Patents by Inventor Wentao Bie

Wentao Bie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mobile terminal with a bendable structure
    Patent number: 11886240
    Abstract: The mobile terminal includes a first part, a second part, a connection structure, and a flexible circuit board. A signal is transmitted between the first part and the second part through the flexible circuit board. The flexible circuit board includes a first end and a second end. The first end is electrically connected to the first part, and the second end is electrically connected to the second part. The flexible circuit board passes through the connection structure, and a part of the flexible circuit board in the connection structure maintains a regular bending structure.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: January 30, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Wentao Bie, Wen Fan, Chia Huan Chang, Qilin Xu, Rui Wang
  • Mobile Terminal
    Publication number: 20210263558
    Abstract: The mobile terminal includes a first part, a second part, a connection structure, and a flexible circuit bar. A signal is transmitted between the first part and the second part through the flexible circuit board. The flexible circuit board includes a first end and a second end. The first end is electrically connected to the first part, and the second end is electrically connected to the second part. The flexible circuit board passes through the connection structure, and a part of the flexible circuit board in the connection structure maintains a regular bending structure.
    Type: Application
    Filed: July 17, 2018
    Publication date: August 26, 2021
    Inventors: Wentao Bie, Wen Fan, Chia Huan Chang, Qilin Xu, Rui Wang