUCTOR MATERIAL CO., LTD.
    Inventors: Wensheng Xiang, Kun Zhu, Lan Lu, Bing Zhang, Jianlong Zhao
  • Publication number: 20140011867
    Abstract: The present invention discloses use of borrelidin for preventing and controlling phytophthora root rot of soybean. The present invention also discloses formulations of borrelidin seed coating agents and wettable powders and preparation methods thereof. Borrelidin exhibits significant effects on Phytophthora sojae. As compared with the conventional fungicide metalaxyl which is used for preventing and controlling phytophthora root rot of soybean, the mycelial growth inhibition assay indicates that the IC50 and IC95 values of borrelidin are 1/62 and 1/263, respectively, of those of metalaxyl. In the indoor pot-culture experiment, the seed coating agent and wettable powder exhibit significant controlling effects on phytophthora root rot of soybean.
    Type: Application
    Filed: March 25, 2011
    Publication date: January 9, 2014
    Applicant: ZHEJIANG HISUN PHARMACEUTICAL CO., LTD.
    Inventors: Wensheng Xiang, Jidong Wang, Xiangjing Wang, Chongxi Liu, Dianliang Gong, Hua Bai