Abstract: A test system for high voltage testing of semiconductor devices including at least one test socket and a docking plate assembly. Each test socket includes a socket enclosure for encompassing first and second contact finger assemblies, in which the socket enclosure may include a cover and alignment plate. At least one test socket is embedded within the docking plate assembly which is configured to mount between high voltage test head and a pick and place handler. The docking plate assembly and each test socket includes one or more site openings each for receiving a corresponding device under test (DUT) during a high voltage test procedure. Each contact finger assembly includes at least one contact finger configured as an elongated conductor with a bent tip for electrically interfacing a pad of the DUT.

Abstract: A test system for high voltage testing of semiconductor devices including at least one test socket and a docking plate assembly. Each test socket includes a socket enclosure for encompassing first and second contact finger assemblies, in which the socket enclosure may include a cover and alignment plate. At least one test socket is embedded within the docking plate assembly which is configured to mount between high voltage test head and a pick and place handler. The docking plate assembly and each test socket includes one or more site openings each for receiving a corresponding device under test (DUT) during a high voltage test procedure. Each contact finger assembly includes at least one contact finger configured as an elongated conductor with a bent tip for electrically interfacing a pad of the DUT.

Abstract: A modular integrated circuit test fixture integrates the integrated circuit (IC) handler to IC test fixture alignment interface (the alignment plate) into a daughter card subassembly, which reduces the overall rejection rate of devices due to alignment errors. The test fixture has a plurality of daughter card subassemblies for receiving integrated circuits for testing. Each daughter card subassembly is independently removable from the test fixture and includes a daughter card for a particular size and type of integrated circuit, a plurality of sockets electrically and mechanically coupled to the daughter card to receive respective integrated circuits for testing, and an alignment plate to provide alignment between an IC handler and respective ones of the daughter card subassemblies and to provide alignment for one or more manual test lids. The manual test lids are removed for automatic testing using an IC handler.

Abstract: A test system for testing semiconductor chips including a docking plate, a test card, chip sockets, a stiffener, and test electronics. Each test card has a uniform card configuration that may be used with any of several different handlers. Each test card includes conductive pads electrically coupled to and longitudinally offset from a socket interface along a length of the test card. The stiffener includes a test interface including conductive pins for electrically interfacing the conductive pads of the test card. The test card is supported by the stiffener so that it remains undeformed as each chip is plunged into a test socket. The test interface includes a basin that is covered by the test card to form a thermal isolation cavity for thermal separation from the test electronics. A uniform radio frequency interface is provided between each test card and a corresponding test interface.

Abstract: A test system for testing semiconductor chips including a docking plate, a test card, chip sockets, a stiffener, and test electronics. Each test card has a uniform card configuration that may be used with any of several different handlers. Each test card includes conductive pads electrically coupled to and longitudinally offset from a socket interface along a length of the test card. The stiffener includes a test interface including conductive pins for electrically interfacing the conductive pads of the test card. The test card is supported by the stiffener so that it remains undeformed as each chip is plunged into a test socket. The test interface includes a basin that is covered by the test card to form a thermal isolation cavity for thermal separation from the test electronics. A uniform radio frequency interface is provided between each test card and a corresponding test interface.

Abstract: A modular integrated circuit test fixture integrates the integrated circuit (IC) handler to IC test fixture alignment interface (the alignment plate) into a daughter card subassembly, which reduces the overall rejection rate of devices due to alignment errors. The test fixture has a plurality of daughter card subassemblies for receiving integrated circuits for testing. Each daughter card subassembly is independently removable from the test fixture and includes a daughter card for a particular size and type of integrated circuit, a plurality of sockets electrically and mechanically coupled to the daughter card to receive respective integrated circuits for testing, and an alignment plate to provide alignment between an IC handler and respective ones of the daughter card subassemblies and to provide alignment for one or more manual test lids. The manual test lids are removed for automatic testing using an IC handler.

Abstract: A contactor uses a pogo block in a first configuration as a direct integrated circuit test socket and the contactor can be reconfigured to provide a pogo block assembly to interface between a main test printed circuit board (PCB) and a daughter card that is dedicated to a specific device handler and/or a specific package type that can be different from the main test PCB. A pogo block is inserted into a thick frame with an alignment plate for contactor use in which a device under test fits into a recess in the frame through an alignment plate to align the device under test to make contact with electrical contacts of the contactor. The frame and guide plate can be removed and a thinner frame coupled to the contactor, which changes its function to a pogo block assembly.

Abstract: A contactor uses a pogo block in a first configuration as a direct integrated circuit test socket and the contactor can be reconfigured to provide a pogo block assembly to interface between a main test printed circuit board (PCB) and a daughter card that is dedicated to a specific device handler and/or a specific package type that can be different from the main test PCB. A pogo block is inserted into a thick frame with an alignment plate for contactor use in which a device under test fits into a recess in the frame through an alignment plate to align the device under test to make contact with electrical contacts of the contactor. The frame and guide plate can be removed and a thinner frame coupled to the contactor, which changes its function to a pogo block assembly.